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Why Are You Still Using Gerber?
The alternatives to Gerber, IPC-2581 and ODB++, offer a single-source, intelligent dataset used for processes throughout the PCB cycle. A longtime user compares and contrasts the ECAD formats. READ MORE...
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Going Green: PCB Designers Say Salaries on Rise
Designers and engineers are getting paid more. But are they working harder for a living? READ MORE...
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Designing for Higher Power in Smaller Form Factors
The redesign of a higher wattage adapter into a space 25% smaller was made easy by thermal modeling software. READ MORE...
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The Mechanism of Nickel Corrosion in ENIG Deposits and How to Mitigate It
ENIG specs call for examination corrosion for a continuous intermetallic formed between the nickel layer and bulk solder. Can solder wetting balance testing predict the acceptability of ENIG deposits with level 2 or 3 corrosion? READ MORE...
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Maxwell and Transmission Lines
Many electronic engineers leave Maxwell to the textbooks. But in logic, the rise times for signals are often less than a nanosecond – bandwidth that invites unwanted radiation, interference and crosstalk. Can Maxwell’s equations help? READ MORE...
Homepage Slideshow
Why Are You Still Using Gerber?
The alternatives to Gerber, IPC-2581 and ODB++, offer a single-source, intelligent dataset used for processes throughout the PCB cycle. A longtime user compares and contrasts the ECAD formats.
https://pcdandf.com/pcdesign/index.php/editorial/menu-features/13521-data-transfer-1904
Going Green: PCB Designers Say Salaries on Rise
Designers and engineers are getting paid more. But are they working harder for a living?
https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/13450-salary-survey-1903
Designing for Higher Power in Smaller Form Factors
The redesign of a higher wattage adapter into a space 25% smaller was made easy by thermal modeling software.
https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/13449-thermal-design-1903
The Mechanism of Nickel Corrosion in ENIG Deposits and How to Mitigate It
ENIG specs call for examination corrosion for a continuous intermetallic formed between the nickel layer and bulk solder. Can solder wetting balance testing predict the acceptability of ENIG deposits with level 2 or 3 corrosion?
https://pcdandf.com/pcdesign/index.php/editorial/menu-features/13342-plating-corrosion-1902
Maxwell and Transmission Lines
Many electronic engineers leave Maxwell to the textbooks. But in logic, the rise times for signals are often less than a nanosecond – bandwidth that invites unwanted radiation, interference and crosstalk. Can Maxwell’s equations help?
https://pcdandf.com/pcdesign/index.php/editorial/menu-features/13236-maxwell-and-transmission-lines
