Printed Circuit Design & Fab Online Magazine

NEWS

PCEA Announces PCB Detroit Technical Conference Sessions and Tabletop Exhibitors

27 February 2026

PEACHTREE CITY, GA –February 27, 2026 – PCB Detroit will be returning to Wayne State University in June, the Printed Circuit Engineering Association (PCEA (http... Read More...

PCB Management Forum Makes PCB East Debut

26 February 2026

WORCESTER, MA – February 26, 2026 – The Printed Circuit Engineering Association (PCEA (https://pcea.net)) today announced the debut of the PCB Management Forum ... Read More...

Incap Reports 7% Revenue Decline in 2025

26 February 2026

HELSINKI – Incap Corporation reported 2025 revenue of $232 million, down 6.7% year-over-year from $248.7 million, as currency headwinds and a softer market envi... Read More...

Element Solutions Reports 4% Sales Growth in 2025

19 February 2026

MIAMI, FL – Element Solutions reported 2025 net sales of $2.5 billion, up 4% year over year on a reported basis and 6% organically, driven by double-digit organ... Read More...

Fine-Line Circuits Q3 Revenue Falls 19.5% as Profit Rises 14.8%

19 February 2026

MUMBAI – Fine-Line Circuits Limited reported a 19.5% year-over-year decline in third quarter revenue while posting a 14.8% increase in net profit. Read More...

Cadence System Design and Analysis Business Grows 13%

19 February 2026

SAN JOSE, CA – Cadence reported 13% growth in its system design and analysis business in fiscal 2025, reflecting sustained demand for advanced packaging and sys... Read More...

Cadence System Design and Analysis Business Grows 13%

19 February 2026

SAN JOSE, CA – Cadence reported 13% growth in its system design and analysis business in fiscal 2025, reflecting sustained demand for advanced packaging and sys... Read More...

Creative 3D Technologies Raises $5 Million to Scale Modular “Factory-in-a-Box” Platform

17 February 2026

AUSTIN, TX – Creative 3D Technologies (C3DT) has raised $5 million in seed funding to expand its modular “Factory-in-a-Box” manufacturing platform. Read More...

SEL Breaks Ground on $50M Moscow Manufacturing Expansion

13 February 2026

MOSCOW, ID – Schweitzer Engineering Laboratories has begun site preparation for a new $50 million, 250,000-square-foot electronic device manufacturing facility ... Read More...

ECIA Industry Pulse Hits 138, Strongest Sales Sentiment in Over 4 Years

13 February 2026

ATLANTA, GA – ECIA’s January Industry Pulse survey delivered its strongest sales sentiment reading in more than four and a half years, signaling renewed confide... Read More...

Meiko Electronics Raises FY2025 Forecast 5% on HDI PCB Demand

13 February 2026

TOKYO, JAPAN – Meiko Electronics has raised its fiscal 2025 consolidated earnings forecast, citing sustained demand for high-density interconnect (HDI) printed ... Read More...

Icape Reports 2025 Revenue Up 12%

12 February 2026

FONTENAY-AUX-ROSES, FRANCE – Icape reported consolidated 2025 revenue of $219.4 million, up 11.5% year over year, marking a return to growth after a 2.2% declin... Read More...

Silicon Wafer Shipments Rise 6% in 2025

10 February 2026

MILPITAS, CA – Worldwide silicon wafer shipments increased 5.8% year over year in 2025 to 12,973 million square inches (MSI), marking a return to volume growth ... Read More...

Wearable Tech Market Forecast to Reach $232 Billion by 2030

09 February 2026

LONDON, UK – The global wearable technology market is expected to nearly double in value by the end of the decade, fueled by growing demand for health monitorin... Read More...

Global Semiconductor Sales Jump 26% in 2025

06 February 2026

WASHINGTON, DC – Global semiconductor sales reached a record $791.7 billion in 2025, rising 25.6% year over year, according to new data from the Semiconductor I... Read More...

FEATURES

The Victory Plan Reborn: Forcing the Surge of America’s Drone Industrial Base

Leveraging artificial obsolescence to operationalize the domestic supply chain. In my previous article, (https://www.circuitsassembly.com/ca/editorial/menu-fea... Read More...

Adhesive vs. Adhesiveless Polyimide Core Materials Used in Flex and Rigid-Flex Applications

How polyimide core technology determines whether electronics survive extreme conditions. Deciding which processes and materials to adopt for a PCB design depen... Read More...

The Via Revolution: Stacked, Staggered and Copper-Filled

Copper-filled microvias, controlled aspect ratios and fabrication-aware design are redefining vias. If you want a front-row seat to the evolution of PCB techno... Read More...

Experimental Evaluation of High-Thermal Dielectric Materials and Surface-Mount Thermal Bridges in Multilayer PCB Designs

A study shows how high-thermal dielectrics outperform FR-4 for bulk heat spreading, with surface-mount thermal bridges serving as targeted tools for hotspot con... Read More...

AI ‘Hallucinates.’ Why That’s Actually Good News.

Without the right context, AI gives answers that sound right but can quietly derail manufacturing decisions. It’s 9:15 AM on a Tuesday, and Maria – your rising... Read More...

Consider Manufacturing Complexity When PCB Designs Have Tight Hole-to-Trace Spacing

Tight spacing (less than 8 mils) between drilled holes and copper traces increases fabrication complexity and yield risk. In the world of PCB manufacturing, kn... Read More...

Designing for Manufacturability in Ultra HDI: New Rules, New Realities

Ultra HDI changes the design for manufacturability equation. As more teams begin to explore ultra HDI, one of the early surprises is just how different the des... Read More...

The Marketplace for Untapped Inventory

Where excess inventory stops being clutter and starts being currency. For years, companies have treated excess electronic components like an embarrassing secre... Read More...

Ultra HDI: What is It and How is It Different than HDI?

With ultra-high-density interconnect design, small features come with big decisions. Ultra HDI (UHDI) has become a prominent part of the PCB design conversatio... Read More...

The Critical Nature of PCB Stackup, and How to Build an Efficient One

Like a building foundation, the stackup supports every layer above it. The way the printed circuit board layers shown in Figure 1 are arranged is called a stac... Read More...

Nexperia Crisis Exposes Hidden Fragility in the PCB Supply Chain

Just when the industry thought the shortage saga was over, the parts giant hit refresh on the chaos. The global electronics industry faces another shortage sit... Read More...

Beyond the Gerbers: How Unstructured Data Drives PCB Cost and Lead Time

The real bottleneck isn’t the layout; it’s decoding those half-hidden specs stuffed into a PDF. Every electronics engineer and PCB designer knows the feeling: ... Read More...

From Boards to Assemblies: Precision PCB’s Journey to In-House Manufacturing

How a longtime PCB supplier became a contract manufacturer. More than a handful of US-based printed circuit board fabricators offer some degree of assembly in ... Read More...

5 Things That Will Haunt Your Plating Tanks

And practical steps to exorcise the chemistry demons. Each fall brings ghosts, goblins and, if you’re not careful, a few monsters lurking right inside your pla... Read More...

Hybrid vs. Single Material Stackup in PCB Design

Good engineering isn’t just about power; it’s about knowing where not to over-engineer. As modern electronic devices combine RF, high-speed digital and power c... Read More...