Ventec Giga Solutions, the equipment division of Ventec International Group, announces that it has been appointed as sales agent and distributor of Taiwanese manufacturer Yeitek's specialized PCB cleaning machines and accessories. The agreement encompasses EMEA, the United Kingdom, and the Americas.
Yeitek cleaning machines and accessories are made to effectively address and prevent FOD contamination to ensure defect-free, cost-efficient PCB production processes. The range of equipment offers single- and double-sided automated cleaning choices that utilize specially formulated adhesive rolls and absorbing rollers to efficiently remove any dust and/or debris.
“This is the beginning of a significant partnership, and I am very excited to be working with Yeitek as we develop our capabilities and equipment offering through Ventec Giga Solutions to deliver a consistently excellent customer experience to current and new customers,” said Ramesh Dhokia, Business Unit Director, Ventec Giga Solutions. “We are thrilled to present our new partnership with Yeitek at Productronica 2023 on booth B3/242, which will take place in Munich from November 14 to 17.”
Mark Goodwin, COO of Ventec International Group added: “The appointment represents a great opportunity for Ventec to expand and support Yeitek’s customer base, whilst at the same time strengthening our one-stop-shop solution for PCB manufacturers, OEMs, and EMS. Yeitek has served customers in the PCB industry for nearly 40 years, and we are proud to have such an important partnership.”
Ventec Giga Solutions handles factory design, equipment selection, sales, installation, commissioning, and training on behalf of customers. The division’s competencies and connections with numerous leading equipment suppliers, combined with the Ventec portfolio of high-performance substrate laminates and prepregs, presents a one-stop-shop for PCB manufacturers, OEMs, and manufacturing services companies to quickly establish and rapidly expand their facilities.
Further information about Ventec’s solutions and the company’s wide variety of products is available at www.venteclaminates.com
07. November, 2023 - Ventec Giga Solutions, the equipment division of Ventec International Group (6672 TT) that delivers turnkey workflow solutions, including equipment selection, installation, and commissioning, has reached an agreement to distribute high-performance inkjet-printers from Hi-Print in Europe and North America.
Hi-Print creates advanced, high-accuracy inkjet printers for precision printing of solder masks and PCB identification including legends and QR codes. As a high-speed, digital alternative to silk-screen printing, Hi-Print’s inkjet solutions are configurable, programmable, efficient, clean, and ready to start printing instantly after the design is loaded.
“Since we first met Hi-Print, we have been excited about the innovation and quality evident in the products and the opportunities to grow sales in our marketplace,” said Ramesh Dhokia, Business Unit Director, Ventec Giga Solutions. “With Ventec’s extensive distribution network, market knowledge, supply-chain management capabilities, and customer support services, we expect to build a strong and close partnership that will deliver enduring success.”
“Our printers bring game-changing speed and flexibility to electronic manufacturing, and we are confident that Ventec Giga Solutions can grow sales in high-value territories throughout Europe and North America,” said Hi-Print CEO Mr Cheng Wen. “We are looking forward to working with Ramesh and his team and to jointly focusing our energies on ensuring the success of this relationship.”
The Hi-Print portfolio includes single- and dual-workbench inkjet printers, highly automated printers including inline models, the AR20LK roll-to-roll printer for flexible printed circuit, and the SD200 dedicated double-workbench solder-mask printer. Capable of producing several thousand units per day, the printers offer outstanding features that enhance flexibility and productivity, including multiple configurable print heads, automated clamping, and one-touch operation.
Ventec Giga Solutions handles factory design, equipment selection, sales, installation, commissioning and training on behalf of customers. The division’s competencies and connections with numerous leading equipment suppliers, combined with the Ventec portfolio of high-performance substrate laminates and prepregs, presents a one-stop-shop for PCB manufacturers, OEMs, and manufacturing services companies to quickly establish and rapidly expand their facilities.
Further information about Ventec’s solutions and the company’s wide variety of products is available at www.venteclaminates.com.
About Ventec International Group
Ventec International Group Co., Ltd. is a Taiwan Stock Exchange listed (TWSE:6672.TT) global supplier of advanced base materials for the PCB industry worldwide, with manufacturing and distribution facilities throughout Asia, Europe, and the US. Ventec’s range of laminates & prepregs include signal integrity/high-speed digital, RF/Analog & high-performance IMS material technology, and an advanced range of thermal management solutions designed for specialized use in industries including automotive, communication, aerospace, and defense. All are manufactured by Ventec using strict quality-controlled processes that are certified to AS9100 Revision D, IATF 16949:2016 and ISO 9001:2015, and are backed by a fully controlled and managed global supply chain, sales- and technical support network.
For more information, visit www.venteclaminates.com.
