MILPITAS, Calif. — January 28, 2026 — SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, today announced its 2026 U.S. Policy Strategy: Securing the Semiconductor Supply Chain to Enable American AI Leadership designed to strengthen U.S. competitiveness, sustain long-term market investment, and support innovation across the full semiconductor ecosystem. These focal points reflect SEMI’s role as a trusted partner to policymakers and its commitment to advancing practical, coordinated, and industry-informed solutions that reinforce U.S. competitiveness in a highly integrated global industry.
“The semiconductor industry is vital to every facet of the modern economy, from artificial intelligence and advanced manufacturing to national security and workforce development,” said Ajit Manocha, president and CEO of SEMI. “As global competition intensifies and policy frameworks continue to evolve, the ability of the U.S. to maintain leadership in semiconductor design, manufacturing, and innovation will depend on clear, predictable, and forward-looking policy execution.”
SEMI policy priorities this year focus on providing certainty, enabling long-term investment, and ensuring the U.S. remains connected to the global network that makes semiconductor manufacturing resilient and sustainable. The SEMI 2026 U.S. Policy Strategy emphasizes five interconnected areas critical to strengthening U.S. leadership:
These priorities underscore the importance of early and meaningful engagement with industry for policymakers. Given the complexity of semiconductor supply chains and the scale of investments involved, policies developed with technical input from industry are more likely to achieve their intended outcomes while avoiding unintended consequences.
SEMI’s 2026 U.S. Policy Strategy also highlights the importance of coordination with U.S. allies and partners, as well as continued support for public-private research partnerships. Semiconductor manufacturing relies on a global network of specialized materials, equipment, and expertise, and policies that are aligned internationally help strengthen supply chain resilience, protect shared security interests, and preserve U.S. competitiveness.
“SEMI’s approach is grounded in partnership,” said Joe Stockunas, president of SEMI Americas. “Our members are investing in the United States at historic levels, bringing thousands of good-paying, skilled jobs to communities across the country. Clear rules, predictable incentives, and coordinated policy execution give those investments the best chance to succeed. We look forward to continued collaboration with policymakers to ensure the U.S. semiconductor ecosystem remains strong, resilient, and globally competitive.”
The SEMI 2026 U.S. Policy Strategy positions the industry as a constructive partner in advancing policies that support economic growth, innovation, and national security. Through collaboration, credibility, and consistentengagement, SEMI is working to ensure that the next phase of U.S. semiconductor expansion delivers lasting benefits for the broader economy.
Visit SEMI Global Advocacy to learn more about public policy efforts and developments.
27 January 2026 (Andover, UK) – Connexion Technologies has announced a strategic partnership with OMR Italia, a leading provider of PCBs into the European market, with over 50 years’ experience in manufacturing and supplying boards based near Milan. The collaboration expands Connexion Technologies’ European reach and enhances its advanced PCB offering for customers across the region.
Together, Connexion Technologies and OMR Italia will combine more than 50 years of OMR’s PCB engineering expertise with Connexion’s strong UK manufacturing capabilities. The partnership will create a more competitive and resilient PCB supply chain for European customers, offering local support, high reliability, and faster turnaround times. This follows Connexion Technologies’ 2025 acquisition of Exception PCB, further strengthening its position as a European leader in PCB supply.
“Our partnership with OMR Italia demonstrates our commitment to investing in world‑class capabilities and providing long‑term value to customers across Europe,” said Craig Wright, Chairperson & CEO of Connexion Technologies. “OMR shares our dedication to quality, innovation, and engineering integrity—values that have driven the success of both businesses.”
Through this collaboration, OMR customers will benefit from Connexion Technologies’ wider group capabilities, including semiconductor packaging, PCB assembly, electro‑mechanical engineering, and RF systems. The partnership also supports Connexion’s goal of building stronger global supply chains and expanding its European operations.
Craig Wright added:
“The OMR business is an excellent cultural and operational fit with our own. With its large footprint and outstanding reputation among world‑leading blue‑chip customers across mainland Europe, we aim to nurture and grow these relationships alongside OMR’s strong engineering and operational teams.”
