Press Releases

Eltek Ltd., a global manufacturer of printed circuit boards, has received a $2.4 million order from a leading Israeli defense company. The products will be delivered mainly in 2026 and 2027 and are critical components in the customer's systems, requiring advanced technological capabilities. This order is a continuation of previous supplies to the same customer.

Eltek Ltd. (NASDAQ: ELTK), a global manufacturer of printed circuit boards (PCBs), has received a significant order worth $2.4 million from a leading Israeli defense company. The order, announced on August 25, 2025, is set to be delivered primarily in 2026 and 2027. The products are critical components that require advanced technological capabilities, and this order is a continuation of previous supplies to the same customer [1].

Eltek specializes in the manufacture and supply of complex and high-quality PCBs, including HDI, multilayered, and flex-rigid boards, catering to high-end markets such as defense, aerospace, and medical industries. The company's headquarters and R&D center are located in Israel, with operations extended through subsidiaries and distributors in North America and various other regions [2].

The CEO of Eltek, Eli Yaffe, commented on the order, stating that the products have been previously supplied to the same customer. This indicates a strong, established relationship and a high level of trust between Eltek and the defense company. The order highlights Eltek's ability to meet the advanced technological requirements of the defense sector, which is critical for the integration of PCBs into sophisticated defense systems.

Eltek's order book continues to grow, reflecting the company's strong market position and technological expertise. As a global player in the PCB industry, Eltek's focus on innovation and high-quality products is evident in its ability to secure such significant orders from leading defense companies. The company's certifications, including ITAR compliance, AS-9100, and NADCAP electronics, further underscore its commitment to quality and reliability.

For more information about Eltek Ltd., visit their website at www.nisteceltek.com.

On Aug 18, Jarnistech, a PCB manufacturer specializing in high-end multilayer and specialty material boards, announced the launch of its glass-based printed circuit board (PCB) solution. The technology has already been adopted in customer prototype validation projects, aimed at applications that require strict control over signal loss, thermal stability, and optical transparency. As electronic systems continue to evolve toward RF transmission, optoelectronic integration, and miniaturization, glass PCBs have emerged as a promising alternative to traditional FR-4. Glass substrates deliver superior insertion loss characteristics, impedance consistency, thermal stability, and optical clarity, helping address material performance bottlenecks in advanced designs.

“Unlike conventional copper-clad laminates, glass is rigid and brittle,” said Mike, an engineer at Jarnistech. “Mechanical drilling and depaneling can’t be applied. To overcome this, we’ve adopted custom fixtures, non-contact handling systems, and laser-induced chemical etching to achieve precise, microcrack-free forming.” He added that operators undergo specialized training in plasma surface treatment and brittle-material handling.

Jarnistech has developed a complete technical framework, covering equipment, processes, and operations, to reliably support prototype verification and customized R&D for glass PCBs. The company has already delivered prototypes to customers in fields such as optoelectronic sensing, millimeter-wave communication, and AR modules. Building on this, Jarnistech is expanding its high-end manufacturing capabilities by leveraging the reliability of specialty substrates. Its portfolio includes Rogers, Isola, Panasonic, Taconic, Teflon, and BT series, as well as hybrid PCB structures, enabling clients to implement high-frequency, high-speed designs.

“Beyond glass substrates, we are also advancing in other specialty PCB materials,” said Jeremy Lin, CEO of Jarnistech. “We now have mature processing experience with ultra-low-loss laminates, including Panasonic’s Megtron 6 and M8 series. Looking ahead, Jarnistech will continue focusing on specialty PCB solutions to provide stable, reliable support for complex, high-performance designs.”

Freudenstadt, Germany – August 20th, 2025 - SCHMID Energy System GmbH has been awarded a major contract by Dutch shipping company Portliner to design and construct a large-scale flow battery system with up to 1.5 MW of peak power. This state-of-the-art energy storage solution will serve as the primary power source for the zero-emission propulsion of an all-new container vessel.

This landmark project marks SCHMID Energy System’s entry into the maritime propulsion market and strengthens its position as a pioneer in sustainable energy storage solutions for shipping. The chosen flow battery technology offers high energy density, exceptional longevity, and flexible charging and discharging capabilities- all critical requirements for the reliable operation of large cargo vessels on long-haul routes. It allows charging the battery from onshore electrical charger or for very fast charging swapping of discharged electrolyte with charged electrolyte from charging pontoons will be developed.

“This contract is a major strategic milestone for our company,” said Henrik Buschmann, Vice President BU Energy Systems, SCHMID Group.

“We are leveraging decades of experience in innovative energy systems to enter the maritime sector for the first time, sending a strong signal for sustainable solutions worldwide. Partnering with Portliner allows us to combine technological excellence with a clear commitment to environmental and climate protection.”
Portliner is equally enthusiastic about the collaboration.

“With SCHMID Energy Systems, we have found a partner that not only brings deep technical expertise but also shares our vision for clean, future-proof shipping,” said Ton van Meegen, CEO, Portliner.

“The flow battery will enable us to operate our container ships entirely emission-free, making a tangible contribution to reducing CO₂ emissions in global trade.”

The vessel will operate without any fossil fuels, directly contributing to the decarbonization of maritime freight transport and supporting international climate goals.