Freudenstadt, Germany, 07.11.2023. The SCHMID Group, a global solution provider for the high-tech electronics, photovoltaics, glass and energy systems industries, will be presenting itself to a broad specialist audience at productronica in Munich. From November 14 - 17, 2023, the company will be presenting highly innovative and sustainable solutions for the rapidly growing electronics market at the world's leading trade fair for electronics development and production in Hall B3.
With their new solutions and exhibits on show, the company is underlining its pioneering technological role in the industry, its high level of innovation and its commitment to more sustainable and therefore more environmentally friendly production.
Embedded Trace Process – made by SCHMID: A new approach to PCB and substrate production
The new Embedded Trace Process (ET Process) is an absolute highlight. With this new process – and with it a new generation of production equipment – the company is revolutionizing PCB and substrate production. This unique "process-system combination" now enables higher densities and many other technological features.
For example, "embedded circuit traces" offer many previously unimagined possibilities in miniaturization. Electronic devices and components are becoming increasingly complex and compact – and the space available for the necessary structures is becoming correspondingly tight.
The ET process now gives developers new freedom in electrical design in order to achieve optimum performance, an optimum thermal budget and optimum packing density in the printed circuit board.
Another highly innovative and very important aspect is signal integrity. Embedded traces allow designers to create traces in a completely new way in any shape and connect them across the isolation planes. Furthermore, careful control of impedance and routing of critical high-speed signals can be performed. This helps to maintain signal integrity and minimize signal degradation such as reflections or electromagnetic interference.
The new ET process also enables a significant improvement in reliability and longevity of a PCB, as there is no need to press the insulation layers into the circuit traces, thus eliminating the typical mechanical stress on the delicate circuit traces. In addition, the ET process avoids the surface topology caused by the conventional structure and, with its always planar surfaces, offers significantly better layer to layer registration. Taken together, these two aspects enable a higher track density in the production process with a better aspect ratio of the copper traces.
There are also considerable advantages in terms of costs, production efficiency and the use of resources. For example, water consumption can be reduced by up to 70%, CO2 emissions by up to 30% and chemical consumption by up to 40%. The ET process therefore also forms the basis for considerably more environmentally friendly production – and enables SCHMID customers to improve their CO2 footprint.
This innovative process is realized by a new equipment technology from SCHMID. Due to this uniqueness and outstanding position in the market, the company has registered this highly innovative development for the "productronica innovation award", which recognizes the most innovative new products and manufacturing processes.
Through Glass Vias – complete solution for advanced packaging with glass wafers
SCHMID is breaking new ground with Through Glass Vias (TGVs). Glass is excellently suited as a substrate material and promises enormous market potential as a replacement for organic materials or silicon in the field of semiconductor substrates – also due to its excellent material properties. It offers significant commercial and technical advantages, particularly for requirements in the field of artificial intelligence (AI) and high-frequency applications. SCHMID offers its customers integrated complete solutions for advanced packaging with glass wafers or full panels across the entire value creation process – from glass processing for through-holes and structuring to metallization. This is a new and unique offering on the market.
The titanium etching module and the chemical copper module are also completely new – both for the InfinityLine H+ product line.
For the InfinityLine H+, SCHMID is developing an etching module made of titanium for the first time – and is thus facilitate new possibilities in high-temperature etching. Titanium has very high corrosion and temperature resistance as well as a long service life. By using this resistant material, a wide variety of chemicals can be used for etching and the etching process can be carried out at a temperature of up to 70 degrees.
The efficiency of the chemicals used is increased accordingly, resulting in a significantly faster etching process and thus an increased output quantity and improved efficiency. Furthermore, completely new etching structures can be realized, providing a new range of technological possibilities.
Of course, the full titanium module is also fully compatible with all InfinityLine H+ option packages. This module can also be equipped with the highly efficient and reliable vacuum etching technology. This ensures that there is always a permanent exchange of chemicals on the surface, guaranteeing a consistent and precise etching result. Due to its high resistance, this etching module represents a very long-lasting and therefore sustainable investment.
SCHMID's decades of experience in "chemical copper" have been incorporated into the new design of the InfinityLine H+. The company is now introducing the new "chemical copper" module for the InfinityLine H+. The task of this module is to deposit a thin copper layer on through-holes, blind vias and on the surface of the dielectric in a first step towards through-hole plating. The module has optimized hydrodynamics offering different wave forms in the immersion bath (so-called standing wave). These wave forms can be individually adjusted and visualized using ultrasonic flow meters.
A modified level drain from the process area into the tank area and a separate upright-shaft rinse ensure particle-free copper deposition on the circuit board. Thanks to its intelligent design, the module also offers extremely practical advantages in terms of handling. For example, the container base is rounded on all sides to prevent unwanted copper deposits. Furthermore, it can also be emptied very easily, quickly and completely, which results in a shorter cleaning time and therefore a positive effect on efficiency.
