TOKYO, JAPAN – Global semiconductor manufacturing equipment sales are projected to reach a record $156 billion in 2027, according to SEMI’s latest Year-End Total Semiconductor Equipment Forecast – OEM Perspective.

SEMI estimates global equipment sales will total $133 billion, up 13.7% year over year, followed by $145 billion in 2026 before setting a new industry high in 2027. The growth outlook reflects sustained capital investment tied to artificial intelligence, particularly in leading-edge logic, memory and advanced packaging technologies.

Wafer fab equipment remains the primary growth engine, with sales expected to rise to $115.7 billion as chipmakers expand capacity for advanced logic nodes and high-bandwidth memory. Continued investment in China, along with rising demand for DRAM and HBM to support AI computing, is contributing to the upward revision from SEMI’s midyear forecast.

Back-end equipment is also seeing a sharp rebound. Test equipment sales are projected to surge, while assembly and packaging equipment benefits from increasing device complexity and the adoption of heterogeneous and advanced packaging architectures.

Regionally, China, Taiwan and South Korea are expected to remain the top equipment spending markets through 2027, supported by a mix of domestic capacity expansion, leading-edge logic investments, and advanced memory development.

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