This partnership marks another key milestone in Connexion Technologies’ growth journey, reinforcing its position as a trusted European partner for advanced manufacturing and engineering innovation.
About Connexion Technologies
Connexion Technologies is the UK’s largest independent provider of advanced electronic and mechanical solutions for high‑reliability industries including aerospace, defence, life sciences, energy, and communications. With state‑of‑the‑art facilities across the UK, the company delivers expertise spanning electronic design, manufacturing, mechanical engineering, microelectronics, RF technology, and supply‑chain solutions.
As one of Europe’s largest OSATs, Connexion Technologies provides electronics solutions including semiconductor packaging, advanced bare PCB manufacturing, precision machining, and RF component and subsystem supply. The company continues to invest in people, processes, and technology to deliver quality, reliability, and performance for customers where it matters most.
Connexion Technologies is part of Wright Industries, a UK sovereign‑owned group comprising: Custom Interconnect, Accura Engineering, Exception PCB, Castle Microwave and Pure PCB.
The group employs more than 470 people and exceeds £90m in annual revenue.
About OMR Italia
OMR Italia is a trusted European specialist with over 50 years of experience in the world of high-reliability printed circuit boards (PCBs), specialising in customised and technologically advanced solutions. Founded in 1974 and based in Concorezzo (MB), OMR stands out for its strong technical know-how, consultative approach, attention to quality and ability to support customers during the most critical phases of a project, from technical definition to supply.
Leoben, January 22, 2026 – AT&S AG continues its strong growth path in the new year. Given the continued strong order situation and numerous major projects won in recent months, the company is investing massively in the infrastructure of the Leoben site. Following the successful commissioning of the state-of-the-art competence center for R&D and IC substrates production in summer 2025, AT&S is launching the next phase of its site offensive: With an investment volume in the mid-single-digit million range, the capacities in the existing printed circuit board plants will be comprehensively expanded and modernized.
AT&S is on the upswing
“After a challenging year and a half, things are looking up again,” says Michael Mertin, CEO and Chairman of the Management Board of AT&S. “The driver is artificial intelligence. It is therefore crucial to invest boldly in our own capabilities, especially in a challenging global economic environment.” Mertin adds: “Our decision to consistently expand production in Leoben-Hinterberg is a clear commitment to quality and a strategic step towards securing our technological sovereignty and our ability to supply our customers in the long term.”
Cleanroom area tripled
The key facts: the cleanroom area, which is essential for high-tech production, at the main plant in Leoben will be tripled from 760 to 2,300 square meters. As this new cleanroom extends over two floors, the elevator system and staircase will also be built using cleanroom technology. In addition, the quality of the cleanroom will be raised by one quality class to ISO6. Office, storage and logistics areas will also be converted. The expansion should be completed by summer 2026. “The conversion includes state-of-the-art production facilities and optimized logistics processes that will take the site to the next technological level,” says Barbara Decker-Schlögl. As Senior Director Operations and the new site manager, she is coordinating all activities with her team. “We are significantly increasing our capacities. We owe this expansion to a consistently strong order situation for special embedding products and it is a huge vote of confidence in the expertise of our team.”
AT&S CEO Mertin also refers to the increase in production staff. “In the fall, we announced 150 new jobs in Leoben and the feedback was great. With our IC substrates as essential components for new cloud and AI applications and our renowned expertise in highly developed printed circuit boards, AT&S is ideally positioned globally and here in Austria.”
AUSTIN, Texas – January 22, 2026 – CELUS, developer of the leading AI-assisted electronics design platform used by developers and engineers globally, and Atlantik Elektronik, a leading distributor and design-in specialist for innovative electronic and semiconductor components, today announced a strategic partnership aimed at streamlining and accelerating the hardware design process for engineers globally.
This collaboration is a significant step forward in integrating design intelligence with AI technology into the core of electronic distribution, engineering and design services. Under the agreement, users of Atlantik Elektronik's design services can now seamlessly start their development journey by leveraging the CELUS Design Platform. Furthermore, customers who are part of Atlantik Elektronik’s distribution and partner network can dramatically accelerate their product and component selection by utilizing the CELUS Design Platform’s intelligent component matching and project generation capabilities.
