Press Releases

WALTHAM, MA – Nano Dimension Ltd. (Nasdaq: NNDM) (“Nano Dimension”, “Nano”, or the “Company”), a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (“AM”) 3D printing solutions, today announced that, in light of the ongoing war between Israel and the Hamas terrorists (the “War”), its Board of Directors (the “Board”) has cancelled the extraordinary shareholders general meeting (“EGM”) that was originally scheduled to convene on December 13th, 2023. The Board will consider rescheduling options for the EGM when the impact of the War on Nano’s Israeli workforce subsides.

When the EGM was initially announced on October 18th, 2023, the expansive nature and depth of the War was not yet clear. While Nano continues to believe that its financial performance during fiscal 2023 and beyond will not be affected by the War, its staffing across critical corporate functions (not including sales and marketing) will be impacted as individuals within Nano’s workforce are called to join the War effort. The recruitment of reserve duty in Israel currently includes approximately 15% of Nano’s local workforce.

As previously announced, Nano Dimension remains confident in its outlook for fiscal 2023 and expects to deliver its strongest year yet in terms of organic growth. The Board and the Company’s management team continue to take actions against the backdrop of the War-driven constraints outlined above.

The impact on organizational capacity should be considered in the context of two ongoing developments this quarter, beyond the sales & marketing and customer support campaign:

First, and fortunately, Nano Dimension hopes to have a strong quarter in terms of revenue, translating to many instances of high value promises to its customers and significant demands on all support functions to fulfill them.

Second, as previously announced, this quarter Nano’s management is preparing for Q4/2023 and 2024 goals of “Right-Shaping–Profitability Focus”. This is a major corporate transition that will include the adoption of programs that consume the efforts of finance and operation personnel, in addition to closing the reporting of the third quarter of 2023 and the fiscal year 2023.

Yoav Stern, CEO of Nano Dimension, commented: “While we operate in 6 countries across the globe, support for our Israeli colleagues and execution of our strategic plan must take priority. Prioritizing our effort during this special circumstance means that the time-consuming preparation for a December 2023 EGM is not currently in the best interest of the Company and its shareholders. Nano is performing during the War – without compromising business results. With approximately 15% of our colleagues serving in uniform for Israel’s armed forces during this tragic war, we see no other way to fulfill our primary responsibility of delivering on customer promises as we continue our effort to drive record results, other than to focus exclusively on execution. Hence, the December EGM is cancelled.”

CAMBRIDGE, UK – Ensuring that sensitive electronic components are not adversely affected by radiated electromagnetic interference (EMI) is an essential part of circuit design. Where compactness and close component proximity are a priority, such as in smartphones and smartwatches, conventional board-level shielding with metallic enclosures is increasingly being replaced with conformal package-level shielding. This approach utilizes conductive coatings applied directly to semiconductor packages and, together with emerging deposition methods such as spraying and printing, creates new opportunities for functional materials.

When selecting a material for conformal package EMI shielding, a variety of factors need to be considered. Most important is the attenuation of incident electromagnetic radiation, which is a function of electrical conductivity and magnetic permeability. Often parametrized as shielding effectiveness (SE), higher values enable a thinner coating to be used, reducing weight and material consumption. Other material considerations include adhesion to the underlying epoxy molding compound of the package, thermal conductivity, density, chemical stability, and compatibility with the deposition method if solution processing.

Sputtered metal

Sputtering metal is a well-established incumbent technology for conformal shielding, in which high-purity blocks of solid metal are ablated and deposited with a beam of charged ions. Many conformal shielding coatings use multiple metal layers, easily achieved by switching sputtering targets. Cap and/or adhesion layers are typically made from titanium, chromium, or stainless steel, with the primary shielding layer typically being cheaper metals such as copper, aluminum, or nickel.

While sputtering is well established, there is still scope for innovation. One proposed strategy, inspired by optical anti-reflective coatings, utilizes destructive interference from a multilayer stack to increase the shielding effectiveness. However, this improvement is highly frequency-dependent, given the fixed material spacing.

