KEMET Corporation has released a complete line of capacitor models that are adapted to Mentor Graphics simulation software. These capacitor models allow SI, PI and board design engineers to model the decoupling scheme of a printed circuit board using the Mentor HyperLynx 8.0 PI and HyperLynx SI products.

The low ESR and low ESL polymer products are designed for the high speed processor board level decoupling applications. Using these models design engineers can model the time-domain and frequency behavior of aluminum, film, ceramic, and tantalum SMD capacitors. 
 
www.kemet.com
www.mentor.com

 

Chemcut Corporation 2300 Series product line is based on the 2315 series and designed for compact applications. The new 2300 Series provides a reliable, high performance, compact, easy to install platform for the PCB manufacturing, chemical milling and sign and name plate industries.

The 2300 Series can be configured for most of the common wet processes including; resist developing, resist stripping, chemical cleaning, alkaline etching, cupric etching, and ferric etching.

Available in 15 inch and 20 inch widths, the 2300 Series is ideally suited for prototype shops, captive development facilities, quick-turn shops and any circuit board or chemical milling facility needing an additional processor for a specialized application. Many popular rinse and drying configuration options are available to meet a variety of processing requirements.

Master Bond Inc. introduces EP21AN, a two-part adhesive system. It cures readily at ambient temperatures and quickly at elevated temperatures.
 
The product is reported to be an excellent electrical insulator with a dielectric strength of >400 volts/mil. The adhesive has been designed with a non-critical 1/1-mix ratio by weight or volume.
 
It adheres to numerous substrates, such as metals, ceramics, glass and many plastics. With a low shrinkage upon cure, EP21AN is reported to show exceptional dimensional stability. It is available in ½ pint, pint, quart, gallon and five-gallon kits.
 
www.masterbond.com

Available in a range of dielectric thicknesses and resistance levels, the laminate provides a variety of circuit constructions. It is compatible with printed wiring board processes and has a thermal resistance up to 180° C.
 
Having embedded capacitance and resistance, the product is reported to have excellent dielectric thickness tolerance and electrical performance. It is also IPC 4204/11 certified.
 
www.pyralux.dupont.com