ELK GROVE VILLAGE, IL – Amitron, a leading U.S.-based manufacturer of printed circuit boards (PCB) brings an additional 80,000 sq/ft of manufacturing space into the overall MILSPEC ecosystem with high automation, the latest equipment technology, and processes for military and aerospace applications.

With four decades of excellence in printed circuit board manufacturing, Amitron successfully completed a validation audit of its Elk Grove Village, Illinois facilities thus meeting the requirements of MIL-PRF-31032 in alignment with the company's Quality Management Plan approved by Amitron's Technical Review Board. After this rigorous audit and certification process, Amitron has been granted the honor of contributing to the safety and security of the nation.

"Earning Mil-Spec certification is a testament to our capabilities and to our unwavering commitment to America's safety and defense," said Aidan Salvi, Amitron's Chief Transformation Officer "Our dedication to a 'Made in America' ethos ensures that the technologies fortifying our nation's defense are produced right here, at home. We invite industry leaders in aerospace, military, and defense to leverage our expertise and unmatched quality for the safety of their supply chain."

A United States defense standard often called a military standard, "MIL-STD", "MIL-SPEC", or (informally) "Mil Specs", are used to help achieve standardization by the U.S. Department of Defense (DOD). The DOD has more than 20,000 "Mil Specs" that ensure that products purchased for use by the U.S. Military meet the required quality requirements.

A key to Amitron obtaining the Mil-Spec certification is the company's transformation to become a Factory 5.0 facility.

Factory 5.0 is the next evolutionary stage in the manufacturing industry. While Factory 4.0 was predicated on robotics, Factory 5.0 expands on the principles of Industry 4.0 by emphasizing human-centric collaboration, flexibility, and adaptability. Factory 5.0 focuses on a highly integrated and intelligent production environment where humans and machines work in tandem, leveraging each other's strengths to achieve maximum efficiency, productivity, and innovation. Factory 5.0 leverages the availability of AI and advanced software systems to build better-advanced manufacturing processes.

Waltham, MA – Nano Dimension Ltd. (Nasdaq: NNDM) (“Nano Dimension”, “Nano”, or the “Company”), a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (“AM”) 3D printing solutions, today announced its participation in The ThinkEquity Conference, which will take place on October 19th, 2023 at The Mandarin Oriental Hotel in New York.

The ThinkEquity Conference will gather industry insiders, investors and leading executives for a full day of company presentations, one-on-one investor meetings, networking and more. Featured sectors include AI, Technology, Biotechnology, EV/EV Infrastructure, Metals & Mining and Energy.

Attendees will have the opportunity to hear from Nano Dimension’s leadership on how the Company has grown to date and its prospects for future disruption, growth, and industry leadership.

Yoav Stern, Chief Executive Officer of Nano Dimension, commented, “We are looking forward to engaging with investors – long-standing, new, “returning,” and prospective. The revenue performance is clear – we have had exceptional growth with revenue for the first half of 2023 approaching approximately $60 million on an annual basis; compared to revenue for 2022 of $43.6 million, most of the growth generated organically. We are looking forward to have another good experience at the Think Equity Conference, with meaningful conversations with investors, shareholders and analysts.

FOUNTAIN INN, SC – KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, is acquiring assets of Bliley Technologies, a worldwide leader in the design and development of innovative, low-noise frequency control products with more than 65 years of space heritage in low Earth orbit (LEO) and geostationary equatorial orbit (GEO) applications. The asset transfer acquisition will bring Bliley’s equipment, people, and IP under the KYOCERA AVX umbrella and allow KYOCERA AVX to produce the same high-quality electronic components that made Bliley a global leader. Upon finalization, the acquired assets will operate under KYOCERA AVX Components Corporation (Erie).

“We are very pleased to welcome members from the Bliley Technologies team to KYOCERA AVX and are very excited to further expand our crystal devices portfolio with the disruptive technologies they’ve developed, which will allow us to better serve sophisticated customers in the demanding military, aerospace, and defense markets,” said Kio Ariumi, Senior VP, Operational Integrations, KYOCERA AVX. “The asset transfer acquisition provides more than 20 patents for key positioning, navigating, and timing technologies as well as an accomplished staff and an advanced manufacturing facility with several crucial certifications and qualifications, all of which will further strengthen our presence in these essential markets.”

