WALTHAM, MA -- Nano Dimension Ltd., a digital manufacturing leader, today announced the appointment of Mr. Ofir Baharav as its new Chief Executive Officer, effective immediately. This strategic move underscores the Company's commitment to swiftly realizing merger synergies, restoring profitability, and delivering substantial shareholder value.
The Board of Directors, having worked closely with Mr. Baharav as Chairman, recognized his unique qualifications. Mr. Baharav has a proven track record in transformation and innovation, along with a deep background in capital equipment for the electronics industry and additive manufacturing, 3D printing technologies, making him the ideal candidate to lead Nano Dimension through this pivotal phase.
“Mr. Baharav’s proven ability to drive strategic change and operational efficiency is precisely what Nano Dimension needs at this critical juncture,” stated Robert Pons, Nano Dimension new Chairman of the board of directors, “His deep industry expertise and leadership will be instrumental in navigating the integration, achieving rapid profitability, and delivering significant value to our shareholders.”
Mr. Baharav brings nearly three decades of experience in capital equipment, spanning additive manufacturing and electronics. His prior roles as CEO of Maxify, VP Products at Stratasys, CEO at Xjet, EVP Products at Credence Systems, and President at Optonics, demonstrate a consistent pattern of driving strategic vision, technological innovation, cost optimization, and accelerated growth.
Driven by a passion to build disruptive manufacturingtechnology organizations, but also the capabilities to drive necessary transformation, Mr. Baharav has already stewarded significant changes since becoming Chairman on December 15th, 2024, including:
Strategic Realignment: Refocused R&D and sales on products and services where the Company can innovate, maintain long-term competitiveness, and partner with customers in the fabrication of high-value, high-performance applications.
Cost Reduction: Implemented immediate measures to reduce G&A expenses, which are expected to deliver over $20 million of fully annualized savings by year-end; with further reductions expected from post-merger operational consolidation
High-impact Negotiations: Successfully negotiated with CFIUS to remove restrictive limitations on post-merger cost reductions and synergy realization, enabling the company to achieve projected operational efficiencies.
Governance Enhancement: Initiated amendment proposals to the Articles of Association (pending shareholder approval) along with removal of poison pill to better align with shareholder interests, which reinforces transparency and accountability.
Operational Optimization: Streamlined and relocated field operations to enhance sales in the U.S. and China, improving market penetration and customer responsiveness.
Accountability and Transparency: Implemented comprehensive performance metrics and reporting systems, ensuring clear accountability and data-driven decision-making.
“We are confident that Mr. Baharav’s leadership will drive the rapid and decisive actions necessary to achieve profitability and refocus the company,” said David Stehlin, a Board Director, “His combined expertise in electronics and additive manufacturing is uniquely suited to our strategic direction, ensuring we capitalize on the significant opportunities ahead.”
The board wishes to thank Mr. Julien Lederman for his strong leadership and execution having stepped into the role of Interim CEO in the most challenging of times with both board and management completely afresh. As Nano Dimension’s Chief Business Officer, Mr. Lederman will be leading the corporate transformation with a strategic focus on post merger integration, communications, investor relations, along with spearheading a systematic operational planning and performance tracking framework to drive organizational excellence and accountability.
“It is a privilege to lead Nano Dimension in creating value for shareholders, working with a talented cohort of colleagues and partnering with industry leading customers. Nano Dimension, which now includes Desktop Metal and is expected to include Markforged, is composed of exciting opportunities to build an enduring digital manufacturing leader. Strategic integration efforts and transformations are underway, creating an exceptional company - one with a sustainable business model built upon innovative technologies focused on high value applications for digital manufacturing that will deliver financial results. I want to thank Mr. Lederman for his leadership during this time, and I look forward to working closely with him.”
Mr. Zivi Nedivi, President, and Mr. Tomer Pinchas, Chief Financial Officer and Chief Operating Officer are departing the Company. Mr. Baharav has resigned from the Board, while Robert Pons, a director since December 2024, becomes Chairman of the board.
About Nano Dimension
Driven by strong trends in onshoring, national security, and increasing product customization, Nano Dimension (Nasdaq: NNDM) delivers advanced Digital Manufacturing technologies to the defense, aerospace, automotive, electronics, and medical devices industries, enabling rapid deployment of high-mix, low-volume production with IP security and sustainable manufacturing practices.
