Newark has developed an interactive online tool at that allows engineers to source the right connector by comparing images or by selecting a specific application or type.
The tool was developed in response to customer requests to find a specific connector when exact specifications were not available, and gives customers access to the company’s stock of over 163,000 connectors and 96 brands.
"It can be frustrating to find the right connector if you don't have a manufacturer's part number," comments Barry Litwin, of Newark. "Design engineers can now narrow their search by application or type, while maintenance customers can visually compare the connector… with an image [of the part]."
RBP Chemical Technology has introduced Layer Clean NP, a new acid, nonchelating, nonchloride cleaner that contains no phosphates. The company reports that the cleaner removes chromate conversion coating, fingerprints and oxides from copper laminate. When used prior to photoresist lamination, it reportedly reduces imaging defects by improving photoresist adhesion. Available in both spray and soak applications, the product provides claimed quick cleaning at low concentrations, is non-etching and suitable for use with very thin copper foils, and with a formula that cleans at low concentration.
According to Lattice Semiconductor Corporation, the tool, ispLEVER® 7.1 includes functional and performance-enhancing features like an FPGA Simultaneous Switching Output (SSO) Analyzer. FPGA designers can analyze and optimize I/O pin placement and output switching characteristics to minimize undesirable noise and ground bounce on a printed circuit board. The design tool claims to deliver up to 30% faster FPGA design compile times and can support multi-processor powered design compilation to achieve the fastest timing closure.
A power calculator allows FPGA designers to analyze and optimize power requirements early in the design process. The Lattice Power Calculator includes a user-friendly interface that enables power analysis at the block level and examination of "what-if" scenarios by changing design environment variables.
GreenData Manager is a desktop application that can be used to manage green compliance data and documents. It helps collect and manage the full range of green compliance data such as RoHS compliance status and certificates from suppliers, material composition substance data, MSL and peak temperature data for Pb-free manufacturing, and tin-whisker mitigation strategies. GreenData Manager will validate compliance information against EU RoHS, China RoHS, Korea RoHS, Halogen-Free, and even the recent Norwegian PoHS. It can report the compliance status on all parts or BOMs. It will provide validation on the required material composition substances for each component and aggregate the status to products or BOMs. It can determine if test reports or certificates need to be recollected.
The ST10-LC909 polyimide product is a claimed price competitive replacement for Thermount and Copper Invar Copper, and is used to control the thermal expansion of PCBs.
According to the company, the product closely matches ceramic and flip-chip type low coefficient of thermal expansion (CTE) components, and that a multi-layer board manufactured using polyimide and Copper Invar Copper or Thermount materials can be duplicated using layers of standard polyimide and ST10-LC909 embedded into the PCB. The process will reportedly match the CTE of an existing design, targeting a range from 9ppm/°C to 12ppm/°C, with a low Z-axis expansion.
Christopher Associates Inc. has announced its introduction of the Machvision Hole Doctor verification system for printed circuit fabrication applications. The company states that the product is an in line conveyor system for the inspection and verification of hole count, hole diameter, location accuracy and hole quality on rigid, microvia/HDI, and flexible PCBs, and can be used after drilling, desmearing and plating or for final inspection or QC.
The company states the system can be programmed using a “golden board” or drill files to inspect hole diameters from .006” - .400” and up to 16:1 aspect ratios on panels from .010” to .400” thick. Claimed defect inspections include plugged holes, improper hole diameters, poor drilling accuracy, and other critical parameters using an XP-based SPC software package.