CI-ONE integrates a Ka-band power amplifier and single-pole double-throw (SPDT) RF switch into a compact surface-mount module designed for satellite communication, aerospace, radar and emerging 5G/6G applications. Built using gallium arsenide (GaAs) pHEMT technology, the modules operate from a 6V supply and offer output power options of 30dBm, 34dBm and 36dBm to support 1W, 2W and 4W system architectures. Switching speeds of 5ns enable agile transmit systems while maintaining approximately 22% efficiency at the 1dB compression point. Reduces component count, simplifies RF routing and lowers thermal complexity for Ka-band front-end designs. The integrated architecture is designed to reduce module size by roughly three times while improving efficiency and cutting system costs compared with traditional discrete implementations. 

Umicore introduced Auruna 8000, a nickel- and cobalt-free gold-iron high-speed electrolyte engineered for sustainable hard gold plating in high-speed and brush plating applications. The weakly acidic process produces low-porosity, wear-resistant coatings with approximately 99.7 wt.% gold and 0.3 wt.% iron, achieving hardness of about 130HV and meeting ASTM B-488-01 Type I, Code C specifications for demanding technical uses. Operating at 45–65°C with a pH range of 4.2–4.6, supports plating speeds of approximately 8µm/min and metal content from 2–30g/l (nominal 12g/l). 

TNC Series NTC thermistors expand Stackpole’s passive component portfolio into temperature sensing applications using thick-film construction for improved mechanical robustness compared with multilayer NTC designs. Thick-film technology reduces susceptibility to cracking and thickness variation across resistance values. Devices are available in 0402, 0603 and 0805 chip sizes with resistance values from 50Ω to 2MΩ and B values from 2410K to 4800K. Components support temperature sensing, monitoring and control applications up to 150°C, offering fast thermal response in compact footprints. Target markets include automotive systems, battery monitoring, and industrial and medical temperature sensing equipment. Pricing varies by size, resistance, B value and tolerance, with volume options available through distribution partners.

630900-1001-801 polyimide adhesive material is designed for high-temperature industrial environments including printed circuit board marking applications exposed to soldering and aggressive cleaning processes. Construction features a 50µm polyimide base film with a 20µm white silk-matt coating optimized for thermal transfer printing of 1D/2D codes, serial numbers and variable data. High-performance acrylate adhesive 801 supports bonding to PCBs, paired with a white standard glassine liner. Material withstands short-term temperatures up to 300°C and resists common soldering cycles and harsh cleaning agents. Available from 200m² with 1,000mm working width; 170mm narrow rolls at 400 running meters offered on request. Additional thicknesses and colors available upon request with immediate supply targeting electronics manufacturing, mechatronics and component marking sectors.