Printed Circuit Design & Fab Online Magazine - Design News

Products

Rohm and Haas introduce three acid copper plating products: Copper Gleam CF 25; Copper Gleam CuPulse Plus; and Copper Gleam HT-55.

Copper Gleam CF 25 is designed for pattern, panel and button plate via-filling. The via-fill bath produces a highly-ductile leveled copper deposit that has physical properties similar to traditional DC copper electrodeposits. With simultaneous via-filling and through-hole plating, the bath is reported to have exceptional metal distribution.

Copper Gleam CuPulse Plus is a versatile high-performance pulse electroplating system. A stabilizer component is integrated into the additives, creating superior control and longer bath life. The system is reported to provide a stable and consistent plating and through-hole leveling performance.

Copper Gleam HT-55 is a high-throw plating product, improving cycle time without specialized equipment or cell modifications. It is reported to have exceptional surface distribution, as well as a significant reduction in average surface copper thickness.

www.rohmhaas.com

Fujipoly introduces Sarcon NR-c, a non-silicone, acrylate resin thermal gap pad. It provides the benefits of a traditional gap filler pad without the possibility of silicone contamination.

The product has highly conformable characteristics, ideal for conducting heat away from uneven components to a heat sink or spreader. With a thermal conductivity of 1.5 W/m°K, the non-flammable material has a low thermal resistance. It is available in thicknesses from 0.50 mm to 2.0 mm and individual sheets up to 150 mm by 100 mm. It can by die-cut to satisfy application specifications.

www.fujipoly.com

3M introduces IEEE 1394-compliant I/O connectors. Consisting of an assortment of 6-pin shielded I/O connectors and accessories, IEEE 1394 connectors are shielded for increased resistance to EMI/RFI.

The connectors are vibration-resistant, RoHS-compliant and have a quick-release secure latching system. The product can accept a range of wire gauges. Configurations include right-angle, upright through-hole plug and right-angle and wiremount receptacles with applicable latching kits.

www.3M.com

Leader Tech introduces the Slot Lok Multi-Cavity (SLMC) product line to help solve complex PCB shielding issues.

Assembly costs, weight, space and time-to-market are reduced by combining multiple shields under one footprint. The SLMC products use a standardized manufacturing method, creating near-custom shielding solutions with minimal NRE and numerous customizing options.

www.leadertechinc.com

Automation Systems Interconnect Inc. introduces printed circuit board terminal blocks for automation and control applications.

The RoHS-compliant terminal blocks feature UL 94V0 housing, nickel-plated copper metal parts and moving clamp wire termination. The blocks are UL recognized, and their design, color and function is compatible with leading manufacturers.

They are available in fixed and pluggable wiring in pin spacing from 3.5 mm to 10.16 mm, wire ranges of 30 AWG to 6 AWG and ratings up to 57 amps. The blocks come in standard green, but are available in several colors upon request.

www.asi-ez.com

FKN Systek introduces the N200 punch to singulate round tab routed PCBs. The top down air-operated punch separates panels one tab at a time, while an upper and lower matching knife blade pinches the tabs apart. There is less stress placed on the PCB than a typical punch and die because the cutting occurs from both sides.

An adjustment screw determines the exact cutting location. Locating pins are mounted on quick-change blocks that are easily replaceable for different board configurations. Users can easily sigulate low volume prototype boards or a set of replacement panels from a previous order.

www.Fknsystek.com