"At Atlantik Elektronik, we recognize that the best path to enabling our customers to achieve a market-leading position is through access to the most innovative technologies, shortened design cycles and faster time to market," stated Christian Flach, COO of Atlantik Elektronik. "Integrating the CELUS Design Platform into our ecosystem further assists us in achieving these goals while offering immense value across multiple aspects of our business. From component selection and engineering support to enhancing our overall design services offering, this partnership ensures our clients stay ahead in a rapidly evolving technological landscape."
The CELUS Design Platform bridges the engineering workflow with reliable component implementation by focusing on three foundational elements: enabling engineers to capture their design intent; providing the necessary information effectively; and guiding engineers through the journey of discovery based on their requirements. Rather than suggesting parts in isolation, CELUS supports engineers with complete circuit context ensuring that design decisions are both fast and sound.
"We are incredibly excited to be working with Atlantik Elektronik to truly transform how hardware is designed and further fortify the AI hardware design revolution," said Rob Telson, Vice President of Global Sales at CELUS. "Atlantik recognizes the shifting demands of the electronic component industry and the need for advanced tools to meet market acceleration. By combining Atlantik’s deep expertise and extensive distribution portfolio with the power of the CELUS Design Platform, we are enabling customers to achieve unparalleled speed and efficiency in their projects.”
Atlantik Elektronik partners with leading global technology companies to provide customers with a comprehensive range of products and services that support the development of innovative electronic design. With a portfolio of products and solutions including audio ICS, microcontrollers, displays, network technologies, embedded modules, power supplies, sensors, connectors, fuses, wireless modules and more, Atlantik Elektronik’s nearly half a century of market leadership helps customers combine and integrate the ideal components to greatly reduce time to technology and time to market while delivering significant reduction to the total cost of ownership.
Europlacer, a global leader in flexible SMT assembly solutions, has received a 2025 Service Excellence Award (SEA), marking the 12th year in a row the company has been honored. The award, presented to Technical Service Manager Scott Huffman by Mike Buetow – President of PCEA, recognizes Europlacer’s high standards in Pick & Place and Printer service.
The Service Excellence Awards, now in their 33rd year and sponsored by CIRCUITS ASSEMBLY, are based entirely on feedback from customers. Companies are evaluated on areas such as reliability, responsiveness, ease of use, manufacturing quality, and overall value.
Scott Huffman, Technical Service Manager for Europlacer Americas said:
"Receiving the Service Excellence Award is a great recognition of the commitment our service team shows every day. As service engineers, we are on the front line with our customers, and our priority is always to keep their production running smoothly. This award reflects the trust our customers place in us and the teamwork behind every successful service delivery."
Craig Brown, Europlacer Americas Sales Director, added:
"We are delighted to receive this award, as it reflects the consistent level of support and attention we aim to provide our customers - from initial contact and throughout the life of their equipment."
This 12th consecutive award highlights Europlacer’s continued focus on service and support, a key part of the company’s approach to working with electronics manufacturers worldwide.
OSAKI, JAPAN – Rohde & Schwarz has opened a new larger office in Osaki, Japan, with increased capabilities, to deliver an innovation advantage for the Japanese automotive community.
The new location, which replaces the original one in Shinjuku, has significantly enhanced facilities for service, repair, calibration and engineering support of test equipment as well as increased space for hosting customer events.
Munich/Osaki, - At the new office Rohde & Schwarz hosts demonstrations developed in collaboration with leading automotive industry partners. Noashi Saito, General Manager of Rohde & Schwarz Japan commented, “We are very proud of our new facility in Osaki, and we invite the Japanese automotive community to make the most of this resource and the talented staff who work here.”
