Boston, MA: Issey Ende, VP of Sales and Marketing for PCB Technologies, has announced that the company will be exhibiting at IMS 2026, (IEEE International MTT Symposia) the world’s leading event for the RF, microwave, and high-frequency electronics industry, taking place June 7th through June 13th, 2026, at the Thomas M Menina Convention and Exhibition Center in Boston, Massachusetts.
PCB Technologies will be showcasing its advanced high-frequency PCB and assembly solutions to engineers, OEMs, defense contractors, and technology innovators attending this year’s event. Visitors to the PCB Technologies booth will learn why the company has become one of the most respected providers of complex RF, microwave, HDI, rigid-flex, and advanced electronic manufacturing solutions in the world.
IMS 2026 brings together thousands of engineers, researchers, manufacturers, and industry leaders from across the globe to explore the latest innovations in RF, microwave, millimeter-wave, and high-speed technologies. The event includes a world-class technical conference, workshops, networking opportunities, and one of the industry’s premier exhibitions featuring leading electronics manufacturers and technology providers.
“We are extremely excited to participate in IMS 2026,” said Mr. Ende. “This is one of the most important technology events in the world for companies involved in RF, microwave, aerospace, defense, medical, and advanced communications. IMS gives us the opportunity to demonstrate how PCB Technologies helps customers solve some of the industry’s most complex engineering and manufacturing challenges. Our ability to provide complete solutions—from advanced PCB fabrication to complex assembly and packaging—makes us uniquely valuable to customers developing next-generation electronic products.”
PCB Technologies will be at Booth 19096.
About PCB Technologies:
PCB Technologies is a global leader in advanced electronic manufacturing solutions, offering a complete range of services including high-reliability PCB fabrication, HDI, RF and microwave boards, rigid-flex technology, IC substrates, advanced packaging, and complex electronic assembly. The company’s vertically integrated manufacturing model enables customers to streamline development, improve reliability, reduce time-to-market, and achieve superior performance for mission-critical applications.
Serving industries including aerospace, defense, telecommunications, medical, automotive, industrial, and high-performance computing, PCB Technologies is known for delivering innovative solutions for the most demanding electronic applications in the world.
Attendees visiting the PCB Technologies booth at IMS 2026 will have the opportunity to meet with company experts, explore the latest manufacturing technologies, and discover how PCB Technologies is helping shape the future of advanced electronics manufacturing.
IMS 2026 (IEEE International MTT Symposia) is the premier global event for the RF and microwave industry, bringing together the brightest engineers, innovators, researchers, and technology companies from around the world. Held June 8th through June 13th, 2026, in Boston, Massachusetts, IMS offers an unmatched combination of technical education, product demonstrations, networking opportunities, and industry collaboration.
The event showcases the latest developments in RF, microwave, millimeter-wave, wireless communications, aerospace, defense electronics, automotive radar, satellite systems, and emerging high-frequency technologies. Engineers and technology leaders attend IMS to discover breakthrough innovations, gain practical technical knowledge, and connect with the companies driving the future of advanced electronics.
Canton, MA — April 2026 — Remtec, a leading innovator in advanced ceramic substrates and microelectronic assembly solutions, today announced that it will be attending the upcoming EEE International MTT-S Symposium 2026, taking place June 7–12, 2026, at the Thomas M. Menino Convention & Exhibition Center (MCEC) in Boston, Massachusetts. President and CEO Brian Buyea made the announcement, emphasizing the importance of the event not only for Remtec, but for the broader RF and microwave engineering community.
“The MTT-S Symposium is one of the most important gatherings in the world for RF, microwave, and high-frequency innovation,” said Buyea. “This is where the industry comes together to exchange ideas, challenge assumptions, and push the boundaries of what’s possible. For Remtec, it’s an opportunity to engage directly with engineers and designers who are solving some of the most complex challenges in electronics today. These conversations drive innovation—and that’s exactly where we want to be.”
