Cupracid Flex and InPro Flex are designed for standard conformal flex applications.

Read more: Atotech Debuts Cupracid Flex and InPro Flex Conformal Plating Solution

tec-speed 20.0 high-frequency laminate and prepreg series is a ceramic-filled hydrocarbon thermoset material for such printed circuit board applications as cellular base station antennas, power amplifiers, LNB for broadcast satellites, automotive radar and RFID.

Read more: Ventec Launches tec-speed 20.0 High-Frequency Laminate and Prepreg

TWLS and TZA electrodeposited copper foils are now arsenic-free. All traces of arsenic have been removed from the treatment process.

Read more: Circuit Foil Luxembourg Upgrades TWLS, TZA ED CU Foils

XJTAG DFT Assistant free software interface for Mentor Xpedition Designer increases design for test and debug capabilities of the schematic capture and PCB design environment.

Read more: XJTAG Offers DFT Assistant Plugin for Mentor Xpedition