EMC measurements under dynamic driving conditions with AIP Automotive
The electromagnetic emissions of vehicles, particularly EVs, change significantly depending on their operational state. Therefore, to get a true understanding of the EMC performance of an electric vehicle, it is essential to test it under dynamic driving conditions. A test system that combines EMC receivers and automation software from Rohde & Schwarz with the AIP EMC Chassis Dynamometer enables vehicle manufacturers and Tier 1s to obtain an evaluation of the EMC performance of their designs under realistic operational conditions. AIP has enhanced this system with R&S radar target simulators to also provide vehicle-in-the-loop testing of radars in a controlled environment. The new R&S office in Osaki has a dedicated space for calibration of EMC equipment and is near AIP’s new office, enabling fast servicing and support turnaround time for AIP.
Rohde & Schwarz strengthens in vehicle network compliance testing in Japan with GRL and Analog Devices
Rohde & Schwarz is further expanding its collaboration with Granite River Labs (GRL) and Analog Devices, Inc. (ADI) to support in-vehicle network compliance testing in Japan. GRL, a provider of compliance test and certification services for standards like multigigabit Ethernet and Automotive SerDes Alliance (ASA), has a history of utilizing Rohde & Schwarz test equipment. ADI, a global semiconductor leader, is working closely with Rohde & Schwarz globally to advance the adoption of the emerging OpenGMSL™ standard via the OpenGMSL Association.
The collaboration is supported by Rohde & Schwarz Japan's new expanded facilities and the availability of leading-edge oscilloscopes and vector network analyzers, designed to ensure fast and reliable standards-compliant testing, including solutions specifically tailored for the Japanese market. This will accelerate testing processes and facilitate the building and delivery of OpenGMSL-based solutions. The availability of local expertise and instruments is considered critical in supporting the global automotive ecosystem.
IPG Automotive and Rohde & Schwarz enhance autonomous driving radar testing capabilities
IPG Automotive, a leader in virtual test driving, partners with Rohde & Schwarz to integrate Automotive Radar Hardware-in-the-Loop (HIL) testing from the proving ground into the development lab. The collaboration combines IPG Automotive’s CarMaker simulation software with Rohde & Schwarz’s scalable AREG800A radar target simulator, the R&S QAT100 advanced antenna array, and the compact R&S RadEsT target simulator.
This combination provides vehicle manufacturers and Tier 1 suppliers with the ability to simulate ADAS/AD scenarios, including those defined in Euro NCAP, in a controlled, safe, time-efficient, and cost-reducing environment. In the expanded office facilities in Osaki both companies jointly set up and demonstrate HIL systems alongside the development of local traffic scenario simulations specific to Japan.
MediaTek and Rohde & Schwarz expand automotive NTN testing to Japan
The automotive industry is actively exploring non-terrestrial networks (NTNs) to provide ubiquitous wireless connectivity for always-connected vehicles. The capabilities of pioneering chipset developer MediaTek’s latest NR-NTN device have been demonstrated using the Rohde & Schwarz CMX500 radiocommunication tester, a versatile solution for testing various NTN technologies including NR-NTN, NB-NTN, and Direct-To-Cell (D2C, DTC). The CMX500 offers multiband and multi-orbit support, along with a dedicated NTN workspace for visualizing deployed networks and their parameters.
Rohde & Schwarz leverages its wireless and automotive expertise to help navigate the challenges associated with NTN, identify key vehicle components, and explain the role of testing in creating NTN-enabled vehicles. A global collaboration between MediaTek and Rohde & Schwarz, spanning Europe, North America, and China, is now expanding to Japan.
The office in Osaki will facilitate a greater number of projects for Japanese automotive partners, including faster support for local NTN projects with MediaTek. The R&S CMX500 empowers customers in Japan to test and optimize the entire NTN integration chain — from chipsets and modules to antennas, TCUs, and vehicles and validates NTN vehicle connectivity tailored to the Japanese market.
The new location, which replaces the original one in Shinjuku, has significantly enhanced facilities for service, repair, calibration and engineering support of test equipment as well as increased space for hosting customer events.
Munich/Osaki, - At the new office Rohde & Schwarz hosts demonstrations developed in collaboration with leading automotive industry partners. Noashi Saito, General Manager of Rohde & Schwarz Japan commented, “We are very proud of our new facility in Osaki, and we invite the Japanese automotive community to make the most of this resource and the talented staff who work here.”