Bliley Technologies manufactures innovative low-noise crystal and oscillator products at its 64,000-square-foot, ISO 9001:2008 certified manufacturing facility in Erie, Pennsylvania, and is one of the only U.S.-based companies to manufacture both — from front end to final finishing — within the same facility. This fact enables close collaboration between Bliley’s highly experienced crystal oscillator and mechanical engineers and its production team and has resulted in the development of some of the most successful solutions available in the global frequency control industry, including its patented and currently unrivaled low-power oven-controlled crystal oscillator (OXCO) technology, which offers superior holdover performance compared to micro electromechanical systems (MEMS) and temperature-compensated crystal oscillators (TXCO) at a fraction of the power budget

KYOCERA AVX Components Corporation will continue to manufacture Bliley products, including OCXOs, TCXOs, and voltage-controlled crystal oscillators (VCXOs); high-precision AT-, SC-, IT-, and FC-cut crystals; and quartz and lead zirconate titanate (PZT), lithium niobate, langatate, and yttrium calcium oxoborate (YCOB) transducer blanks and will also design and develop new products based on Bliley IP. Engineered for use in demanding, high-stakes applications within the new space, satellite communications, aerospace, avionics, military and defense, mobile communications, 5G cellular and telecommunications, smart and autonomous vehicles, and commercial drone markets, these innovative products:

• Effectively suppress phase noise.
• Ruggedly withstand random and micro vibrations.
• Reliably endure low-gravity environments.
• Maintain superlative frequency stability.
• Endure fast and wide temperature variations, and more.

“The Bliley Technologies team is happy to become a part of KYOCERA AVX and is looking forward to leveraging our relative strengths and experience to accomplish many of the same goals that we’ve been pursuing as Bliley as KYOCERA AVX Components Corporation,” said Keith Szewczyk, CEO and Director, Bliley Technologies. “Bliley has earned a global reputation for research and development, quality, and reliability, and our purpose has always been to inspire and enable our customers’ innovations, allowing them to achieve more than they ever thought possible. The KYOCERA AVX team shares this commitment and, together, we will continue to develop novel crystal products that redefine possibilities.”

Bliley Technologies is certified to ASD9100 Rev D and ISO 9001, J-STD-001 Class 3, IPC-A-610, IPC-7711, and IPC-7721. The company is also qualified to MIL-PRF-55310 and compliant with International Traffic in Arms Regulations (ITAR), REACH and RoHS directives, and MIL-STD-883B, MIL-STD-202, and MIL-O-55310 environmental and qualification testing standards.

CAMBRIDGE, UK – The road to fully autonomous vehicles is, by necessity, a long and winding one; systems that implement new technologies that increase the driving level of vehicles (driving levels being discussed further below) must be rigorously tested for safety and longevity before they can make it to vehicles that are bound for public streets. The network of power supplies, sensors, and electronics that is used for Advanced Driver Assistance Systems (ADAS) – features of which include emergency braking, adaptive cruise control, and self-parking systems – is extensive, with the effectiveness of ADAS being determined by the accuracy of the sensing equipment coupled with the accuracy and speed of analysis of the on-board autonomous controller.

The on-board analysis is where artificial intelligence comes into play and is a crucial element to the proper functioning of autonomous vehicles. In market research company IDTechEx’s recent report on AI hardware at the edge of the network, “AI Chips for Edge Applications 2024 – 2034: Artificial Intelligence at the Edge”, AI chips (those pieces of semiconductor circuitry that are capable of efficiently handling machine learning workloads) are projected to generate revenue of more than USD$22 billion by 2034, and the industry vertical that is to see the highest level of growth over the next ten year period is the automotive industry, with a compound annual growth rate (CAGR) of 13%.

The part that AI plays

The AI chips used by automotive vehicles are found in centrally located microcontrollers (MCUs), which are, in turn, connected to peripherals such as sensors and antennae to form a functioning ADAS. On-board AI compute can be used for several purposes, such as driver monitoring (where controls are adjusted for specific drivers, head and body positions are monitored in an attempt to detect drowsiness, and the seating position is changed in the event of an accident), driver assistance (where AI is responsible for object detection and appropriate corrections to steering and braking), and in-vehicle entertainment (where on-board virtual assistants act in much the same way as on smartphones or in smart appliances). The most important of the avenues listed above is the latter, driver assistance, as the robustness and effectiveness of the AI system determines the vehicle's autonomous driving level.

