HDTF substrates can incorporate conductor multilayers.
Etchable gold thick film process for high-definition thick film circuitry is an alternative to thin films.
Neoganth W Pre Dip is for desmear and metallization (PTH) process step for fine-line HDI and package substrate applications.
V-One automated drilling attachment mounts directly on V-One PCB printer.
Library.io creates component outlines for Autodesk Eagle and 3D models that can be used with Fusion360 3D CAD and CAM design software.
FH63 series rugged FPC/FFC connectors offer high-heat resistance for harsh environment applications.