EMC measurements under dynamic driving conditions with AIP Automotive
The electromagnetic emissions of vehicles, particularly EVs, change significantly depending on their operational state. Therefore, to get a true understanding of the EMC performance of an electric vehicle, it is essential to test it under dynamic driving conditions. A test system that combines EMC receivers and automation software from Rohde & Schwarz with the AIP EMC Chassis Dynamometer enables vehicle manufacturers and Tier 1s to obtain an evaluation of the EMC performance of their designs under realistic operational conditions. AIP has enhanced this system with R&S radar target simulators to also provide vehicle-in-the-loop testing of radars in a controlled environment. The new R&S office in Osaki has a dedicated space for calibration of EMC equipment and is near AIP’s new office, enabling fast servicing and support turnaround time for AIP.
Rohde & Schwarz strengthens in vehicle network compliance testing in Japan with GRL and Analog Devices
Rohde & Schwarz is further expanding its collaboration with Granite River Labs (GRL) and Analog Devices, Inc. (ADI) to support in-vehicle network compliance testing in Japan. GRL, a provider of compliance test and certification services for standards like multigigabit Ethernet and Automotive SerDes Alliance (ASA), has a history of utilizing Rohde & Schwarz test equipment. ADI, a global semiconductor leader, is working closely with Rohde & Schwarz globally to advance the adoption of the emerging OpenGMSL™ standard via the OpenGMSL Association.
The collaboration is supported by Rohde & Schwarz Japan's new expanded facilities and the availability of leading-edge oscilloscopes and vector network analyzers, designed to ensure fast and reliable standards-compliant testing, including solutions specifically tailored for the Japanese market. This will accelerate testing processes and facilitate the building and delivery of OpenGMSL-based solutions. The availability of local expertise and instruments is considered critical in supporting the global automotive ecosystem.
IPG Automotive and Rohde & Schwarz enhance autonomous driving radar testing capabilities
IPG Automotive, a leader in virtual test driving, partners with Rohde & Schwarz to integrate Automotive Radar Hardware-in-the-Loop (HIL) testing from the proving ground into the development lab. The collaboration combines IPG Automotive’s CarMaker simulation software with Rohde & Schwarz’s scalable AREG800A radar target simulator, the R&S QAT100 advanced antenna array, and the compact R&S RadEsT target simulator.
This combination provides vehicle manufacturers and Tier 1 suppliers with the ability to simulate ADAS/AD scenarios, including those defined in Euro NCAP, in a controlled, safe, time-efficient, and cost-reducing environment. In the expanded office facilities in Osaki both companies jointly set up and demonstrate HIL systems alongside the development of local traffic scenario simulations specific to Japan.
MediaTek and Rohde & Schwarz expand automotive NTN testing to Japan
The automotive industry is actively exploring non-terrestrial networks (NTNs) to provide ubiquitous wireless connectivity for always-connected vehicles. The capabilities of pioneering chipset developer MediaTek’s latest NR-NTN device have been demonstrated using the Rohde & Schwarz CMX500 radiocommunication tester, a versatile solution for testing various NTN technologies including NR-NTN, NB-NTN, and Direct-To-Cell (D2C, DTC). The CMX500 offers multiband and multi-orbit support, along with a dedicated NTN workspace for visualizing deployed networks and their parameters.
Rohde & Schwarz leverages its wireless and automotive expertise to help navigate the challenges associated with NTN, identify key vehicle components, and explain the role of testing in creating NTN-enabled vehicles. A global collaboration between MediaTek and Rohde & Schwarz, spanning Europe, North America, and China, is now expanding to Japan.
The office in Osaki will facilitate a greater number of projects for Japanese automotive partners, including faster support for local NTN projects with MediaTek. The R&S CMX500 empowers customers in Japan to test and optimize the entire NTN integration chain — from chipsets and modules to antennas, TCUs, and vehicles and validates NTN vehicle connectivity tailored to the Japanese market.