Larger substrate sizes for AI, network switch, and server CPUs are driving the development of new package structures as well as materials and processes for substrate fabrication. One of the major concerns with a large substrate is warpage; other concerns include material sets to support the larger body size, including thermal interface materials to help dissipate heat. TechSearch International’s latest Advanced Packaging Update examines these trends and includes a section on thermal interface materials (TIMs) under development for large body packages.

The Update also examines substrate material shortages, including glass fiber for the core and Bismaleimide Triazine (BT) resin for a variety of substrate types. Underlying causes for the shortages are discussed, along with alternatives for these materials.

An update on glass core substrates examines progress and highlights challenges in developing the technology. Trade-offs are examined. A particular advantage of the glass core is the potential for a thinner core than with existing glass cloth materials, but a core thickness of 1.0 mm may be necessary to meet reliability requirements. High-performance applications will require 11 or more build-up layers, and so far only three or four build-up layers on each side have been fabricated in test vehicles. There is little published reliability data for glass core substrates, and cost compared to alternatives is unavailable.

TechSearch International’s annual survey on substrate design rules is presented, featuring coverage of laminate flip chip BGA and CSP substrate suppliers worldwide. The design rules include body size, core thickness, via and pad diameter, minimum bump pitch supported, and substrate finish. Core and resin materials offered by each substrate supplier are listed. OSAT financials are highlighted.

The Update is a 100-page report with full references and a set of more than 90 PowerPoint slides.

TechSearch International, Inc., founded in 1987, is a market research leader specializing in technology trends in microelectronics packaging and assembly. Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis. TechSearch International professionals have an extensive network of ~20,000 contacts in North America, Asia, and Europe. For more information, contact TechSearch International at tel: 512-372-8887 or see www.techsearchinc.com. Follow us on LinkedIn.

Larger substrate sizes for AI, network switch, and server CPUs are driving the development of new package structures as well as materials and processes for substrate fabrication. One of the major concerns with a large substrate is warpage; other concerns include material sets to support the larger body size, including thermal interface materials to help dissipate heat. TechSearch International’s latest Advanced Packaging Update examines these trends and includes a section on thermal interface materials (TIMs) under development for large body packages.

The Update also examines substrate material shortages, including glass fiber for the core and Bismaleimide Triazine (BT) resin for a variety of substrate types. Underlying causes for the shortages are discussed, along with alternatives for these materials.

An update on glass core substrates examines progress and highlights challenges in developing the technology. Trade-offs are examined. A particular advantage of the glass core is the potential for a thinner core than with existing glass cloth materials, but a core thickness of 1.0 mm may be necessary to meet reliability requirements. High-performance applications will require 11 or more build-up layers, and so far only three or four build-up layers on each side have been fabricated in test vehicles. There is little published reliability data for glass core substrates, and cost compared to alternatives is unavailable.

TechSearch International’s annual survey on substrate design rules is presented, featuring coverage of laminate flip chip BGA and CSP substrate suppliers worldwide. The design rules include body size, core thickness, via and pad diameter, minimum bump pitch supported, and substrate finish. Core and resin materials offered by each substrate supplier are listed. OSAT financials are highlighted.

The Update is a 100-page report with full references and a set of more than 90 PowerPoint slides.

TechSearch International, Inc., founded in 1987, is a market research leader specializing in technology trends in microelectronics packaging and assembly. Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis. TechSearch International professionals have an extensive network of ~20,000 contacts in North America, Asia, and Europe. For more information, contact TechSearch International at tel: 512-372-8887 or see www.techsearchinc.com. Follow us on LinkedIn.

THAILAND – Ventec International Group has confirmed its agreement with Jinzhou Precision Technology Corporation to distribute precision drill and router bits in the Europe, Middle East, and Africa (EMEA) region, working in cooperation with DCM Technology, Jinzhou’s long-standing European distribution partner. Jinzhou Precision Technology is a globally recognised leader in PCB tools and micro-tools, with over 30 years’ experience in the field. The company was the winner of the National Microdrill Champion Enterprises Award and currently produces 70 million machine-tool bits per month, including drills and routers down to 0.01mm for advanced high-density applications.

“Our agreement with Jinzhou Precision Technology & DCM Technology allows us to offer a comprehensive selection of bit types and sizes, for fast delivery from regional inventory, all of the highest quality with proprietary coating options to ensure tools retain their edge and maintain the utmost accuracy for longer,” said Mark Goodwin, COO of Ventec. “Investing in the best drilling and routing products, from the world’s largest manufacturer, delivers tangible dividends for our customers by delivering sustained productivity and quality gains.”

Accurate drilling and routing are essential to ensure high production quality, seen in perfectly formed electrical and thermal vias, component mounting points, panelisation, board profiling, cutouts, and slotting. Jinzhou Precision high-quality bits ensure consistent accuracy, and the range includes extremely fine-diameter drill bits, with longer flute lengths that are needed to produce today’s most advanced high layer count HDI boards. The tools also ensure long service lifetime when operated up at high cutting speeds, maintaining fast and repeatable cycle times. Choosing Jinzhou Precision from Ventec & DCM for enduring integrity and sharpness empowers PCB makers to drive up throughput and productivity.

Ventec’s new agreement with Jinzhou Precision Technology &DCM Technology strengthens the company’s one-stop supply commitment, which also assures customers of premium PCB laminates, prepregs, machinery, consumables, and precision tools, all available for fast delivery from inventory a single trusted supplier. Ventec’s technical team provides guidance on selecting and using the materials and tools to ensure compatibility and optimum throughput to maximize manufacturing efficiency and quality.

Also supported by Ventec’s worldwide distribution network, customers can rely on fast dispatch, efficient shipping, and consistent delivery performance to ensure their PCB manufacturing operations are always on track.

Insulectro, the largest distributor of materials used in the manufacturing of printed circuit boards and printed electronics, announces a new service - a system to help our customers to access EMC's well established mass lam offerings. Long a leader in mass lam manufacturing, EMC is the exclusive supplier in Insulectro's laminate and pre preg portfolio. The addition of this service allows Insulectro to again find innovative ways to enable our customers to make better circuits faster.

Michelle Walsh, Vice President of Product Management stressed its importance, "Mass lam outsourcing becomes essential when it comes to the industries like automotive, medical or mil/aero with low-volume, high-tech and complex PCB requirements that demand a quick-turn service that high-volume fabricators don’t typically provide. Insulectro is pleased to facilitate contact between our fabricators and EMC.”

Mitchell Benson, Insulectro’s Product Manager – Laminates, who is deeply knowledgeable about EMC’s mass lam capabilities, offers his take, “At Insulectro, we’re always looking for ways to remove barriers for our fabricators. By streamlining access to EMC’s trusted mass lam solutions, we’re enabling customers to respond faster to complex builds and tight timelines—without sacrificing quality. It’s another example of how we partner with our suppliers and customers to drive innovation and speed to market.”