Blackhole LE and Eclipse LE modified semi-additive processing (mSAP) for direct metallization enable direct copper electroplating to laminate walls and copper target pads of microvia structures without need for intermediary copper layers from electroless or electrolytic flash plating.
inspectAR 2.3 includes the ability to add comments within the context of the PCB, create custom names and save overlay sets.
Tec-Speed 20.0 VT-870 H348 TCR laminate is available in Hoz- and 1oz-thick foil with resistivity values of 25, 50 and 100Ω/sq. Tec-Speed 20.0 glass-reinforced hydrocarbon and ceramic laminate with thin-film resistor material is now available with Ticer TCR NiCr thin-film resistor foil as a service option.
SpeedWave 300P ultra-low loss prepreg can be used to bond XtremeSpeed RO1200, CLTE-MW, and RO4000 series laminates.
APC Series surface mount resistors have been qualified for use in environments exposed to sulphur-bearing gasses.