Elprinta introduces a thermally conductive adhesive for insulated metal substrate (IMS) boards. The cut-to-PCB adhesive is reported to withstand heat and resist mechanical PCB processes. The product bonds the PCB directly to the target surface, eliminating the need for mechanical fasteners. Manufacturers no longer need to cut and paste thermal tapes after board assembly. www.elprinta.com
Zuken introduces the Board Modeler. The collaborative software tool docks into Zuken’s electronic systems and CR-5000 PCB design suite, enabling layout and mechanical engineers to work together. Users are able to work in a 3D environment, showing the actual component shape rather than an approximation. Board outlines, pre-placed parts and obstacles can be imprinted directly from mechanical CAD tools, eliminating duplicate work. Board layout structures can be exported into numerical simulation tools for mechanical, electrical or thermal verification. Simulation results can be back annotated into CR-5000 tools for design modifications. In addition, a multi-board option allows multiple-board design verification and chassis on a multi-site global basis. www.zuken.com
The 2009 release of Advanced Design System (ADS) from Agilent Technologies Inc. is a high-frequency/high-speed co-design tool for integrated circuits (IC), packages and PCBs.
ADS provides circuit, package, board and system designers with a single EDA platform for shared simulation models. According to the company this can minimize design rework, reduce costs and shorten delays in communications during the product design process.
The co-design platform can provide verification of high-frequency or high-speed system performance across the IC, package and printed circuit board designs using common system-verification test benches. Designers can identify and correct component interactions earlier in the design cycle.
ADS 2009 interoperates with Cadence and Mentor back-end design platforms, allowing designers to import Cadence Allegro PCB, Advanced Package Designer and System-In-Package physical design data for co-designing with active components and Design Rule Check results from Cadence Assura, Mentor Calibre or Triquint MailDRC for viewing and correcting within ADS layout environment.
The co-design models available include:
X-parameters; accurate, non-linear measurement.
3D electromagnetic parameterized components representing metal shields, antenna radomes, absorbers, packages, interconnects, finite dielectric substrates and wire bonds.
Transistor-level circuits on RFIC, MMIC, LTCC or laminate RF modules and PC boards.
Behavioral models of all types, including Verilog-A/AMS, HDL, MATLAB®, IBIS, C++ and neural networks.
Netlists from HSPICE and Spectre.
Measured signal stimulus and data from Agilent signal, network and logic analyzers.
Prebuilt simulation libraries and sources compliant with the latest wireless standards such as LTE, WiMedia and VWAN wireless HD with MIMO antenna characteristics.
Micropelt GmbH introduces
TE-Power NODE, the first
thermo-powered wireless sensor system. Thermal energy, taken from temperature
differentials, is used to operate a wireless sensor node, providing a
battery-free operation.
The product consists of a 60 mm by 27 mm footprint aluminum
base plate, carrying two Micropelt MPG-D751 thermo generators. This allows the
energy supply to be tailored to the application. Threaded heat spreaders,
mounted on the thermo generators, provide easy access and repair.
TE-Power NODE uses ultra-low-power technology from Texas
Instruments, and supports both IEEE 802.15.4-compliant and custom solutions.
Enthone has introduced an organic metal-based nanofinish, OrmeSTAR Ultra final finish. According to the company the process consumes approximately 90% less energy, reduces process time by 75% and lowers cost by 30% compared to an electroless nickel / immersion gold (ENIG) process.
Features include a surface conductivity comparable to pure gold and signal transmission that outperforms ENIG finishes. The solder bonds directly to copper to form strong solder joints. The durable coating allows for wipe downs on misprinted assemblies with no copper oxidation. Hold time between thermal cycles is similar to other metal finishes.
The nanofinish generates a visible coating that allows for ease of inspection and high first-pass yields with no false failures at in-circuit test. Application during PCB fabrication can occur before electrical test.
OrmeSTAR Ultra bonds with copper without a displacement reaction, increasing bath life. Low application temperatures, minimal water usage and long bath life make OrmeSTAR Ultra an environmentally friendly HASL alternative.
Würth Elektronik introduces Lasercavity that combines laser machining technology and thermo-compression bonding to integrate active components into PCB innerlayers. The technique uses lasers to generate a cavity in the innerlayer where a flip chip can then be incorporated using thermo-compression bonding techniques.
A laser cavity of up to 300 µm is carved out in the PCB innerlayer. Laser technology provides high precision for both the cavity dimension and depth. The cavity is then coated with an adhesive. The flip chip is placed by a die bonder and the adhesive is cured under pressure. The chip stud bump connections are also soldered at the same time.
Process creator, Roland Schönholz, product manager HDI-microvia at Würth Elektronik said the Lasercavity process is exciting because of its simplicity and efficiency.
Reliability testing of Lasercavity-PCBs has been conducted. In the testing, that used thermal shock and long-time temperature exposure, the bonding joint between the PCB and the flip chip demonstrated high reliability.