Conductive inks

Depositing conductive materials from solution provides an alternative to sputtering, with much-reduced equipment costs since the process occurs under ambient conditions rather than a vacuum. A range of solution processing methods, including spraying and inkjet printing, have been developed for EMI shielding, with all requiring conductive ink. Despite the high metal price, silver inks currently dominate due to their high conductivity and chemical stability.

Although the underlying metal is the same, there is extensive scope for differentiation amongst conductive ink suppliers. Particle shape and size are key factors, with nanoparticles generally offering higher conductivity but requiring higher curing temperatures than flake-based inks. Particle-free ink, also known as molecular ink, is a compelling emerging alternative. Rather than a suspension of metal particles, the ink is instead a solution of organometallic species that are reduced in situ, producing a smooth metal layer. A key advantage of particle-free conductive ink is eliminating the risk of nozzle clogging, a significant factor for digital printing methods such as aerosol and inkjet that enable selective deposition. Another benefit is that they produce very smooth coatings, which can improve shielding efficiencies at high frequencies.


The ideal EMI shielding material would have high electrical conductivity, low density, flexibility to accommodate thermal expansion, tunable surface chemistry for adhesion, and solution processability. The emerging material class of MXenes, a family of two-dimensional inorganic materials composed of a few layers of transition metallic carbides, nitrides, or carbonitrides, fit this description. MXenes are thus the subject of both academic and commercial research for applications across electronics, including EMI shielding, with efforts currently being made to scale up production.

Comprehensive coverage

IDTechEx’s report “EMI Shielding for Electronics 2024-2034: Forecasts, Technologies, Applications” provides a detailed overview of the ‘EMI shielding for electronics’ market, with a more detailed assessment of the outlined materials classes along with nanocarbon-containing composites, metamaterials and combined thermal interface/EMI shielding materials. Innovations that will support the increasing adoption of heterogeneous integration and advanced semiconductor packaging, along with the activities of key players, are evaluated. 10-year forecasts for both deposition method and conductive ink consumption are provided, drawing on consumer electronic device analysis to assess the semiconductor package area requiring conformal shielding. Forecasts are segmented across multiple application categories, including smartphones, laptops, tablets, smartwatches, AR/VR devices, vehicles, and telecoms infrastructure. For more information on this report, please visit, or for the full portfolio of related research available from IDTechEx please visit

WASHINGTON – The U.S. Partnership for Assured Electronics (USPAE) today announced that the Defense Business Accelerator (DBX) Microelectronics Challenge received twice the number of entries expected. Nearly two-thirds of the entrants are startups, and one-third are small- to medium-sized businesses.

All are vying for a chance at awards between $500,000 and $2 million to advance commercially viable microelectronics solutions.

“We are very excited by the quantity and quality of the DBX entries for innovative electronic technologies and materials,” said Nathan Edwards, USPAE executive director. “This program helps advance solutions that will have commercial and defense applications while further strengthening the U.S. electronics industry.”

In a few weeks, finalists will be notified and invited to pitch their solutions at the Defense TechConnect Innovation Summit & Expo in late November.

“Defense TechConnect draws leaders from private industry, investment and government to accelerate state-of-the-art technology solutions,” said Matt Laudon, vice president of the TechConnect Division at ATI. “The DBX project is a great example of how new approaches can leverage innovation hubs to achieve great success.”

The innovative DBX program brings together the electronics industry expertise of USPAE with the Department of Defense’s (DoD’s) Manufacturing, Capability Expansion, and Investment Prioritization Directorate (MCEIP) to award funding through a process meant to accelerate the development of commercial solutions that the DoD can then leverage.

SUZHOU, CHINA – Ventec International Group Co., Ltd. (6672 TT) will once again team up with partner Taiyo to promote the synergy between Ventec’s substrate materials and Taiyo solder masks, at Productronica 2023, Munich November, 14-17 in Hall B3, Booth 242.

Show highlights include Ventec’s new Battlam materials portfolio for advanced battery-management applications, alongside high-performing RF materials for cutting-edge wireless systems. Ventec will also showcase Ventec Giga Solutions, its new cooperative venture for turnkey workflow solutions.