HUIZHOU, CHINA – Tom Yang, CEO of CEE-PCB, is pleased to announce the appointment of Fred E. Hickman III as Vice President of Sales for North America. A seasoned industry leader with over 40 years of experience, Hickman has built a reputation for delivering exceptional customer experiences. His expertise spans technical sales, customer engagement, and strategic business development, making him a trusted partner for OEMs seeking cutting-edge PCB solutions.
"Fred brings the talent, experience, and reputation we need as we continue to expand our North American technology sales operations," said Tom Yang, CEO of CEE-PCB. "His deep industry relationships and commitment to customer success align perfectly with our mission to be themost caring, helpful, and attentive PCB provider in the world. We are confident that Fred will play a key role in driving growth and strengthening our presence in North America."
Hickman expressed his enthusiasm for joining the company: "CEE-PCB is exactly the kind of company I have been searching for at this stage of my career. I am highly selective about the PCB solutions I bring to my customers, and I am confident that CEE- PCB can provide the comprehensive, high-quality solutions they need to succeed."
About CEE-PCB
Huizhou CEE Technology Inc. (Stock Code:002579), founded in 2000, provides a one-stop service from professional R&D to sales and manufacturing. Our offerings include a comprehensive suite of products such as rigid printed circuit boards (RPCB), flexible printed circuit boards (FPC), rigid-flex printed circuit boards (R-F) and flexible printed circuit assembly (FPCA). With three state-of-the-art factories located in key industrial hubs, we are recognized as a key high-tech enterprise under the National Torch Program, hold the position of Vice Chairperson in the China Printed Circuit Industry Association (CPCA) and contribute as one of the industry standard setters.
Dr. Patrick Valentine, Technical & Lean Six Sigma Manager and Six Sigma Master Black Belt, announces the completion of Lean Six Sigma Black Belt training by 4 members of Uyemura’s professional staff. They are: Field Service Engineer, Juan Garcia; Quality Assurance Manager, Joanna Rafalowicz; Director of Operations, David Liston, and Analytical Chemist, Matthew Natelli.
Six Sigma certification demonstrates a deep understanding of statistical analysis, problem-solving, and project management. It signifies an individual's ability to lead process improvement initiatives, drive change, and deliver measurable results. Black Belt is the program’s highest certification level.
Uyemura International Corporation, 240 Town Line Road • Southington, CT 06489. (800) 243-3564. www.uyemura.com.
CEE PCB, a leading manufacturer of printed circuit boards (PCBs) and flexible printed circuits (FPCs) with 3 production facilities in China, is expanding its presence in Europe and will offer local support starting March 2025. With 25 years of experience in the industry, the company is enhancing its commitment to European customers by providing more direct collaboration for technical inquiries and advice. Markus Voeltz, an experienced sales professional with over 20 years of experience in the PCB/FPC and EMS industries, will head the new European branch. He will be the direct contact for customers and prospects across various industries, offering tailored solutions and support.
CEE PCB is known for its comprehensive product range, which includes multilayer PCBs with up to 30 layers, HDI PCBs, and flexible printed circuits. The company delivers high quality solutions for a wide range of applications, from prototype development to mass production. Notably, CEE PCB is highly flexible and able to handle both small and medium batch sizes efficiently. The company is certified not only to ISO 9001 but also to the demanding standards of IATF 16949 and ISO 13485, which are particularly important in the automotive and medical technology sectors. These certifications ensure a robust quality management system that meets the highest industrial standards.
“The decision to offer direct support in Europe is another step toward serving our customers even faster and more effectively,” says Tom Yang, CEO of CEE “Our long-standing experience and extensive product portfolio, combined with our local presence, allow us to address the specific needs of our customers more directly.” With this expansion, CEE PCB reinforces its ambitions to strengthen its market position as a reliable partner for PCB and FPC solutions while enhancing its proximity to European customers.
About CEE PCB
CEE PCB is a leading manufacturer of printed circuit boards (PCBs) and flexible printed circuits (FPCs) with 25 years of successful international operations. With three production facilities and a team of over 5,000 employees, CEE PCB provides high-quality solutions for a wide range of industries, including automotive, medical technology, telecommunications, and consumer electronics. The company offers innovative manufacturing technologies and comprehensive consulting, covering everything from prototype development to mass production.
