Fab News

SHENZHEN, CHINA – Shennan Circuit announced 2023 revenue of CNY13.5 billion ($1.9 billion), a decrease of 3.3% from the previous year.

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ESPOO, FINLAND – Aspocomp announced annual sales of EUR32.3 million ($35.3 million), a decrease of 17% from the previous year's total.

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TAOYUAN, TAIWAN – Zhen Ding Technology announced full-year revenue of NT151.4 billion ($4.8 billion), down 12% from 2022.

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TAOYUAN, TAIWAN – Compeq Manufacturing reported a 12% year-over-year decrease in annual revenue, totaling NT67.1 billion ($2.1 billion).

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TOKYO – Toppan Holdings will build a semiconductor package substrate plant in Singapore, with plans to begin operations at the end of 2026.

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QINGYUAN, CHINA – Chinese PCB fabricator Jinlu Electronics has begun construction on a 2.3 billion yuan ($320 million) expansion project that will add an additional 3 million sq. m. of production capacity for multi-layer rigid boards and high-density interconnect boards.

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