2.92mm solderless PCB connectors support high-frequency stripline and microstrip applications with performance to 40GHz. Available as vertical PCB jacks, the connectors use a threaded interface to eliminate solder joint variability and maintain consistent connector-to-PCB contact. The design supports impedance control across different PCB stackups while allowing installation, removal and reuse during prototyping and validation. Constructed with passivated stainless steel bodies, gold-plated beryllium copper contacts and ULTEM insulators, the connectors target microwave, millimeter-wave, test and measurement, aerospace, defense and advanced communications applications.

TNC Series thick-film NTC thermistors provide temperature sensing and monitoring for automotive, industrial, battery management and medical electronics applications. Available in 0402, 0603 and 0805 case sizes, the series offers resistance values from 50Ω to 500kΩ, B values from 2410K to 4700K, and operating temperatures up to 150°C. Devices use thick-film technology to improve mechanical strength, maintain consistent thickness across resistance values and enhance resistance to cracking compared with multilayer thermistors. Components feature strong solderability, fast thermal response, heat resistance and AEC-Q200 qualification for demanding environments.

Signal analyzer portfolio supports wideband wireless, 5G NR, WLAN, radar and millimeter-wave design validation. Pro XA6 SA6320A provides up to 8GHz analysis bandwidth, frequency coverage to 67GHz, full preselection and GPU-accelerated 5G NR demodulation for high-frequency RF characterization. Expert XA5 SA6210A offers swept measurements to 32GHz, up to 2GHz analysis bandwidth and dual-channel RF analysis for MIMO, ultra-wideband and radar applications. Systems feature advanced error vector magnitude measurement capabilities, wide-resolution bandwidth support, dual-receiver architecture and compatibility with legacy X-Series SCPI command sets for streamlined RF test workflows.

Ultrafast laser cutting machine portfolio supports high-precision glass processing for consumer electronics, automotive displays, optical components and wearable device manufacturing. Systems use picosecond and femtosecond laser processing for low-heat glass separation with reduced chipping, microcrack suppression and improved edge strength retention. Supports processing of ultra-thin glass, sapphire, PET, polyimide and flexible printed circuit substrates through modification-and-splitting workflows. Includes integrated motion and vision systems for shaped cuts, contour profiles and complex geometries used in foldable devices, AR/VR systems and automotive display applications.