MULINO, OR – ASC Sunstone Circuits, a leading provider of high-quality printed circuit board (PCB) manufacturing services, is pleased to announce the promotion of Jan Neill to the position of Business Development Manager. Neill joined ASC Sunstone Circuits in 2021 as a member of the Inside Sales team, where she quickly became known for her strong customer relationships, in-depth product knowledge, and unwavering commitment to service excellence. Over the past few years, she has played a key role in helping customers navigate PCB quoting, ordering, and production, ensuring seamless experiences and contributing to ASC Sunstone’s strong reputation in the industry.
In this new role, Neill will focus on expanding ASC Sunstone’s customer base, developing new business opportunities, and strengthening partnerships across key markets. With a passion for innovation and a deep understanding of customer needs, she will be instrumental in driving growth and bringing strategic value to both new and existing clients.
“We are thrilled to see Jan step into this role,” said Matt Stevenson, VP & General Manager at ASC Sunstone. “This promotion reflects her outstanding performance, dedication to our customers, and the leadership potential we’ve long seen. We’re excited about the energy and insight she brings to the Business Development team.” Please join us in congratulating Jan on this well-deserved promotion.
About ASC Sunstone Circuits
Sunstone Circuits®, a leading PCB solutions provider, has delivered high-quality, on-time PCB manufacturing services for over 55 years. With a reputation built on outstanding customer service, industry-leading turn times, and a suite of design-to-manufacture support tools, ASC Sunstone continues to serve engineers and designers nationwide.
BIEL, SWITZERLAND - The consumer electronics industry is experiencing a remarkable transformation, propelled by rapid technological advancements and an increasing demand for compact, efficient, and multifunctional devices. Central to this evolution is 3D-MID (Three-Dimensional Mechatronic Integrated Devices) technology, which redefines design standards and drives innovation.
Understanding 3D-MID Technology
3D-MID technology integrates electronic and mechanical functions into a single three-dimensional structure. Unlike traditional printed circuit boards (PCBs), which are flat, 3D-Circuits (3D-MID) allows the incorporation of complex electronic circuits into compact designs. This approach not only enhances performance but also reduces space requirements.
Injection Molding: Thermoplastic materials are shaped through a molding process, enabling the creation of intricate components.
Laser-Direct Structuring (LDS): This technique employs lasers to define conductive paths on the molded plastic by activating specific areas for metallization.
Metallization: A chemical plating process deposits conductive materials like copper onto the activated areas, forming complex circuit patterns directly on the 3D component.
Final Assembly: The completed 3D-MID component is integrated with electronic parts, significantly reducing assembly time and potential failure points.
Advantages of 3D-MID in Consumer Electronics
Enhanced Integration and Miniaturization: 3D-MID enables the integration of multiple functions into a single component, minimizing device size and simplifying assembly.
Design Versatility: The technology allows for the creation of complex geometries that fit into unconventional spaces, fostering innovative designs that differentiate products in a competitive market.
Improved Performance and Reliability: Fewer connections and components reduce the risk of failure, while optimized designs enhance heat dissipation, crucial for high-performance devices.
Cost and Time Efficiency: Streamlining assembly processes and reducing individual components lead to lower manufacturing costs and shorter development cycles.
Environmental Benefits: Smaller components use less material, and a more efficient assembly process minimizes waste, contributing to sustainability efforts.
Real-World Applications of 3D-MID Technology
Action Cameras: Devices like GoPro integrate sensors and circuits into compact units, delivering high-definition capabilities in a rugged design.
Wearable Devices: Smartwatches and fitness trackers utilize miniaturized components to provide various health metrics elegantly.
Smart Home Devices: IoT products, such as smart speakers and thermostats, leverage 3D-MID for enhanced functionality and easier installation.
The Future of 3D-MID
As the demand for sophisticated consumer electronics grows, 3D-Circuit technology will become increasingly vital. It has the potential to tackle challenges like complex supply chains and rising production costs by centralizing functions within fewer components.
In conclusion, 3D-MID technology is transformative for the consumer electronics industry, paving the way for innovative designs that enhance consumer experiences. For more information on how 3D-MID can benefit your products, visit HARTING 3D-Circuits.