As part of the event, Microwave Journal will conduct an on-site interview with Buyea at their booth, where he will share insights into the evolving role of ceramic substrates, power electronics, and high-frequency materials in next-generation system design.
About the EEE International MTT-S Symposium
The EEE International MTT-S Symposium is widely regarded as the premier global event for microwave theory and techniques, bringing together thousands of engineers, researchers, and industry leaders from around the world. The event features cutting-edge technical sessions, product exhibitions, panel discussions, and networking opportunities focused on RF, microwave, millimeter-wave, and advanced electronic systems.
Held in Boston—one of the world’s leading hubs for technology and innovation—the symposium provides a unique platform for collaboration, learning, and showcasing the latest advancements shaping the future of high-frequency electronics.
About Remtec
Remtec is a leading provider of advanced ceramic substrate and assembly solutions for high-performance electronic applications. With over 35 years of experience, the company specializes in Alumina and Aluminum Nitride ceramic technologies, delivering superior thermal management, reliability, and electrical performance for demanding environments. At the core of Remtec’s capabilities is its proprietary PCTF® (Plated Copper Thick Film) technology, enabling robust, high-performance interconnects for RF, microwave, and power electronics applications. From substrate design to full system-level assembly—including die attach, wire bonding, encapsulation, and housing integration—Remtec offers a true “From Substrate to System” approach.
Serving industries such as aerospace, defense, telecommunications, and industrial power, Remtec is committed to solving the toughest challenges in microelectronics with precision, reliability, and engineering expertise.
SANTA ANA, Calif., June 03, 2026 (GLOBE NEWSWIRE) -- TTM Technologies, Inc. (NASDAQ: TTMI) (“TTM”), a leading global manufacturer of technology products, including mission systems, radio frequency (“RF”) components, RF microwave/microelectronic assemblies, and technologically advanced interconnect products, including printed circuit boards (“PCB”s) and substrates, announced today that it has completed the closing of a new $1.0 billion cash flow senior secured revolver and a repriced and upsized senior secured Term Loan B (“TLB”) in the aggregate principal amount of $400 million.
“Consistent with plans communicated during our May 27th Investor Day presentation, we are excited to announce that we have brought on new credit facilities to strengthen our financial position while providing flexibility to pursue strategic initiatives,” said Dan Boehle, Executive Vice President and Chief Financial Officer. “Together with our solid balance sheet and healthy operational performance, we have enhanced our long-term capital structure to support further sustainable growth and maximize shareholder value in 2026 and beyond.”
TLB Highlights
Repriced and upsized TLB due May 2030 in the aggregate principal amount of $400 million.
The new TLB has been priced at Term SOFR+ 1.75%, a reduction of 50 basis points from our prior term loan B commitments.
Reduced pricing is anticipated to provide meaningful cash interest savings for the remaining term.
Cash Flow Revolver Highlights
The maximum availability under the multi-currency cash flow senior secured revolving credit facility is $1.0 billion, maturing in May 2031.
The new revolver replaced our prior $150 million U.S. and $150 million Asia asset-based-lending (ABL) facilities.
Milledgeville, Georgia, USA – Topline Corporation has released a 50-page product guide of jumpers and spacers, publication 2026-A, fully illustrated and featuring schematics, charts, specifications, land patterns, package outlines, and descriptions of the wide range of zero ohm jumpers and solderable PCB spacers that TopLine offers, including custom configurations.
WESTFORD, Mass.; PARIS, France; and YOKOHAMA, Japan, May 28, 2026 — Valeo, a global leader in mobility technologies, and Zuken, a pioneer in Electronic Design Automation (EDA) software, announce a major strategic partnership. In their joint "Zuken Valeo InnoLab" program, the two companies will create the most advanced and open AI-assisted electronic design platform on the market.
This partnership combines Zuken's cutting-edge AI roadmap with Valeo's "AI Agents" and industrial expertise, creating an ecosystem where the tool and the engineer collaborate in real time.
