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  • Nepcon Japan Highlights AI, 5G, and Packaging and Assembly Trends

Nepcon Japan Highlights AI, 5G, and Packaging and Assembly Trends

Published: 25 February 2020
 by E. Jan Vardaman

ADAS auto electronics require zero-defect components.

With construction of a new venue for the 2020 Olympics in Tokyo, the annual Nepcon Japan show was split into two parts this year. There were 67,169 visitors to see more than 2,100 exhibitors. A reported 24,323 people attended the conference presentations. Exhibits included automotive and electronics. The electronics R&D and manufacturing exhibits included IC and sensor packaging, LED and laser diode technology, PCB, SMT, test and measurement, components, devices, and materials. Many highly attended conference sessions focused on 5G, AI, and automotive electronics (FIGURE 1).

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