SHANGHAI – Vayo Technology, a global provider of industrial software solutions for interconnected electronic systems from design to manufacturing, is pleased to announce plans to exhibit at PCB West 2023. The event is scheduled to take place Wednesday, Sept. 20, 2023 at the Santa Clara Convention Center in California. Vayo Technology will discuss DFX know-how digitalization and how to build your own digital know-how library in Booth #510.
With its robust DFX Design Execution System Software, Vayo Technology is at the forefront of providing intelligent system platform solutions for enterprise electronic design and process departments. The system offers a transformative approach to automating the review, analysis, and digital management of PCB/PCBA design data.
PCB West 2023 provides a unique platform for industry professionals and enthusiasts to gather and explore the latest advancements in the field of printed circuit boards. Vayo Technology is excited to contribute its insights into DFX know-how digitalization and showcase how its solutions empower enterprises to optimize their design and manufacturing processes.
Visitors to Booth #510 can engage with the Vayo Technology team to gain insights into the benefits of DFX know-how digitalization. By streamlining and automating design data review and analysis, Vayo's solution enables businesses to enhance their overall productivity, reduce errors, and optimize collaboration between design and manufacturing teams.
Vayo Technology invites attendees to discover the potential of DFX know-how digitalization and explore the possibilities of building their own digital know-how library. The company's expertise in intelligent manufacturing solutions positions them as a valuable resource for professionals seeking to stay at the forefront of industry trends and advancements.
SINGAPORE – The Asia Responsible Enterprise Awards (AREA) 2023 is pleased to honor 30 outstanding business leaders and enterprises for championing sustainable and responsible business practices. Presented by leading regional NGO Enterprise Asia, the AREA is the most reputable award recognition program recognizing organizational efforts in creating a culture of compassion, integrity, and in being socially responsible corporate citizens. The AREA serves as a badge of excellence to spur further innovation and best-practice sharing for organizations and the world at large. The awards event is also preceded by the International CSR & Sustainability (ICS) Summit 2023 which was themed "Sustainability as the Great Equalizer".
Apex Circuit (Thailand) Co., Ltd. (Apex), the subsidiary of Apex International Co., Ltd (TWSE:4927) was among the recipients who were conferred with the Social Empowerment Award. As a professional manufacturer of printed circuit boards (PCB). Apex has been focused on single-to-12-layer rigid production since the year 2001. The company is ranked as a major high-revenue rigid PCB manufacturer in Thailand, and its products are being sold internationally to Japanese, Korean, European, and USA customers.
Apex chose to carry out public welfare construction in the village of Uttaradit in northern Thailand, assisting the local village to install solar panels and improve the water supply system. This project brings the concepts of clean energy and sustainability to rural areas and takes root in local communities to establish a win-win relationship with society.
Apex has worked on many initiatives including cooperating with the local government to disseminate the policy of reducing straw burning and also introducing the solar-powered system to vocational school students.
The company executed this initiative under the concept of "Young Generation Returns Home" by using the domiciles of successful and long-term Apex employees to develop the project. 90% of these employees have their domiciles in upcountry provinces.
For this project, the Apex team developed a complete plan to supply power for the pumping equipment. The company built a 5kW solar-powered module to supply a portion of electricity for the water supply system. Besides that, the water cistern was expanded, the pipeline was renewed, and the filter was cleaned out. These improvements extended the lifespan of the original water supply system and saved on electricity expenses for the residents.
After the system was launched, the survey metrics showed that the solar-powered system reduced about 30% of the consumption of non-renewable energy every month, as the plan had proposed.
The project's influence led to a total of 121 households signing a memorandum that they would use renewable energy and promise to avoid straw and agricultural waste burning to reduce CO2 emissions, the impacted area is estimated to be around 1,880,000 square meters. The local government also provides straw balers to assist residents in dealing with the straw to reduce the harmful impact on the environment.
Thanks to Apex's efforts, the use of sustainable energy has entered the lives of residents, and a green mindset has been implanted in the hearts of many students. Adding to this is the government's endorsement of improving waste disposal methods and promoting the concept of sustainable development of the environment in more regions.
Apex also intends to assist in the implementation of sustainability catered to local conditions, so that environmental friendship is not just a concept but also enters becomes a way of life.
LYON, FRANCE – The processor market had a remarkable year in 2021, achieving a historic high of US$155.5 billion with a robust growth rate of 22.3%. However, the following year, it experienced a slight downturn, with revenue settling at US$154 billion. The primary factor contributing to this decline was the CPU segment, which was mainly impacted by reduced shipments in the PC category and increased competition from non-x86 APUs.
Conversely, the APU market saw significant growth in 2022, and the data center sector exhibited substantial expansion, leading to a shift in revenue distribution. While the total revenue for processors is expected to reach US$242 billion by 2028, CPUs are expected to maintain their dominant position, GPUs are projected to experience significant growth, and data center is poised to emerge as the fastest-growing market.
