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  • Reflections from Discontinuities

    Reflections from Discontinuities

    Reflections can destroy a signal, but the effect of major discontinuities can be predicted with validated models.  READ MORE...

  • PCB Panelization Costs: It’s All About the Real Estate

    PCB Panelization Costs: It’s All About the Real Estate

    On arrays, a quarter or half-inch too long in one direction may mean a double-digit price difference.  READ MORE...

  • Covid Class Creations

    Covid Class Creations

    PCB East keynoter Gene Weiner gives a roundup of innovative technologies to come out of the pandemic.  READ MORE...

  • Will US Government Incentives Spur Domestic Investment?

    Will US Government Incentives Spur Domestic Investment?

    The PCBAA gets legislative good news. What’s next for the organization?  READ MORE...

  • Onshoring and Second Sourcing

    Onshoring and Second Sourcing

    The current difficulties call for a more strategic approach to arranging our global supply chains.  READ MORE...

Homepage Slideshow

  • Reflections from Discontinuities

    Reflections can destroy a signal, but the effect of major discontinuities can be predicted with validated models.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/16569-reflections-from-discontinuities

  • PCB Panelization Costs: It’s All About the Real Estate

    On arrays, a quarter or half-inch too long in one direction may mean a double-digit price difference.

    https://www.pcdandf.com/pcdesign/index.php/current-issue/270-board-buying/16564-pcb-panelization-costs-it-s-all-about-the-real-estate

  • Covid Class Creations

    PCB East keynoter Gene Weiner gives a roundup of innovative technologies to come out of the pandemic.

    https://www.pcdandf.com/pcdesign/index.php/current-issue/285-what-s-old-is-new/16563-covid-class-creations

  • Will US Government Incentives Spur Domestic Investment?

    The PCBAA gets legislative good news. What’s next for the organization?

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/16566-will-us-government-incentives-spur-domestic-investment

  • Onshoring and Second Sourcing

    The current difficulties call for a more strategic approach to arranging our global supply chains.

    https://www.pcdandf.com/pcdesign/index.php/current-issue/262-material-gains/16565-onshoring-and-second-sourcing

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  • 2020 Magazine Archives
2012cover

December 2020

  • View the digital issue
  • Accurate microsectioning for high-volume production
  • The PCEA comes alive
  • A look back at friends and colleagues who left us in 2020
  • Taming electromagnetic interference on a PCB 
  • The impedance implications of the trapezoidal trace 
  • What is the shortest flex length between rigid areas?
  • Download the pdf
2011cover

November 2020

  • View the digital issue
  • Alternatives to S-parameters for advanced PCB design and analysis
  • Automating high-speed constraints
  • Advanced packages in portable products
  • Implementing HDI in design
  • Will the US support R&D in manufacturing?
  • What can Industry 4.0 do for you?
  • Download the pdf
2010cover

October 2020

  • View the digital issue
  • Should BGA and CCA packages be bigger?
  • Design for rework
  • Embedded clearance
  • Covid: the ultimate organizational stress test
  • Is your customer service costing you business?
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2009cover

September 2020

  • View the digital issue
  • The NTI-100 list of the world's largest printed circuit fabricators for 2019
  • Enabling technologies for medical electronics
  • How to determine the critical length of a signal
  • Understanding drafting for printed circuit boards
  • What impedance is
  • Calculating copper thickness
  • Leveraging the IT department to reduce operation-caused variation
  • Updates in silicon and electronics technology
  • The role of AR and VR
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2008cover

August 2020

  • View the digital issue
  • Routing traces between pins on a 1mm pitch BGA
  • Ensuring long-term access to key component packages
  • Embedding magnetics in a PCB design
  • Footprint libraries
  • How to spend marketing dollars when travel is frozen
  • High reliability starts at the laminate
  • Why the flex circuit roadmap is broken
  • Download the pdf
2007cover

July 2020

  • View the digital issue
  • Differential signal design rules
  • Design rules and stackups for four-layer PCBs, the Lee Ritchey way
  • IoT standards
  • Bare board purchasing plans
  • Place and route recommendations
  • Controlling far-end crosstalk
  • Materials technology evolution
  • Why board orders go on hold, and how to prevent it
  • Benchmark Electronics opens a fab shop
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2006cover

June 2020

  • View the digital edition
  • Materials considerations for automotive radar designs
  • Current density and via temperature relationship
  • The 2020 PCD&F salary survey
  • What to do when your PCB supplier is acquired
  • PCB warpage
  • Via padstacks
  • Performance-centric materials specifications
  • Uneven layer counts on flex circuits
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2005cover

May 2020

  • View the digital edition 
  • Minimizing the effects of vias on very high-speed digital signals
  • Multi-board design for applications with different voltages
  • Is it time for a pandemic-resistant supply chain?
  • As we wait out Covid-19 at home, energy use and thermal management issues remain
  • An hour-by-hour look at the quickturn fabrication process
  • Who should be concerned about the fiber-weave effect?
  • What to bring to the PCB design review
  • the factory of the future, and what flexibility really buys us
  • Download the pdf
2004cover

April 2020

  • View the digital issue
  • BGA pitch impacts on bare board fabrication
  • Future aerospace and defense product requirements
  • Crisis communications strategies
  • Nepcon Japan recap
  • Assembly “gotchas” during the design phase
  • High-performance materials standards
  • Time and frequency domains
  • Flex circuit stiffeners
  • PCB manufacturing equipment advances
  • Download the pdf
2003cover

March 2020

  • View the digital edition
  • Differential pairs
  • Tight vs. loose coupling
  • IPC Apex Expo recap
  • Planning for supply chain disasters
  • Long parallel routing
  • Obtaining accurate Df numbers without building test boards
  • Download the pdf
2002cover

February 2020

  • View the digital edition
  • Using copper pour on routing layers
  • Next-generation PCB processes
  • Augmented reality (AR) solutions for the factory
  • What is the role of heterogeneous integration in the AI hardware ecosystem?
  • Can signal-integrity test vehicle results be accurately simulated?
  • Low-cost ways to expand your fabrication base
  • Via structure strategies
  • Download the pdf
2001cover

January 2020

  • View the Digital Edition
  • Signal-integrity test vehicle simulations
  • Mentor's post-Siemens merger plans
  • The electronics digital thread
  • Mist-based dispensing for fine lines
  • Protecting IP during purchasing
  • The future of PCBs
  • Download the pdf

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