Power Integrity Advance tool conducts EMC analysis and AC and DC power integrity analysis to help predict, analyze and control design issues that may cause problems later down the printed circuit board design process.

Read more: Zuken Announces Power Integrity Advance Tool

The DT series printed circuit board enclosure and header are designed to maintain the integrity and continuity of data and power signals in harsh environments; withstand dust, dirt, moisture and vibration. Thermoplastic enclosure accommodates a 5" x 6.5" PCB and features through-hole mounting flanges. Environmentally sealed snap in header features 90° molded in pins that mate with standard DT series plugs. Header is available in 12, 24, 36 or 48 cavity arrangements that accept size 16 contacts and 14-20 AWG wire.

LADD Industries, www.laddinc.com

DuPont 5064H screen printed silver conductor material is for printed electronics. Provides resistivity less than or equal to six milliohms per sq. per mil. Reportedly provides higher conductivity with thinner prints of conductor traces. Can be printed onto a variety of substrates, including Polyethylene Terephthalate, Polyethylene-Naphthalate, Kapton polyimide films, and paper. Is solvent-based and designed to be screen printed in semiautomatic or high volume reel-to-reel applications.

DuPont Microcircuit Materials, http://mcm.dupont.com

UV-P100 Direct Imager supports volume production of printed circuit boards. Track scheme for the UV LED head is optimized based on a vector-based algorithm. Includes auto-alignment and focus. Works with all types of PCB substrates and substrate thicknesses. Low thermal stress on photo-resist. Suitable for curing of solder resist. Intuitive scaling of layout data via PATH X software. Has fast load lock system with vacuum stage and alignment pins.

Limata, http://www.limata.de/en/UV_P100.html