G Series XRF is for analysis of precious metals, tin and nickel on PCBs, wafers, connectors and other electronic components.
Features bottom-up measurement using motorized z-axis with laser-based autofocus and precision video imaging. Manual x-y stage with 1.5” x 1.5" travel facilitates positioning of small and large parts. Configuration includes single fixed collimator, solid-state PIN detector, and long-life micro-focus x-ray tube. Components can include multiple collimators, a variable focal camera, or an SDD detector. Simultaneously measures up to five coating layers, 10 elements in each layer, up to 25 elements in all. Runs Xralizer software.