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  • NTI-100: The World’s Top PCB Fabricators

    NTI-100: The World’s Top PCB Fabricators

    The changing map of PCB production.  READ MORE...

  • Elements of PCB Panelization

    Elements of PCB Panelization

    Panelize to optimize: faster builds, better boards.  READ MORE...

  • Optimizing Mixed Signal Circuit Designs

    Optimizing Mixed Signal Circuit Designs

    Navigating the analog and digital worlds.  READ MORE...

  • Dynamic Times

    Dynamic Times

    Component Dynamics is where market intelligence meets distribution.
      READ MORE...

  • Power Circuits

    Power Circuits

    Making power connections is a world unto itself.   READ MORE...

  • Developing Organizational Culture for Troubleshooting

    Developing Organizational Culture for Troubleshooting

    Solving problems and adding value.  READ MORE...

Homepage Slideshow

  • NTI-100: The World’s Top PCB Fabricators

    The changing map of PCB production.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18878-tracking-giants-inside-the-world-s-top-pcb-fabricators

  • Elements of PCB Panelization

    Panelize to optimize: faster builds, better boards.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18838-elements-of-pcb-panelization

  • Optimizing Mixed Signal Circuit Designs

    Navigating the analog and digital worlds.

    https://www.pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/18794-optimizing-mixed-signal-circuit-designs

  • Dynamic Times

    Component Dynamics is where market intelligence meets distribution.


    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18880-where-market-intelligence-meets-distribution

  • Power Circuits

    Making power connections is a world unto itself. 

    https://www.pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/18874-power-circuits-an-island-pov-on-pcb-design

  • Developing Organizational Culture for Troubleshooting

    Solving problems and adding value.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18798-developing-organizational-culture-for-troubleshooting

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  • 2014 Magazine Archives
December 2014 cover

December 2014

  • PCB DESIGN
  • RETROSPECTIVE
  • Giving it away.
  • The fab sandwich.
  • Cushioning the blows.
  • IoT: It’s all in the package.
  • Pad-to-via clearance effects.
  • Just what are “local equivalent materials?”
  • Minimizing BTC voiding.
  • View the Digital Edition
November 2014 cover

November 2014

  • FABRICATION
  • DESIGN TRADEOFFS
  • CHEMICAL LABELING
  • Who will we have left to rely on when the chips are down?
  • Too big not to fail?
  • False promises.
  • Optimizing the parts library.
  • Revenue rehabilitation.
  • View the Digital Edition
October 2014 cover

October 2014

  • COVER STORY
  • There may never be another like Viasystems.
  • Out of fashion but not out of factory.
  • Maximizing the program manager.
  • Where QFNs and QFPs vary.
  • The upside of rough topography.
  • Why you should check the plating adhesion.
  • View the Digital Edition
September 2014 cover

September 2014

  • INSPECTION
  • An industry icon passes on.
  • What we can learn from the grocer.
  • In search of the real India.
  • Differential serial data transmission.
  • One-time startup charges.
  • The race for whisker-free solder.
  • View the Digital Edition
August 2014 cover

August 2014

  • PI SIMULATION
  • COVER STORY
  • BOARD RELIABILITY
  • DATA TRANSFER
  • From the minds of babes.
  • On pride and perceptions.
  • Staying on message in the EMS arena.
  • Stick with the standard?
  • View the Digital Edition
July 2014 cover

July 2014

  • INSPECTION
  • PACKAGING
  • Material loss.
  • Service with a smile.
  • Priced to win.
  • ECTC: a packaging heaven.
  • Moving targets.
  • Counting the data.
  • More whiskers.
  • I’m your answer.
  • View the Digital Edition
June 2014 cover

June 2014

  • PCB DESIGN
  • PCB HISTORY
  • EMS TOP 50
  • The Boss.
  • Young and restless.
  • Finding the source.
  • Third-party libraries.
  • Sulphur corrosion.
  • View the Digital Edition
May 2014 cover

May 2014

  • COMPONENT PACKAGING
  • STENCIL DESIGN
  • IPC APEX EXPO RECAP
  • At the Apex?
  • Lessons from the past.
  • Competition from unlikely places.
  • Constraint management.
  • Flex PCB routing.
  • Close shaves.
  • View the Digital Edition
April 2014 cover

April 2014

  • MATERIAL PERFORMANCE
  • DESIGN QUALIFICATION
  • MURRIETTA CIRCUITS
  • Man vs. machine.
  • No flex in circuits industry.
  • Getting the deal on paper.
  • Changing copper weight.
  • View the Digital Edition
March 2014 cover

March 2014

  • PROCUREMENT
  • DESIGN VALIDATION
  • END-MARKETS
  • Broken eggs.
  • The future in 3-D.
  • Organic substrates.
  • SI with HDI.
  • Designing for flex.
  • Flux standard in flux.
  • View the Digital Edition
January 2014 cover

February 2014

  • SYSTEM DESIGN
  • STENCIL CLEANING
  • Facts About OSHA’s New Hazard Communication Standards and GHS
  • All in one.
  • New attitudes.
  • Freshen up.
  • Grounding large vias.
  • View the Digital Edition
January 2014 cover

January 2014

  • OPTICAL INTERCONNECTS
  • PRODUCTRONICA RECAP
  • ORGANIZATIONAL STRUCTURE
  • What was BlackBerry thinking?
  • An end to repetition.
  • Tight capacitance.
  • Flex pad design.
  • Why SnCuNi can be cool(er).
  • View the Digital Edition

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OCTOBER ISSUE
OctOber cover

View the Digital
Edition Here!

Press Releases

  • SCHMID Group Expands Advanced Packaging Portfolio to Power the AI Era
  • Participating in "JOINT3" Consortium to Develop Next-Generation Semiconductor Packaging
  • Luminovo to Host First Spanish-Language Webinar on September 5th
  • ICZOOM Group Inc. Announced the Launch of PCB & SMT Services to Strengthen One-Stop Electronics Industry Solution at IIC Shenzhen 2025
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