The "Chemical Copper" module in the InfinityLine design will be presented to trade visitors as an exhibit for the first time at the trade fair.
The new vertical resist stripping module for the InfinityLine V+ and the enhanced process chamber for the InfinityLine C+ will also be on display at the trade fair stand.
InfinityLine V+: Resist stripping module – "stripping" in perfection
The InfinityLine V+ is designed for Advanced HDI and IC substrates and is characterized, among other things, by vertical, contactless transport of the panels using innovative clamping frame technology. The transport frames are loaded and unloaded fully automatically. A magnetic transport system is also used to ensure particle-free movement of the frames. In addition to the developer, flash etch and a MEC process, SCHMID is expanding its high-performance and reliable InfinityLine V+ system concept with the new stripper module.
After etching, the module removes the dry film resist (stripping) and filters the dissolved and rinsed photoresist from the chemistry and prevents it from returning the tank area. Due to the vertical arrangement, the same process parameters exist on both the front and rear sides, resulting in optimum removal of resist particles. The new module therefore stands for perfect results and thus for maximum quality.
InfinityLine C+: Process chamber – intelligently enhanced!
The InfinityLine C+ is a modular, vertical, non-contact cluster that can be equipped with up to 8 vertical spin chambers. SCHMID's proven clamping frame technology is also used here. As with other non-contact product lines from SCHMID, the clamping frame makes it possible to hold the thinnest substrates.
The further developed process chamber with simultaneous processing of the front and rear sides offers the user enormous advantages. The vertical rotary movement (rotation) and a servocontrolled spray arm allow complex movement patterns to be run, which enables maximum process reliability in terms of time, pressure and chemical distribution – allowing 2 μm structure resolution and below. Another advantage: several processes, including rinsing and drying, can be carried out sequentially within one chamber. The C+ system concept also stands for minimum consumption of resources such as water and chemicals. In this way, the C+ system series combines technological possibilities with a resource-saving production process in a special way – with correspondingly positive effects on running costs, CO2 balance and environment. Just typical SCHMID.
About SCHMID Group
The SCHMID Group is a world-leading global solutions provider for the high-tech electronic, photovoltaics, glass, and energy systems industries, with its parent company Gebr. SCHMID GmbH is based in Freudenstadt, Germany. Founded in 1864, today it employs more than 800 staff members worldwide, and has technology centres and manufacturing sites in multiple locations including Germany and China, in addition to several sales and service locations globally. The Group focuses on developing customized equipment and process solutions for multiple industries including electronics, renewables and energy storage. Further information is available at: www.schmid-group.com
SOUTHINGTON, CT – Dr. Patrick Valentine, Technical & Lean Six Sigma Manager and Six Sigma Master Black Belt, announces the completion of Lean Six Sigma Black Belt training by 4 members of Uyemura’s professional staff. They are: Business Development Manager, Rich DePoto; Technical Service Engineer, Colin Poedtke; Senior Chemist, Brittany Levine, and Chemical Engineer, Magdalena Debkowski.
Six Sigma certification demonstrates a deep understanding of statistical analysis, problem- solving, and project management. It signifies an individual's ability to lead process improvement initiatives, drive change, and deliver measurable results. Black Belt is the program’s highest certification level.
WALTHAM, MA – Nano Dimension Ltd. (Nasdaq: NNDM) (“Nano Dimension”, “Nano”, or the “Company”), a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (“AM”) 3D printing solutions, today announced that, in light of the ongoing war between Israel and the Hamas terrorists (the “War”), its Board of Directors (the “Board”) has cancelled the extraordinary shareholders general meeting (“EGM”) that was originally scheduled to convene on December 13th, 2023. The Board will consider rescheduling options for the EGM when the impact of the War on Nano’s Israeli workforce subsides.
When the EGM was initially announced on October 18th, 2023, the expansive nature and depth of the War was not yet clear. While Nano continues to believe that its financial performance during fiscal 2023 and beyond will not be affected by the War, its staffing across critical corporate functions (not including sales and marketing) will be impacted as individuals within Nano’s workforce are called to join the War effort. The recruitment of reserve duty in Israel currently includes approximately 15% of Nano’s local workforce.
As previously announced, Nano Dimension remains confident in its outlook for fiscal 2023 and expects to deliver its strongest year yet in terms of organic growth. The Board and the Company’s management team continue to take actions against the backdrop of the War-driven constraints outlined above.
The impact on organizational capacity should be considered in the context of two ongoing developments this quarter, beyond the sales & marketing and customer support campaign:
First, and fortunately, Nano Dimension hopes to have a strong quarter in terms of revenue, translating to many instances of high value promises to its customers and significant demands on all support functions to fulfill them.