In this context, Yole Intelligence releases its Status of the Processor Industry 2023 report. In this report, the company, part of Yole Group, gives a broad overview of the semiconductor processor industry, as well as an in-depth understanding of the market trends, ecosystem, and players and offers critical technical insights and analyses into future technology trends and challenges.
More advanced iterations of processors demand increased integration of circuitry, particularly larger blocks of logic and SRAM. In the past, progress toward denser logic was as straightforward as the next lithography shrink. However, as transistors continue to shrink in size, they have become more intricate and expensive to manufacture. In 2022, the industry is approaching the end of the finFET era, with gate-all-around architectures at 3nm and 2nm on the horizon.
This evolution is led by major players like Intel, TSMC, AMD, NVIDIA, and Samsung. High-performance packaging platforms like Si interposers and hybrid bonding are becoming increasingly pivotal across various applications, reveals Yole Intelligence in this new report.
The processor market is largely dominated by a few key players: Intel, AMD, Nvidia, and Qualcomm, with these giants holding 54% of the total market share.
Competition is growing, with new entrants and tech giants like Amazon and Alibaba entering the CPU arena. Qualcomm, MediaTek, and Apple lead in APUs, with 32% of the market. The SoC FPGA and AI ASIC segments are led by AMD, Intel, and tech giants like Google and Amazon.
The processor startup landscape is dynamic, raising substantial funds, especially in AI-focused endeavors, with China leading the pack. The semiconductor industry in China is evolving, driven by investments and a growing ecosystem. In 2022, notable M&A activities included AMD’s acquisition of Xilinx and Pensando, Intel’s failed attempt to acquire Tower Semiconductor, and Nvidia’s abandoned bid for Arm.
KEMPEN, GERMANY – For Peters, the new Reflow 1.8. soldering machine from SEHO is an investment in the future. Like its predecessor, this machine is used in the laboratory for testing high-quality solder resists. Before the coatings are entrusted to the customers, Peters performs a thermal soldering simulation. Substrates and circuit boards coated with Peters coatings pass through the inner workings of the machine via a conveyor belt.
"There, the circuit boards are exposed to temperature stress", reports Jonas Sutmann. Together with his colleague Michael Contzen, the coatings lab technician is responsible for the machine at Peters. "If our coatings withstand this test undamaged under extreme temperature stress, the industrial customer can be sure that in their context, too, they are resistant and robust in view of permanently protecting the respective PCB," reports the 26-year-old technician from Oberhausen.
The coated part can be heated to a maximum of 320° Celsius in the new reflow system by a total of ten radiators on two levels. "If the coating shows no cracks or color changes in the inhouse soldering system after the heat bath, a major hurdle in the development of new special coating systems for electronics has been taken." This ensures the customer that the coating systems from Peters fulfill the high demands placed on them at all times.
The machine is therefore an important element in the development of solder resist technology. Peters is a leader in this field. "Our white solder resist systems from the ELPEPCB® product family are chosen for many LED lamps," reports Detlef Paschke, Head of the Technical Service at Peters. By deciding to purchase the soldering system from SEHO, the full-range supplier of coating materials for electronics from the Lower Rhine region has once again invested significantly in the family-owned company based in Kempen.
By this soldering machine, not only inhouse the research and development activities, but also the Quality Assurance sector is advancing into new dimensions that are directly adapted to the customer’s needs. "This system is indeed a further development of extraordinary value for our research and development," emphasizes Detlef Paschke who has been working at Peters for 27 years. The investment in the reflow system was consistent and future-oriented," says the 54-year-old from Willich.
In the Peters laboratory, the 900-kilogram SEHO machine measuring 3.20 by 1.25 by 1.60 meters is already a hunk in terms of length, height and width. "Nevertheless, our supplier SEHO has built the system in such a way that it takes up around half as much space as in everyday industrial production," says Jonas Sutmann, the responsible machine operator.
WATERBURY, CT – MacDermid Enthone Industrial Solutions, a manufacturer of chemical compounds used in surface coating applications, announced it will open a second facility in Japan in order to better serve the needs of the local automotive industry. The laboratory will be located in Nagoya and provide technical services to the region's Tier 1s, Tier 2s and other companies vital to the automotive ecosystem.
MacDermid Enthone Industrial Solutions, which operates in Japan as the MacDermid Performance Solutions Japan K.K. legal entity, currently provides technical services to Nagoya-based customers from the Hiratsuka location in Kanagawa Prefecture. The laboratory in Nagoya will reduce the time required for existing customers to make important decisions about their plating bath parameters, many of which operate 24 hours a day. The additional location in Japan will also satisfy the business continuity planning requirements of every automotive OEM.
