Printed Circuit Design & Fab Online Magazine - Design News

Products

Zuken introduces E³.panel, a panel design system with integrated 3D functionality. It allows the physical representation of cabinets to be designed and developed, offering an easy-to-use solution for panel layout and wiring.

E³.panel is an add-on option for E³.schematic or E³.cable, with complete online integration. Features include interactive and automatic wire routing, automatic and interactive placement with online checks and cable duct fill calculations with graphical displays.

In addition, determined data can re reused for production. Information is synchronized online, regardless of where design changes have been made.

www.zuken.com

EMA Design Automation introduces Component Information Portal (CIP) Version 2.2, for design capture and data management. The latest version of CIP adds 800 additional parts to the existing foundation library and increases the CIP Enterprise foundation library to more than 5,000 parts.

Designed for multi-user environments with more complex data management requirements, CIP Version 2.2 takes advantage of the relational database support in Cadence OrCAD Capture CIS 16.2.

The advanced export feature allows users to update an external list of parts with information from the CIS database. CIP Enterprise can convert an OrCAD Capture CIS BOM into a BOM that is hierarchical, showing the manufacturers linked to each company part number. In addition, engineering teams can manage component data via the CIP web-based browser.

www.ema-eda.com

International Manufacturing Services Inc. introduces the VGX-2010WA for high power RF and microwave applications.

The high power, 2010-size chip attenuator features wraparound terminals for solder or epoxy attachment. It is reported to dissipate 20 W at a 100° C baseplate temperature and has a standard impedance of 50 ohm.

Attenuation values to 30 dB are available, including 0.5 dB increments. Attenuation accuracy starts at ±0.2 dB. Depending on implementation, achievable VSWR is 1.3:1 to 12 GHz.

www.ims-resistors.com

RBP Chemical Technology Inc. introduces MetalTreat 530, MetalTreat 4007 and MetalTreat 957, a waste treatment process for electronics and metal finishing.

MetalTreat 530 precipitates metals out of solution, and MetalTreat 4007 coagulates the waste metal. This metal waste is then flocculated by MetalTreat 957. This three-step process produces a solid waste cake that can be easily removed from the bath.

The chemicals are non-DOT regulated and non-hazardous. MetalTreat 530 is free DTC, preventing aquatic toxicity. It can also be used with ORP metering. MetalTreat 957 is packaged in suspension, providing easy handling. MetalTreat 4007 is effective in both PCB and metal finishing applications.

www.rbpchemical.net

3M introduces an Ultra Hard Metric (UHM) socket connector, providing multi-Gigabit performance to hard-metric, compact PCI, VME and PXI systems.

The socket connector is reported to deliver more than 7 Gbps of backplane performance for systems based on 2-mm, hard-metric connectors. Users can increase overall system performance while maintaining existing investments.

Able to mate with both industry-standard and 2-mm, hard-metric header connectors, the socket provides design flexibility for engineers and supports 100 ohm differential pairs in rows or columns. Five-row (A, B, CL, CR, AB) and eight-row (D, E, DE, FL, FR) form factors are available for high signal density.

www.3M.com

Teknek introduces Nanocleen, an advanced cleaning system for the electronics industry. Features include a unique polymer roller capable of removing particles down to 25 nm in size. The high performance roller is reported to remove 25% to 50% more particles than other contact cleaners.

Both the adhesive roll and roller are 100% silicon free, and when compared to traditional contact cleaners, static is reduced by a factor of 10.

An optional kit allows Nanocleen to be fitted to other makes and models of cleaning machines.

www.teknek.com