Printed Circuit Design & Fab Online Magazine - Design News

Products

HyperLynx printed circuit board simulation software now performs end-to-end, fully automated serializer/deserializer (SerDes) channel validation.

Read more: Mentor Upgrades HyperLynx Simulation Software

AC-7303 copper-clad laminate offers thermal conductivity of 3W/mK, a reported modulus 1/10 that of conventional materials, and flexible dielectric layer (after curing).

Read more: ToyoTech Offers AC-7303 Laminate

FAB 3000 v. 7 is CAM software runs advanced DRC/DfM verifications, generates component centroids, creates SMT stencil pads, panelizes PCBs, and performs other useful features.

Read more: Numerical Innovations Offers FAB 3000 v.7 CAM

RO4460G2 low-loss bondply has a 6.15 dielectric constant (Dk).

Read more: Rogers Introduces RO4460G2 Bondply

SiP-id software is said to reduce design iterations and improve throughput, reducing time needed to design and verify ultra-complex SiP packages.

Read more: ASE, Cadence Offer SiP-id FOCoS Software

OrCAD Capture Cloud, a free, web-based subset of the OrCAD Capture schematic design, is now integrated with Ultra Librarian, providing a cloud-based design tool that is fully scalable to a professional, production-ready printed circuit board design solution.

Read more: EMA Integrates OrCAD Capture Cloud, Ultra Librarian