Together, Ventec and Taiyo present a PCB materials one-stop shop, where customers can source high-performing Ventec laminates and prepregs from ranges such as tec-speed for communication and backplane and tec-thermal for power and lighting. In addition to Taiyo’s solder masks, available in a full range of colors, the one-stop shop can also supply a full range of copper foils, thermal interface materials, standard FR4, and special materials including flex-rigid and ultrathin.

"Productronica visitors can see how our Battlam and RF curated portfolios help customers quickly identify the right materials for their application and get to market ahead of the competition,” said Mark Goodwin, COO, Ventec International Group. “We will provide a second helping of the refreshing formula we established at electronica 12 months ago, as we again team up with Taiyo. This time, we will also highlight the value-add from our new Ventec Giga Solutions division to conceive, commission, and support highly automated PCB manufacturing capacity. It’s a service we expect to find growing demand as the industry moves to increase the resilience of its supply chains.”

Ventec’s Battlam portfolio contains hand-picked high-performing substrate materials that offer optimal parameters for applications in automotive, aerospace, and industrial sectors including utility-grade energy storage. The materials include polyimide-based, halogen-free, low-CTE, and CAF-resistant substrates, as well as unclad laminates, used everywhere from terminal plates to BMS circuitry.

The advanced tec-speed radio frequency material portfolio serves state-of-the-art communication, aerospace, and scientific applications including 5G infrastructure and terminal equipment targeting 3GPP upper and lower frequency ranges. Leveraging Ventec’s expertise in PTFE, with its excellent molecular properties, tec-speed steps up wherever high signal speed, low loss, and environmental robustness are needed.

Ventec's experts will be present throughout the event to explain the products and services available, including Ventec’s unique, wholly owned supply chain that safeguards product integrity and delivery performance. All Productronica visitors are invited to visit the booth, B3.242, to experience firsthand the latest innovations.

Further information about Ventec’s solutions and the company’s wide variety of products is available at

TOKYO – TOPPAN Holdings Inc. (TYO: 7911) (TOPPAN Holdings) and TOPPAN Group companies TOPPAN Inc. and TOPPAN Digital Inc. will join FPT Techday 2023, which is due to be held in Hanoi, Vietnam, on October 24 and 25.

FPT Techday 2023 is a technology forum organized by FPT Corporation (FPT), a leader in the Vietnamese ICT industry. Until now it has been an event dedicated to presenting FPT’s solutions, but on the occasion of the 35th anniversary of the company’s founding, external companies based outside Vietnam have been invited to take part for the first time. The TOPPAN Group is one of 10 overseas companies to have been selected.

Last year’s FPT Techday attracted more than 10,000 visitors, including representatives of the Vietnamese government and executives from Vietnamese and overseas companies. The event is expected to see an even greater number of attendees this year.

Vietnam has many factory complexes, and multiple new large-scale industrial parks are scheduled to open. Smart factories and digital transformation (DX) of manufacturing are required to address issues related to electrical power and the environment. The TOPPAN Group has thus far rolled out a range of manufacturing DX solutions, predominantly in Japan, and now aims to deliver those solutions to the Vietnamese and Southeast Asian markets.

Main solutions on show

The TOPPAN Group will present its solutions in the Manufacturing corner. Taking the theme of “Empowering Factory Management,” the main features will be the Manufacturing Digital Twin concept, which envisages use of digital twins in factories, and e-Platch™, a smart inspection support service. e-Platch™ makes use of the low-power wide-area network (LPWAN) protocol ZETA and is equipped with a visualization app specialized for remote monitoring and data collection from measurement devices dispersed throughout factories and other facilities.

1) Display of Manufacturing Digital Twin concept

To showcase its efforts targeting the use of digital twins in factories, the TOPPAN Group will present a demonstration featuring a 3D model of a real manufacturing area and screen a video explaining the concept for its use. This involves instantly collecting and analyzing large volumes of data from production equipment, ZETA-compatible sensors, and other IoT devices, and using the TOPPAN Group’s high—definition virtual expression technologies to produce a highly realistic reconstruction of a manufacturing setting in a metaverse space.

The concept that the TOPPAN Group will present targets enhanced productivity through remote real-time monitoring and 3D positioning/line construction simulation. It also aims to raise worker performance through training in virtual spaces and operational assistance on the manufacturing floor, and to create a digital value chain connecting manufacturing locations throughout the world.

