Low-loss PCB material with near-zero coefficient of thermal expansion (CTE) supports high-speed signal integrity in advanced electronics. Celeritas HM001 provides stable dielectric performance with low loss characteristics, enabling signal transmission at data rates up to 224Gb/s and beyond. The material is designed for high-frequency applications requiring consistent electrical performance across temperature and frequency ranges, supporting next-generation AI and high-speed computing designs.

PCB material with negative coefficient of thermal expansion (CTE) supports large-format AI designs by reducing thermomechanical mismatch. Celeritas HM50 features a CTE of -8ppm/°C, enabling PCB stackups to counteract copper expansion and lower overall board CTE. This supports reduced warpage, minimized package bow and improved solder fatigue performance in high-density assemblies. The material supports applications where thermal stability is critical, including advanced AI hardware and high-performance computing systems, enabling improved reliability in large-scale designs.

High-power chip resistors with aluminum nitride substrates support thermally constrained electronics applications. The RMAN series uses aluminum nitride to enable higher thermal conductivity than standard alumina, allowing improved heat dissipation, lower operating temperatures and stable electrical performance. Designed for power-dense environments, the resistors support applications including IGBT, SiC and GaN modules, power supplies, EV systems and RF circuits. Devices deliver power ratings up to 2.4W in 1206 and 3.4W in 2512 packages while maintaining controlled hotspot temperatures.

Roll-to-roll coating system supports thin-film development for electronics, energy and advanced materials research. The system uses slot-die coating technology and supports processing of up to 100m of foil, enabling consistent film deposition with controlled web tension. Available in multiple platform lengths and widths, the modular design allows configuration for a range of experimental setups, including use in gloveboxes and controlled environments. Supports applications such as PCB coatings, printed electronics, batteries, fuel cells, OLEDs, sensors and medical films. Control options include touchscreen, manual adjustment and PC-based operation, with features such as forward-reverse and stop-and-go processing to accommodate different workflows.