WASHINGTON – SEMI announced that global semiconductor equipment billings reached $33.07 billion in the second quarter, representing a 24% year-over-year increase and a 3% quarter-over-quarter gain. The strong results were driven by demand for advanced logic and high-bandwidth memory (HBM) DRAM applications, alongside increased shipments to Asia.

INDIA – The Andhra Pradesh government has cleared an ₹856-crore incentive package to support the development of India’s largest printed circuit board (PCB) facility, to be established by Syrma SGS in partnership with Korea’s Shinhyup Electronics.

PEACHTREE CITY, GA – SEPTEMBER 4, 2025 – The Printed Circuit Engineering Association (PCEA) today announced Jackson Schultz, head of engineering at Rainmaker Technology, will keynote PCB West this fall.

HUAI'AN PARK – Zhen Ding Technology said Avary Holding’s board approved a Huai’an Park expansion, committing roughly $1.1 billion (RMB 8 billion) through 2028 to boost high-end PCB capacity aimed at AI infrastructure.