RO3003G2 high-frequency laminates provide radar sensor designers with improved insertion loss and reduced dielectric constant (Dk) variation.
Combination of resin and filler content, along with low-profile ED copper, translates to Dk of 3.00 @ 10GHz (clamped stripline method) and 3.07 @ 77GHz (microstrip differential phase length method). Show insertion loss of 1.3dB/in. for 5 mil. laminates as measured by microstrip differential phase length method. Reduce insertion loss via a very low-profile electrodeposited copper (VLP ED). Reduce dielectric constant variation through PCB processing as a result of homogeneous construction and incorporating VLP ED foil. Enable designs with denser/smaller diameter microvias, achieved by advanced filler system using small, rounded particles. Are available in standard panel sizes of 24 × 18" and 24 × 21" with 0.5oz. or 1.0oz. ED Cu foil and rolled Cu foil. Available in dielectric thicknesses of 0.005" and 0.010".