"For Valeo, Zuken is much more than a software provider; it is a true innovation partner," says Christophe Le Ligné, Vice President Research and Development at Valeo. "The power of Zuken's AI roadmap, combined with the exceptional openness of its architecture, allows us to hybridize our own artificial intelligence tools with their engine. This win-win partnership is the best way to tackle the challenge of automotive complexity by slashing our design times while guaranteeing 100% robustness."
"Our vision at Zuken has always been to provide intelligent tools that adapt to our customers' most complex challenges," states Ryosuke Takagi, Executive Officer, General Manager of R&D Division at Zuken. "Collaborating with a technological leader like Valeo pushes our 'Autonomous Brain' roadmap to its highest level of performance. By opening our System Planner, Design Gateway, and Design Force solutions to Valeo's AI agents, we demonstrate that the true power of AI in engineering lies in the alliance between a high-performance software engine and expert industrial know-how."
The co-innovation is structured around the design flow and combines the unique strengths of each partner:
Functional Generative Design: Using Zuken's System Planner, Valeo deploys its generative AI to instantly create and evaluate optimal multi-criteria architectures based on Valeo's standards.
Digital Continuity: Zuken's open platform ensures integration with Valeo's ecosystem and digital continuity for full traceability for the Automotive SPICE 4.0 (ASPICE4.0) HWE (Hardware Engineering process group) standard. Valeo's AI processes data and reinjects it as automated actions in the platform.
Assisted Detailed Design: Valeo integrates "AI Agents" (virtual copilots) to assist engineers in real time with solution searches, hardware rule verification, and constraint implementation while Zuken develops native AI functions to accelerate schematic entry using Valeo's standardized database.
Auto-Placement and Routing: Physical integration relies on Zuken’s Design Force engine which offers some of the most powerful AI Place and Route (AI-PR) algorithms on the market. To guarantee a "First Time Right" execution, Valeo uses Zuken's SDK to act directly within the tool and "train" this AI on the extreme constraints of the automotive industry.
MILPITAS, Calif. — May 27, 2026 — SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, today announced the availability of a new industry research report focused on the glass core substrate market and trends, produced in collaboration with Global Net Corp. (GNC). The Glass Core Substrate Market and Development Trends Report examines the emerging market for glass core substrates, a potential next-generation packaging technology attracting increased attention as AI and high-performance computing (HPC) drive demand for larger and more advanced semiconductor packages.
“As chipmakers look for new ways to improve system performance beyond traditional device scaling, advanced packaging has become a critical area of innovation,” said Clark Tseng, Senior Director of Market Intelligence, SEMI. “Glass core substrates are being evaluated as one possible solution for future high-end packages because they may help support larger package sizes, finer interconnects, and improved dimensional stability compared to conventional package-substrate materials. This new report helps industry stakeholders understand where glass core substrates may fit in the next phase of packaging technology and what challenges must be addressed to achieve broader adoption.”
The report highlights increasing industry activity and investment around glass core substrates as companies prepare for the next phase of advanced packaging—providing an independent view of the technology’s market potential, development status, key players, and remaining barriers to commercialization. Under the report’s market-development scenarios, initial production could begin around 2028 in selected high-performance applications, with adoption expanding over time across larger and more complex package architectures. Based on the average of its Positive, Base, and Negative scenarios, the report projects a compound annual growth rate (CAGR) of 67.2% from 2028 to 2040. It also maps an increasingly active global development ecosystem, with companies and research organizations across Asia, North America and Europe advancing glass core substrate technologies.
Key topics covered in the report include:
Market outlook and adoption scenarios for glass core substrates
Technology drivers and barriers to commercialization
Expected applications in AI, HPC, advanced processors, co-packaged optics, and image sensors
Company activities across substrates, glass materials, equipment, processing, inspection, and related supply-chain segments
Development hubs, consortia, and supply-chain structure
Forecast scenarios through 2040
The Glass Core Substrate Market and Development Trends report is available in English and Japanese editions through SEMI Market Intelligence. Download the report.
