Surface-mount DIP switches support high-density PCB layouts in space-constrained electronic designs. The devices feature a 1.27mm half-pitch footprint, enabling increased component density while maintaining electrical and mechanical reliability. Gold-plated bifurcated contacts support low-resistance signal integrity, while top-tape sealed construction enables automated SMT soldering and post-reflow aqueous cleaning. Rated up to 50VDC and 100mA steady-state, with 1,000-cycle mechanical and electrical life. Available in 2, 4, 6, 8, and 10-position configurations, supporting flexible design requirements. Compatible with standard SMT processes and offered in tube or tape-and-reel packaging for high-volume production.

Littelfuse/C&K

ittelfuse.com

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