Second, as previously announced, this quarter Nano’s management is preparing for Q4/2023 and 2024 goals of “Right-Shaping–Profitability Focus”. This is a major corporate transition that will include the adoption of programs that consume the efforts of finance and operation personnel, in addition to closing the reporting of the third quarter of 2023 and the fiscal year 2023.
Yoav Stern, CEO of Nano Dimension, commented: “While we operate in 6 countries across the globe, support for our Israeli colleagues and execution of our strategic plan must take priority. Prioritizing our effort during this special circumstance means that the time-consuming preparation for a December 2023 EGM is not currently in the best interest of the Company and its shareholders. Nano is performing during the War – without compromising business results. With approximately 15% of our colleagues serving in uniform for Israel’s armed forces during this tragic war, we see no other way to fulfill our primary responsibility of delivering on customer promises as we continue our effort to drive record results, other than to focus exclusively on execution. Hence, the December EGM is cancelled.”
CAMBRIDGE, UK – Ensuring that sensitive electronic components are not adversely affected by radiated electromagnetic interference (EMI) is an essential part of circuit design. Where compactness and close component proximity are a priority, such as in smartphones and smartwatches, conventional board-level shielding with metallic enclosures is increasingly being replaced with conformal package-level shielding. This approach utilizes conductive coatings applied directly to semiconductor packages and, together with emerging deposition methods such as spraying and printing, creates new opportunities for functional materials.
When selecting a material for conformal package EMI shielding, a variety of factors need to be considered. Most important is the attenuation of incident electromagnetic radiation, which is a function of electrical conductivity and magnetic permeability. Often parametrized as shielding effectiveness (SE), higher values enable a thinner coating to be used, reducing weight and material consumption. Other material considerations include adhesion to the underlying epoxy molding compound of the package, thermal conductivity, density, chemical stability, and compatibility with the deposition method if solution processing.
Sputtered metal
Sputtering metal is a well-established incumbent technology for conformal shielding, in which high-purity blocks of solid metal are ablated and deposited with a beam of charged ions. Many conformal shielding coatings use multiple metal layers, easily achieved by switching sputtering targets. Cap and/or adhesion layers are typically made from titanium, chromium, or stainless steel, with the primary shielding layer typically being cheaper metals such as copper, aluminum, or nickel.
While sputtering is well established, there is still scope for innovation. One proposed strategy, inspired by optical anti-reflective coatings, utilizes destructive interference from a multilayer stack to increase the shielding effectiveness. However, this improvement is highly frequency-dependent, given the fixed material spacing.
Conductive inks
Depositing conductive materials from solution provides an alternative to sputtering, with much-reduced equipment costs since the process occurs under ambient conditions rather than a vacuum. A range of solution processing methods, including spraying and inkjet printing, have been developed for EMI shielding, with all requiring conductive ink. Despite the high metal price, silver inks currently dominate due to their high conductivity and chemical stability.
Although the underlying metal is the same, there is extensive scope for differentiation amongst conductive ink suppliers. Particle shape and size are key factors, with nanoparticles generally offering higher conductivity but requiring higher curing temperatures than flake-based inks. Particle-free ink, also known as molecular ink, is a compelling emerging alternative. Rather than a suspension of metal particles, the ink is instead a solution of organometallic species that are reduced in situ, producing a smooth metal layer. A key advantage of particle-free conductive ink is eliminating the risk of nozzle clogging, a significant factor for digital printing methods such as aerosol and inkjet that enable selective deposition. Another benefit is that they produce very smooth coatings, which can improve shielding efficiencies at high frequencies.
MXenes
The ideal EMI shielding material would have high electrical conductivity, low density, flexibility to accommodate thermal expansion, tunable surface chemistry for adhesion, and solution processability. The emerging material class of MXenes, a family of two-dimensional inorganic materials composed of a few layers of transition metallic carbides, nitrides, or carbonitrides, fit this description. MXenes are thus the subject of both academic and commercial research for applications across electronics, including EMI shielding, with efforts currently being made to scale up production.
Comprehensive coverage
IDTechEx’s report “EMI Shielding for Electronics 2024-2034: Forecasts, Technologies, Applications” provides a detailed overview of the ‘EMI shielding for electronics’ market, with a more detailed assessment of the outlined materials classes along with nanocarbon-containing composites, metamaterials and combined thermal interface/EMI shielding materials. Innovations that will support the increasing adoption of heterogeneous integration and advanced semiconductor packaging, along with the activities of key players, are evaluated. 10-year forecasts for both deposition method and conductive ink consumption are provided, drawing on consumer electronic device analysis to assess the semiconductor package area requiring conformal shielding. Forecasts are segmented across multiple application categories, including smartphones, laptops, tablets, smartwatches, AR/VR devices, vehicles, and telecoms infrastructure. For more information on this report, please visit www.IDTechEx.com/EMI, or for the full portfolio of related research available from IDTechEx please visit www.IDTechEx.com/Research/AM.