"We are very excited to have a presence in Nagoya, where we have already been supplying customers with specialty chemicals for more than 40 years. This strategic investment underscores our long-term commitment to Japan, a country which recognizes the value of our environmentally-friendly products. We also expect the gained trust to result in new business opportunities," said Richard Lynch, Senior Global Vice President of MacDermid Enthone Industrial Solutions.
Julian Bashore, Representative Director of MacDermid Performance Solutions Japan K.K., added, "After the soft opening on October 1st, we will be fully equipped by April 2024. The growth in our automotive business has allowed us to make such an expansion in Japan. With Japan's focus on sustainability, we are excited to expand our offerings in the electric vehicle market. This investment in Aichi Prefecture positions us for further market penetration with Japan-based manufacturers of brake calipers, door handles, emblems, fasteners and other components."
CAMBRIDGE, UK – Can digital and/or high throughput manufacturing be applied to circuit boards? Can stretchable electronics be produced without sacrificing processing capabilities? Flexible hybrid electronics (FHE) is an emerging manufacturing methodology that aims to resolve both of these questions. By combining aspects of printed and conventional electronics, specifically conductive inks patterned on a flexible substrate with mounted components such as integrated circuits (ICs), it represents a compelling 'best of both worlds' solution.
Matching Value Propositions to Applications
At its core, FHE is an alternative approach to circuit manufacturing. As such, FHE circuits can, in principle, be used wherever comparatively simple PCBs are needed (i.e., not complex multilayer circuits). Of course, replacing an established incumbent technology requires a compelling advantage that is typically application-dependent - do not expect FHE circuits to displace the PCB in most consumer electronics anytime soon.
Relative to existing flexible PCBs, FHE offers 3 distinct value propositions: Additive digital manufacturing, conformality/stretchability, and compatibility with roll-to-roll (R2R) manufacturing. The key to successful commercialization is finding a product-market fit where one or more of these value propositions either justifies switching or to facilitate a new application that would not otherwise be possible.
Additive Digital Manufacturing
Since conductive ink can be printed using digital methods such as inkjet or the emerging laser-induced forward transfer (LIFT), FHE enables additive digital manufacturing. FHE is thus well suited to prototyping and very high-mix low-volume (HMLV) manufacturing - it could also potentially be deployed to facilitate versioning and even 'mass customization', the latter of which is difficult to envisage without digital manufacturing.
Additive manufacturing is less wasteful than more established subtractive approaches and is thus especially advantageous when components and, hence, conductive traces are widely spaced. One such example is mounting LEDs on sheets for large area lighting, which can also be produced by R2R manufacturing.
Conformality/Stretchability
Conformality/stretchability is a key value proposition of FHE. Whereas flexible PCBs often employ rigid islands for mounting packaged ICs and other rigid SMD components, FHE circuits can be more flexible since many components (e.g., sensors) can be printed. Furthermore, conductive inks that are either stretchable or can withstand bending enables a shorter bending radius and even stretchability.
The flexible (and potentially stretchable) form factor makes FHE ideally suited to wearable technology, including electronic skin patches and e-textiles since it improves wearer comfort relative to the current rigid boxes that contain conventional electronics. Challenges include washability and sustainability concerns relative to reusable rigid electronics mounted within a removable box.
R2R Manufacturing
For large-volume manufacturing, conductive traces can be printed using rotary analog methods such as flexography, gravure, and rotary screen printing. This enables very rapid deposition via R2R manufacturing, reducing costs. Cost benefits are especially significant if traces can be printed onto existing surfaces (such as packaging labels), eliminating the need for a dedicated structure.
Given the large volumes required and relatively low value-add per item, minimizing costs is essential for electronics to be adopted for smart packaging/RFID. While most RFID tags currently use stamped aluminum foil for antennas, printing with copper inks will reduce costs and improve sustainability. R2R FHE production is forecast to expand to more sophisticated smart packaging circuits with greater functionality, such as sensing.
Comprehensive Insight
IDTechEx's report "Flexible Hybrid Electronics 2024-2034" evaluates the status and prospects of FHE circuits, which we forecast to reach a market size of around US$1.8 billion by 2034 - more if the associated infrastructure, software, and services are included. Drawing on years of following the printed electronics industry and 40 interview-based company profiles, the report outlines trends and innovations in the materials, components, and manufacturing methods required. It explores the application sectors where FHE is most likely to be adopted, drawing on current activity and in-depth discussions with contract manufacturers and potential adopters. Granular market forecasts break down the opportunities for FHE circuits across 5 application sectors (automotive, consumer goods, energy, healthcare/wellness, and infrastructure/buildings/industrial) into 39 specific opportunities, such as skin temperature sensors and printed RFID tags.
To find out more about this IDTechEx report, including downloadable sample pages, please visit www.IDTechEx.com/FHE.
