KM128SNG-MB inkjet printhead has a small printhead structure (38 mm wide, 128 nozzles in one row) that can deliver a 1 pl size drop for printed electronics applications. Provides ink resistance and optimization for low viscosity. Offers stable, accurate operation with precision drive control on a per-nozzle basis. Uniform thin film print thickness (at the 100 nm level).
Konica Minolta IJ Technologies, www.konicaminolta.com
These modular work benches offer quality and versatility for work areas that include network labs, assembly areas, shipping stations, security and command consoles, or as computer repair benches. Can configure to suit specific needs. Frames are made from tube steel.
Custom Products & Services, www.custom-products.com
SMT Card-Edge Connector System is based on 0.64mm press-fit technology. Is a discrete pick-and-place SMT component that creates a solderless edge card interconnection for daughter board applications. Contacts can be placed on a daughter card using standard high-speed pick-and-place surface mount equipment. SMD solder interface uses pin-in-paste through-hole technology and recessed channels for solder distribution. Is designed for standard 1.6mm thick printed circuit boards, but is compatible with additional PCB thicknesses. Center min. PCB spacing is 3.2mm. Is packaged in a 16 x 4mm pitch EIA tape on a 13" diameter plastic reel for compatibility to standard high-speed surface mount pick-and-place equipment. Is suitable for high-conductivity material, able to carry up to 15A per contact.
Interplex Industries, www.interplex.com/card-edge
Multisim 12.0 Professional Edition has specialized editions for circuit design and electronics education.
High-capacitance embedded capacitance material reportedly improves power integrity and reduces electromagnetic interference in miniaturized devices. Is halogen-free. Helps provide hi-fidelity signals, high-signal-to-noise ratio in radio frequencies, and higher speed digital signals in high-performance applications such as small form factor printed circuit board hardware, high-performance RF boards, microphones, integrated circuit packaging, and consumer electronics. Offers a capacitance density range from 20 up to 40nF per sq. in.
3M, www.3M.com/ecm
Rainbow Process incorporates printed circuit board coating, imaging and developing in a single compact, automated unit.