• Enabling the Electronics Digital Thread

    Enabling the Electronics Digital Thread

    Model-based enterprise initiatives often ignore electronics.  READ MORE...

  • Mentor Sees More Convergence Ahead

    Mentor Sees More Convergence Ahead

    How the ECAD giant’s integration into Siemens is shaping up.  READ MORE...

  • Preparing for Next-Gen Loss Requirements

    Preparing for Next-Gen Loss Requirements

    Can signal-integrity test vehicle results be accurately simulated?  READ MORE...

  • Why You Should Quit Using 1080 Glass

    Why You Should Quit Using 1080 Glass

    The high percentage of resin coverage can cause skew issues at higher speeds.
      READ MORE...

  • A Closer Look at DDR5 Sockets

    A Closer Look at DDR5 Sockets

    The new memory technologies provide double the bandwidth and density of DDR4.  READ MORE...

  • How to Avoid Getting Totally Skewed, Part 4

    How to Avoid Getting Totally Skewed, Part 4

    When to source dual-ply glass.  READ MORE...

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NEWS

Ultra Librarian, Maxim Integrated Release Reference Designs

Ultra Librarian, Maxim Integrated Release Reference Designs

21 January 2020

ROCHESTER, NY – Ultra Librarian and Maxim Integrated Products released a new set of reference designs for use in the Ultra Librarian Reference Design Cloud.  Read More...

DuPont Explores Divestiture of Electronics Unit

DuPont Explores Divestiture of Electronics Unit

20 January 2020

WILMINGTON, DE – DuPont is reportedly discussing with advisers the possible sale of its electronics business.  Read More...

CCL Material Demand Increases with 5G

CCL Material Demand Increases with 5G

17 January 2020

TAOYUAN, TAIWAN – 5G is driving the upgrade of copper clad laminate foil materials, says TPCA. As a result, CCL manufacturing plants such as EMC, Iteq, Tuc and ...  Read More...

5G Spurs Competition for Taiwan PCB Manufacturers

5G Spurs Competition for Taiwan PCB Manufacturers

17 January 2020

TAOYUAN, TAIWAN – Total capital expenditures of Taiwan PCB factories in 2020 will exceed NT$50 billion ($1.67 billion), thanks in large part to demand for 5G mo...  Read More...

TPCA: PCB Manufacturers Developing 5G Infrastructure, with Smartphones Leading the Way

TPCA: PCB Manufacturers Developing 5G Infrastructure, with Smartphones Leading the Way

17 January 2020

TAOYUAN CITY, TAIWAN – As the 5G era approaches, major PCB manufacturers have increased their pace to launch terminal equipment, and various countries have acti...  Read More...

Tianjin Gov’t in Talks with TCL Over Sale of 2 Firms

Tianjin Gov’t in Talks with TCL Over Sale of 2 Firms

17 January 2020

TIANJIN, CHINA – The government of Tianjin is discussing the sale of two firms to TCL Corp., according to reports.  Read More...

IC Market Shows Strong Tie with Global GDP

IC Market Shows Strong Tie with Global GDP

17 January 2020

SCOTTSDALE, AZ – The correlation coefficient between worldwide GDP growth and IC market growth over the past decade was 0.85 (0.96 excluding the memory market i...  Read More...

Global IT Spending to Increase 3% in 2020

Global IT Spending to Increase 3% in 2020

16 January 2020

STAMFORD, CT – Worldwide IT spending is projected to total $3.9 trillion in 2020, an increase of 3.4% from 2019, according to Gartner. Global IT spending is exp...  Read More...

Gartner: Global Semi Revenue Fell 12% in 2019

Gartner: Global Semi Revenue Fell 12% in 2019

16 January 2020

STAMFORD, CT – Worldwide semiconductor revenue totaled $418.3 billion in 2019, down 11.9% from 2018 on a slump in memory demand, according to Gartner.  Read More...

IPC Announces IPC Design Program

IPC Announces IPC Design Program

16 January 2020

BANNOCKBURN, IL – IPC today announced IPC Design: an international professional network of board designers.  Read More...

Atotech to List on the NY Stock Exchange

Atotech to List on the NY Stock Exchange

16 January 2020

FRANKFURT – Atotech is planning to list on the New York Stock Exchange, according to a filing this week.  Read More...

UP Media Group Issues Call for Abstracts for PCB West 2020

UP Media Group Issues Call for Abstracts for PCB West 2020

15 January 2020

ATLANTA, GA – UP Media Group Inc. seeks abstracts for PCB West (http://pcbwest.com/) 2020, to be held September 8-11, 2020, in Santa Clara, CA. The event includ...  Read More...

Cadence Completes AWR Acquisition

Cadence Completes AWR Acquisition

15 January 2020

SAN JOSE – Cadence Design Systems completed its $160 million cash acquisition of AWR from National Instruments.  Read More...

IPC: EMS Welcomes US-China Deal, Seeks Further Action

IPC: EMS Welcomes US-China Deal, Seeks Further Action

15 January 2020

BANNOCKBURN, IL – IPC welcomes today’s signing of phase one of the US-China trade deal.  Read More...

