MILPITAS, CA -- SEMI and Global Net have released a new report examining the emerging market for glass core substrates, a packaging technology being evaluated for future semiconductor applications as artificial intelligence and high-performance computing drive demand for larger and more complex packages.

According to the Glass Core Substrate Market and Development Trends Report, initial production could begin around 2028 in select high-performance applications, with broader adoption expanding over time. Based on the average of its positive, base and negative market scenarios, the report projects a compound annual growth rate of 67.2% from 2028 to 2040.

The report explores market outlooks, technology drivers, commercialization challenges, expected applications, supply-chain developments and company activity across substrate materials, equipment, processing and inspection. It also highlights growing development efforts across Asia, North America and Europe.

SEMI said glass core substrates are being considered for advanced packaging because they may support larger package sizes, finer interconnects and improved dimensional stability compared with conventional substrate materials.

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