Since its launch in 2014, the SAE Levels of Driving Automation have been the most-cited source for driving automation in the automotive industry, which defines the six levels of driving automation. These range from level 0 (no driving automation) to level 5 (full driving automation). The current highest state of autonomy in the private automotive industry (incorporating vehicles for private use, such as passenger cars) is SAE Level 2, with the jump between level 2 and level 3 being significant, given the relative advancement of technology required to achieve situational automation.

A range of sensors installed in the car – where those rely on LiDAR (Light Detection and Ranging) and vision sensors, among others – relay important information to the main processing unit in the vehicle. The compute unit is then responsible for analysing this data and making the appropriate adjustments to steering and braking. In order for processing to be effective, the machine learning algorithms that the AI chips employ must be extensively trained prior to deployment. This training involves the algorithms being exposed to a great quantity of ADAS sensor data, such that by the end of the training period they can accurately detect objects, identify objects, and differentiate objects from one another (as well as objects from their background, thus determining the depth of field). Passive ADAS is where the compute unit alerts the driver to necessary action, either via sounds, flashing lights, or physical feedback. This is the case in reverse parking assistance, for example, where proximity sensors alert the driver to where the car is in relation to obstacles. Active ADAS, however, is where the compute unit makes adjustments for the driver. As these adjustments occur in real time and need to account for varying vehicle speeds and weather conditions, it is of great importance that the chips that comprise the compute unit are able to make calculations quickly and effectively.

A scalable roadmap

SoCs for vehicular autonomy have only been around for a relatively short amount of time, yet it is clear that there is a trend towards smaller node processes, which aid in delivering higher performance. This makes sense logically, as higher levels of autonomy will necessarily require a greater degree of computation (as the human computational input is effectively outsourced to semiconductor circuitry). The above graph collates the data of 11 automotive SoCs, one of which was released in 2019, while others are scheduled for automotive manufacturers’ 2024 and 2025 production lines. Among the most powerful of the SoCs considered are the Nvidia Orin DRIVE Thor, which is expected in 2025, where Nvidia is asserting a performance of 2000 Trillion Operations Per Second (TOPS), and the Qualcomm Snapdragon Ride Flex, which has a performance of 700 TOPS and is expected in 2024.

Moving to smaller node sizes requires more expensive semiconductor manufacturing equipment (particularly at the leading edge, as Deep Ultraviolet and Extreme Ultraviolet lithography machines are used) and more time-consuming manufacture processes. As such, the capital required for foundries to move to more advanced node processes proves a significant barrier to entry to all but a few semiconductor manufacturers. This is a reason that several IDMs are now outsourcing high-performance chip manufacture to those foundries already capable of such fabrication.

In order to keep costs down for the future, it is also important for chip designers to consider the scalability of their systems, as the stepwise movement of increasing autonomous driving level adoption means that designers that do not consider scalability at this juncture run the risk of spending more for designs at ever-increasing nodes. Given that 4 nm and 3 nm chip design (at least for the AI accelerator portion of the SoC) likely offers sufficient performance headroom up to SAE Level 5, it behooves designers to consider hardware that is able to adapt to handling increasingly advanced AI algorithms.

It will be some years until we see cars on the road capable of the most advanced automation levels proposed above, but the technology to get there is already gaining traction. The next couple of years, especially, will be important ones for the automotive industry.

Report coverage

IDTechEx forecasts that the global AI chips market for edge devices will grow to US$22.0 billion by 2034, with AI chips for automotive accounting for more than 10% of this figure. IDTechEx’s report gives analysis pertaining to the key drivers for revenue growth in edge AI chips over the forecast period, with deployment within the key industry verticals – consumer electronics, industrial automation, and automotive – reviewed. Case studies of automotive players’ leading system-on-chips (SoCs) for ADAS are given, as are key trends relating to performance and power consumption for automotive controllers.

More generally, the report covers the global AI Chips market across eight industry verticals, with 10-year granular forecasts in six different categories (such as by geography, by chip architecture, and by application). IDTechEx’s report “AI Chips for Edge Applications 2024 – 2034: Artificial Intelligence at the Edge” answers the major questions, challenges, and opportunities the edge AI chip value chain faces. For further understanding of the markets, players, technologies, opportunities, and challenges, please refer to the report.

For more information on this report, please visit www.IDTechEx.com/EdgeAI, or for the full portfolio of AI research available from IDTechEx please visit www.IDTechEx.com/Research/AI.