RO-Linx PowerCircuit Busbars provide multifunction capability in a single, compact form factor. Distribute power and signal lines or can have components mounted on the busbar structures to save space and weight. Are 3D, for a range of power distribution applications in EV/HEVs, wind/solar power, and variable-frequency-drive (VFD) markets. Solder-process compatible.
Rogers Corp., rogerscorp.com
Simbeor signal integrity software, for physical design of PCB and packaging interconnects operating at 6-100 Gb/s and above, now features geometry import from ODB++ files to fit Simbeor into any design flow; Via Analyzer tool to synthesize geometry for transparent via-holes and connector launches; multi-variable optimization capability for geometry optimization and identification of dielectric and conductor roughness models; anisotropic dielectric model for accurate analysis of via-holes; Huray snowball and modified Hammerstad conductor roughness models for accurate analysis of PCB and packaging traces; and automatic computation, plotting and output of nine common serial interconnects compliance metrics.
Simberian, www.simberian.com
HyperLynx 8.2 suite of analysis tools offers new functionality for printed circuit board designs, including 3D full-wave field solving and integrated thermal/power co-simulation analysis capabilities.
InSolver PCB impedance field solver reportedly enables fast and accurate stackup and impedance modeling for a range of PCB structures. Solves standard single-ended and differential impedance constraints, as well as a wide range of broadside coupled, coplanar and embedded models to accurately simulate impedance for the most complex structures. Powered by Mentor Graphics' HyperLynx technology. Comes embedded in InPlan or InStack, or as a standalone application.
Frontline PCB Solutions, www.frontline-pcb.com
IntelliTool electroplating tooling concept is said to improve uniformity and deposition speed of copper electrodeposition on printed circuit boards.
Silver Ink is capable of forming electronic circuits. Requires no heating. Hardens under ultraviolet (UV) light for approximately 0.3 sec. Film thickness of five micrometers produces wiring with electrical resistivity of 10-3cm. Permits wiring on glass base material and substrates, flexible base material and polyester film (PET film).
Tanaka Kikinzoku Kogyo, www.tanaka.co.jp