Power and signal placed on outer layers minimize radiated emissions.

The PCB stackup is like a building's foundation; a product not built on a strong base will fall apart. When electromagnetic compatibility (EMC) testing is considered, the PCB stackup is a major determinant of radiated EMI, and to some extent, conducted EMI. A PCB stackup design that enables low EMI also aids signal integrity and power integrity, as all these areas are linked and must be considered in totality.

So, to ensure a PCB design passes EMC testing, understand the stackup's role in generating emissions and determining EMI susceptibility. Simple changes in materials, layer assignments, and routing strategies can make the difference between passing and failing EMC tests. All these decisions originate in the PCB stackup.

A special panel discusses the growth of AI tools and its possible effects on the industry.

“Will AI take my job?”

That’s the question on the mind of many around the world today – including electronics engineers and PCB design engineers – and was one of several questions considered during an online panel hosted by PCEA in March.

A group of panelists with notable AI experience – Circuit Mind’s Tomide Adesanmi, Cadence Design Systems’ Taylor Hogan, Zuken’s Kyle Miller, Luminovo’s Sebastian Schaal and Siemens Digital Industries’ David Wiens – gathered to share predictions for the future of AI in the electronics supply chain and answer questions from an audience of industry professionals.