Q4 Gains Push PCs to First Annual Growth Since 2011

Q4 Gains Push PCs to First Annual Growth Since 2011

14 January 2020

FRAMINGHAM, MA – The worldwide market for traditional PCs, inclusive of desktops, notebooks, and workstations, finished the fourth quarter up 4.8% year-over-yea...  Read More...

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FEATURES

Designing a Robust Industrial Augmented Reality Solution

Designing a Robust Industrial Augmented Reality Solution

A review of tracking methodology choices to address challenges of environmental factors such as light and the prerequisite of fixed visual features.  Read More...

Can PCB FABRICATION PROCESSES Keep Up with Design Demands?

Can PCB FABRICATION PROCESSES Keep Up with Design Demands?

New hole formation technologies and low-cost low-loss materials are needed.  Read More...

Digital Building Blocks

Digital Building Blocks

AI and machine learning will shape the coming era of electronics manufacturing.  Read More...

Designing for Higher Power in Smaller Form Factors

Designing for Higher Power in Smaller Form Factors

The redesign of a power adapter, using thermal modeling software. Much has been written about the benefits of moving thermal design activity higher up the prod...  Read More...

Maxwell and Transmission Lines

Maxwell and Transmission Lines

The famous mathematician can guide our understanding of electrical signals.  Read More...

SMT 4.0 and CTF

SMT 4.0 and CTF

AI Industry 4.0-aided manufacturing should incorporate CTF quality methodology.  Read More...

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PRODUCTS

Teledyne LeCroy Offers SignalIntegrity Software

Teledyne LeCroy Offers SignalIntegrity Software

SignalIntegrity open-source software provides free tools for solving real-time signal integrity problems.  Read More...

EMA Launches CADSync with Solidworks Connector

EMA Launches CADSync with Solidworks Connector

CADSync passes high-fidelity design data and changes between Cadence PCB and Solidworks.  Read More...

Amphenol SV Microwave Releases Solderless PCB Connectors

Amphenol SV Microwave Releases Solderless PCB Connectors

Micro-Mini (SMP/SMPM) extreme frequency subminiature RF/coaxial push-on solderless PCB compression mount connectors are for high-frequency printed PCBs.  Read More...

Hirose Adds PQ50 Series Connector

Hirose Adds PQ50 Series Connector

PQ50 series rugged high-power connector for industrial environments is available in lightweight plated plastic resin or Zinc die cast shell.  Read More...

Toray Creates PPS Film For 5G PCBs

Toray Creates PPS Film For 5G PCBs

Polyphenylene sulfide (PPS) film reportedly maintains dielectric characteristics, flame retardancy and chemical robustness of polymer, while remaining thermally...  Read More...

Hirose Develops KP13B Nano SIM Card Connector

Hirose Develops KP13B Nano SIM Card Connector

KP13B Nano SIM card connector reportedly reduces required PCB mounting space by up to 26%.  Read More...

Vishay Introduces IHDF-1300AE-10 Through-Hole Inductor

Vishay Introduces IHDF-1300AE-10 Through-Hole Inductor

IHDF-1300AE-10 through-hole inductor is comprised of an edge-wound coil.  Read More...

Zuken Unveils eCADSTAR Advanced HS ECAD

Zuken Unveils eCADSTAR Advanced HS ECAD

eCADSTAR Advanced HS extends 3-D PCB design capabilities with high-speed routing tools, such as length, delay-based impedance, skew control and comprehensive co...  Read More...

Amphenol RF Adds SMA Connectors to ARC Series

Amphenol RF Adds SMA Connectors to ARC Series

Amphenol Rugged Connector (ARC) series now include additional SMA connectors designed for performance in harsh conditions, including outdoor applications where ...  Read More...

ECI Rolls Out QualiLab Elite Benchtop Plating Bath Analyzer

ECI Rolls Out QualiLab Elite Benchtop Plating Bath Analyzer

QualiLab Elite benchtop plating bath analyzer supports multi-language operations and provides accurate analyses in an ergonomic design.  Read More...

RBP Chemical Releases MetalTreat Chelate Eliminator-8

RBP Chemical Releases MetalTreat Chelate Eliminator-8

MetalTreat Chelate Eliminator-8 is formulated to eliminate waste of highly chelated waste streams containing heavy metals.  Read More...

Kemet Debuts CAS Series SMD MLCCs

Kemet Debuts CAS Series SMD MLCCs

CAS series surface mount device (SMD) safety-certified multilayer ceramic capacitors (MLCCs) are for use in mains-powered applications.  Read More...

Lackwerke Peters Introduces Elpejet Inkjet Solder Resists

Lackwerke Peters Introduces Elpejet Inkjet Solder Resists

With print head adjusted, Elpejet inkjet solder resists reportedly provide print image and edge coverage precise to specification, along with high resolution.  Read More...

Elsyca Releases PCBBalance Plating Analysis Software

Elsyca Releases PCBBalance Plating Analysis Software

PCBBalance evaluates the impact of a specific board/panel layout on the copper plating step during manufacturing.  Read More...

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