2) e-Platch™ smart inspection support service employing LPWAN ZETA

e-Platch™ is a comprehensive monitoring system that drives automated collection of environmental data at factories and enables enhanced risk management. Employing ZETA, an LPWAN protocol, makes it possible to establish wireless communication networks in locations such as factories and warehouses where it has previous been challenging to do so.

Automated data collection is enabled by a solution for automated reading of analog meters using magnetic sensors, by ZETA-compatible sensors (humidity, illuminance, CO2 concentration, water leakage, water level, sound, etc.), or by retrofitting ZETABOX™ to existing measurement devices that have industrial interfaces (4-20mA/RS-485/dry contact). This means that e-Platch™ can be implemented easily, without the need for large-scale construction work or investment.

WALTHAM, MA – Nano Dimension Ltd. (Nasdaq: NNDM) (“Nano Dimension” or the “Company”), a leading supplier of Additively Manufactured Electronics and multi-dimensional polymer, metal & ceramic Additive Manufacturing 3D printers, today announced that it will hold an Extraordinary General Meeting of Shareholders (the “EGM”) on December 13th, 2023, at which shareholders will be asked to approve compensation for the Company’s Directors, including the Chairman of the Board and Nano Dimension’s Chief Executive Officer. In addition, Nano Dimension today announced the continuation of its corporate governance enhancements to further align the Company’s profile with gold standards and best practices based on shareholder feedback and input from governance experts, Institutional Shareholder Services and Glass Lewis, prior to the previous Annual General Meeting on September 7th, 2023.

As part of setting the board to be efficient and effective, Nano Dimension has followed ISS recommendations from March and September 2023: Igal Rotem and Amit Dror are stepping down from the Board effective immediately as part of a planned transition. Amit Dror will also resign from his position as Customer Success Officer.

With these changes, Nano Dimension’s Board has been reduced, since September 2023, from nine to seven directors, with all six non-executive directors being independent.

These changes follow the previously announced separation of the Company’s Chairman and CEO roles, under which independent director Dr. Yoav Nissan-Cohen was appointed Chairman of the Board, as announced on September 15th, 2023.

Yoav Stern, CEO of Nano Dimension, commented, “We intend to continue corporate governance enhancements with refreshed Board composition and Board rightsizing, as well as recruiting unique and highly qualified additions to our present leadership. Our new Chairman, Dr. Yoav Nissan-Cohen, is already highly effective in helping us prepare the Company’s board leadership for the years to come. And we have more improvements planned, most of them aimed to fulfill our main goal: Supporting long term shareholders’ interests.”

Dr. Nissan-Cohen added, “Over the past few months, we have made important changes to our Board to promote independent oversight. Today’s announcement is a continuation of these efforts, as we have considered feedback from our shareholders and independent governance experts. Separately, as part of our effort, Mr. Rotem has left the Board, and I would like to thank him for his contribution over the last 18 months.”

Mr. Stern concluded, “This is an opportunity for all of Nano Dimension’s teams since it is inception in 2014, and me personally, to thank a very special individual, Mr. Amit Dror. He is the co-founder of the Company and its previous CEO. Amit is a visionary and a relentless leader and entrepreneur. His strength and commitment over so many years is part and parcel of what Nano Dimension’s spirit is today. Thank you, Amit. You will always be a part of Nano Dimension, and vice versa.”

Additional Information Regarding the EGM

The EGM will be held December 13th, 2023 at 16:00 p.m., Israel time at the Company’s headquarters in Israel and the following items will be put to a vote:

  1. Approval of cash annual fee for all non-executive directors as of October 1st, 2023.
  2. Approval of a compensation package for the Company’s Chairman of the Board, Dr. Yoav Nissan-Cohen, as of September 13th, 2023.
  3. Approval of a compensation package for the Company’s Chief Executive Officer, Mr. Yoav Stern, as of January 1st, 2024.

The Company’s proxy statement will be mailed to all ADS holders in due course following the November 8th, 2023, record date and will contain any properly presented agenda items from shareholders.

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