Homepage Slideshow

• Stop Thinking about Current Density and Via Temperature

  Via temperature is determined by the temperature of the trace associated with the via, not the current itself.

  https://pcdandf.com/pcdesign/index.php/editorial/menu-features/14639-stop-thinking-about-current-density-and-via-temperature

• How Much Are You Worth?

  Recent salary survey results suggest newcomers may be entering the field.

  https://pcdandf.com/pcdesign/index.php/editorial/menu-features/14640-it-was-predicted-for-years-engineers-are-finally-taking-over-pcb-design

• Can Rigid-Flex Have Different Layer Counts in Different Areas?

  Yes, but there are performance and cost tradeoffs.

  https://pcdandf.com/pcdesign/index.php/current-issue/243-flexperts/14636-can-rigid-flex-have-different-layer-counts-in-different-areas

• High-End Systems Product Needs

  SiP, MCP and DDR5 support faster speeds and higher power requirements.

  https://pcdandf.com/pcdesign/index.php/editorial/menu-features/14651-high-end-systems-product-needs

• The Nuts and Bolts of a Via Padstack

  Why aspect ratio rules all.

  https://pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/14635-the-nuts-and-bolts-of-a-via-padstack

• Materials Considerations for Automotive Radar Designs

  A holistic view of 77GHz radar sensors as a PCBA build, considering fabrication, assembly and packaging materials.

  https://pcdandf.com/pcdesign/index.php/editorial/menu-features/14641-materials-considerations-for-automotive-radar-designs