Homepage Slideshow

• 7 Habits of Highly Efficient PCB Designers

  PCB design is a complex puzzle. It starts with a design envelope that provides the frame, a set of components to be logically and strategically placed, and a schematic diagram with guides and rules that represent how components are interconnected.

  https://pcdandf.com/pcdesign/index.php/editorial/menu-features/12813-pcb-design-1807

• Manage High-Current Traces by Thinking Outside the Box

  When it comes to thermal design, we have relied on the charts published by IPC for a long time. But the problem is much more complicated than simply adding the thermal resistance and local heating of individual traces.

  https://pcdandf.com/pcdesign/index.php/editorial/menu-features/12812-trace-routing-1807

• Voltage in the GHz World

  Today, the interconnecting structures on logic circuit boards are just as important as the components. The meaning of voltage when it involves fast logic needs a closer look.

  http://pcdandf.com/pcdesign/index.php/editorial/menu-features/12673-voltage-in-the-ghz-world

• More on Via Temperatures

  A study of relationship among via temperature, trace width and current under two conditions –  keeping the trace temperature (at the test point) constant and looking at the via temperature, and the converse – suggests it may be possible to neck-down a high-current trace for a short distance without much penalty.

  http://pcdandf.com/pcdesign/index.php/editorial/menu-features/12736-current-carrying-capacity-1806

• Using ECAD-MCAD Linkages to Enhance Avionics Thermal Design

  The latest generation of electronics cooling design and simulation applications provides new approaches to cooling and thermal analysis, bridging the gap between ECAD and MCAD to predict airflow and heat transfer in and around equipment.

  http://pcdandf.com/pcdesign/index.php/editorial/menu-features/12706-using-ecad-mcad-linkages-to-enhance-avionics-thermal-design

• How Rigid-Flex PCB Design Configurations are Advancing

  Today’s rigid-flex circuit board materials, stack-ups and constructions create significant opportunities to achieve higher levels of design integration and packaging density within a given design.

  http://pcdandf.com/pcdesign/index.php/editorial/menu-features/12738-flexible-circuits-1806

• Can Next-Gen Military Products Beat the Heat?

  Aerospace/Defense products’ high- and low-temperature requirements force improvements in components and materials. And thermal management is becoming a common limiting factor in newer technologies.

  http://pcdandf.com/pcdesign/index.php/editorial/menu-features/12735-inemi-roadmap-1806