Synplicity Inc. has released new product capabilities for its Confirma ASIC/ASSP Verification Platform.
Confirma is an integrated prototyping package combining hardware and
software tools designed to help customers overcome ASIC verification
challenges. The Confirma Platform includes the company’s Certify tool, and the Identify Pro TotalRecall software, which reportedly provides full visibility into a design under test. The product also includes the company’s High-performance ASIC Prototyping System (HAPS), for prototyping PCBs.
According to Andy Haines, Synplicity marketing VP, “Nearly all of
today’s ASICs are being prototyped…by stitching together hardware and
software from different vendors. Going forward, we will continue to
offer a comprehensive, integration solution through our Confirma
Platform”
Trident Industrial Inkjet has announced the launch of its 256Jet-D
inkjet printhead. The printhead features durable stainless steel
construction that reportedly allows for printing of a variety of
direct-write printable electronic applications with up to five times
the resolution of screen printing.
The company reports that the product is designed for printing traces,
contacts, embedded passives and components on a PCB, as well as for the
printing of flexible photovoltaics, fuel cells and batteries in other
applications.
"As an additive process, inkjet is a very attractive option for direct
write, printable electronics," explained Steve Liker, Trident business.
"It allows manufacturers to print exactly the amount of material they
need, exactly where they need it, saving significant time and expense
when compared to subtractive printing methods that waste valuable
printing materials."
The 256Jet-D nozzle plate can reportedly be easily removed, cleaned and
reassembled, and users can purchase multiple interchangeable nozzle
plates to print different drop volume sizes using one printhead. The
product is available in two models, with drop volume ranges of 5 to 40
picoliters and 50 to 80 picoliters in size.
The printhead’s inert stainless steel construction has a claimed
resistance to the corrosive alkaline and acidic materials often used in
the deposition of printable electronic components. The printhead can
reportedly be heated to 70°C and jet fluids up to 30 cps, and print
materials with double the viscosity of traditional inkjet systems. The
product has a claimed lifespan of 90 billion firings.
Ansoft Corporation has released Nexxim v4, the company’s circuit simulation software, and Designer v4,
its integrated schematic and design management software. The company
reports that the products include statistical analysis and transient
simulation capabilities that allow engineers to simulate high-speed
serial channels, which reportedly eliminates prototype iterations that
require additional test equipment, and multiple spins that delay
time-to-market.
Nexxim v4 features VerifEye, a new methodology for eye analysis of
serial links using statistical methods that maintain accuracy while
offering reductions in run time as compared to other transient methods.
Designer v4 allows dynamic links to the company’s electromagnetic field simulation tools HFSS, SIwave and Q3D Extractor.
Camfil Farr has produced the MERV 8 30/30 (minimum efficiency reporting value) air filter, that claims to extend the productive service life of high-efficiency filters used in microelectronics and other cleanroom environments.
The product has a claimed low initial resistance, a low maintained resistance to airflow, and the lowest average pressure drop of any MERV 8 filter. The company promises a 25% increase in efficiency.
The filter reportedly has earned five stars on the ECI (Energy Cost Index) the industry's highest performance ranking, and can be used in cleanroom areas and support spaces. The product uses all mechanical filtration, rather than electrostatic, and maintains consistent, high removal efficiency throughout the filter’s life.
The filter is rated by Underwriters Laboratories as a Class 2 or 1 filter, and is available in 2” and 4” configurations.
The product also meets the requirements of the U.S. Green Building Council (LEED) in terms of efficiency, energy savings and reduced disposal impact.
Amkor Technology has announced the introduction of FusionQuad, a package technology designed for budget-conscious thermal performance applications.
FusionQuad is a leadframe-based, plastic package which integrates
bottom lands within a standard QFP package outline. The company claims
that the combination of peripheral leads and bottom lands allows for an
approximate doubling of I/O with an approximate 50% reduction in body
size for an existing lead count. Initial package options range from 100
to 376 I/O, in single and dual row bottom land configurations, and with
sizes ranging from 10 to 24 mm, at 0.8 mm thickness.
Agilent
Technologies’ Medalist x6000 PCB X-ray inspection system uses a digital image
reconstruction technique to diagnose solder-joint defects in PCBs.
Using
this Laminography technique, the company reports that PCBs can be examined by looking at
"slices" at various z-values above the board surface, with the image
in sharp focus for one plane of the board. Software then examines these
individual image slices for defects, and can also use them to build a
three-dimensional image of the entire board structure.
"Our
new approach eliminates the time required for z-movement and board settling
associated with laminography. With the architecture of the x6000, we completely
eliminated that step, improving test throughput, simplifying test-program
development, reducing the system's parts count, improving call performance by
ensuring that images are in focus, and improving system reliability,” commented
Jim Benson, product marketing engineer
"Overall
we believe that the new system architecture addresses present and future
inspection needs, just as laminography provided the best solution for
printed-circuit-boards' prior generation."