Upon successful delivery of this project, SCHMID Energy Systems intends to further advance maritime applications of its flow battery technology - from cargo ships and ferries and swimming electrolyte pontoons.

Atlanta – ECIA’s 2025 Executive Conference Committee is pleased to announce that the program for the October conference is complete. The theme for this year’s conference is ‘Amped UP, the Power of Tomorrow.” The 2025 Executive Conference takes place October 19-21, 2025, at a NEW LOCATION, the Westin O’Hare Hotel.

"The 2025 ECIA Executive Conference Core Committee was inspired by the rapid advancements in technology shaping the electronics industry and selected a theme that captures the opportunities ahead,” explained Maryellen Stack, Director of Marketing Communications, Sager Electronics, and this year’s conference chair. “‘Amped Up. The Power of Tomorrow.’ is more than just a theme—it’s a call to action. It reflects the energy, transformative innovation, collaboration, and resilience driving our future. We are committed to delivering a conference that not only tackles the hard topics but also ignites—and powers—new ideas to lead our businesses forward.”

The conference committee considers survey results, feedback from previous years’ attendees, and current market conditions when selecting a theme. With supply chain disruptions, tariff uncertainty and geopolitical upheaval top of mind for strategic planners, theme selection was particularly important.

“Now that the conference program and speakers are finalized, the work of the Speaker Vetting committee really ramps up,” noted Stephanie Tierney, ECIA's Director of Marketing Communications and Member Engagement. ”They must work with each of the speakers to fine tune and prep the presentations to ensure that the topics are specific to our industry and the content flows together logically and doesn’t overlap or repeat. The theme sets the agenda reflecting the excitement of collaboration in our future. The 2025 Executive Conference Core Committee is working hard to deliver a top-notch experience.”

Sponsorships are filling fast! This Conference offers personal access to industry experts, ample time to discuss important issues and critical networking opportunities. Spotlight your company by becoming a sponsor. Several sponsorship levels are available as well as the opportunity to support a particular event or session.

Contact Stephanie Tierney: This email address is being protected from spambots. You need JavaScript enabled to view it. for more information or visit the sponsorship page.

Visit the conference website for more information.

MacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is pleased to announce the appointment of Dr. Ravi Bhatkal to the newly created role of Vice President, Strategy, India.

In this newly established role, Dr. Bhatkal will report to the Executive Vice President of MacDermid Alpha Electronics Solutions and spearhead strategic initiatives to accelerate business growth and transformation in the Indian market, collaborating closely with global business and commercial leaders. His mandate aligns with India’s national priorities to build a robust and self-reliant electronics manufacturing ecosystem, supported by key government programs such as the Production Linked Incentive (PLI) scheme and the India Semiconductor Mission (ISM), which aim to attract investment, boost local innovation, and strengthen supply chain resilience. Dr. Bhatkal brings over two decades of leadership across the electronics, advanced materials, and energy sectors. He most recently led commercial operations in India for the Semiconductor Assembly Solutions division and has held senior roles including Vice President, Energy Technologies, and Managing Director, India, at Element Solutions Inc,. Renowned for driving transformation and building high-performing teams, he has consistently delivered strategic growth and operational excellence.

He serves on the board of iNEMI and advises leading institutions including IIT Madras and the Central Manufacturing Technology Institute. Dr. Bhatkal holds a Ph.D. and M.S. in Materials Engineering and an MBA. He is also a published author and co-inventor on multiple patents.

“Ravi’s appointment marks a pivotal step in advancing our long-term growth strategy for India,” said Julia Murray, Vice President, Global Marketing Communications. “His in-depth understanding of the Indian market, combined with a global perspective and passion for innovation, makes him the ideal leader to drive strategic progress in this critical region.”

This new role reflects MacDermid Alpha’s commitment to expanding its presence in India and delivering long-term value to customers and partners in the region. It also reinforces the company’s intent to actively contribute to India’s vision of becoming a global hub for electronics system design and manufacturing (ESDM).

ORLANDO, FL – The 2026 IEEE Electronic Components and Technology Conference (ECTC), the premier technical conference and product exhibition for the world’s semiconductor packaging industry, has announced a Call for Papers. ECTC 2026 will take place May 26-29, 2026 at the JW Marriott & Ritz-Carlton Grande Lakes Resort in Orlando, FL. More than 2,000 scientists, engineers and business people from more than 20 countries are expected to attend.

Abstract submission will open on August 18, 2025, and the deadline for submissions is October 6, 2025. For all details and to submit an abstract, please visit the ECTC 2026 Call for Papers.

The ECTC 2026 technical program will address new developments, trends and applications for a broad range of topics, including components, materials, assembly, reliability, modeling, interconnect design and technology, device and system packaging, heterogeneous integration, chiplet architectures, hybrid bonding, WLP and PLP, fan-out and fan-in packaging, flip chip technologies, integrated photonics and optoelectronics, LEDs, 5G, quantum computing and systems, and other emerging technologies in electronics packaging.

Previously unpublished, non-commercial paper abstracts are requested in areas including:

  • Applied Reliability
  • Assembly and Manufacturing Tmetechnology
  • Electrical Design and Analysis
  • Emerging Technologies
  • Interconnections
  • RF, High-Speed Components & Systems
  • Materials & Processing
  • Thermal/Mechanical Simulation & Characterization
  • Packaging Technologies
  • Photonics
  • Interactive Presentations

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