SANTA ANA, CA – TTM Technologies reported first quarter net sales of $846 million, up 30% year over year, marking a record quarter as demand tied to AI and data center buildouts accelerated.

ARAYA, THAILAND – Doosan is investing approximately $135 million to establish a new production base for copper clad laminates (CCL), a key material used in printed circuit boards, as global AI infrastructure demand accelerates.

FREUDENSTADT, GERMANY – Schmid has introduced its Any Layer Embedded Trace (ET) process, a panel-level manufacturing platform designed to support next-generation advanced packaging as AI and high-performance computing drive increasing substrate complexity.

SAN JOSE, CA – Cadence reported first-quarter revenue of $1.4 billion, up from $1.2 billion year over year, driven by strong demand for AI-driven design tools and semiconductor solutions.