AUSTIN, TX – TechSearch International’s newest Advanced Packaging Update finds that rapid growth in AI servers and data center hardware will push substrate demand beyond available capacity by 2028, forcing manufacturers to expand production within the next three years. The report highlights rising pressure on substrate materials – especially glass fiber used in core constructions – and evaluates potential alternatives as supply tightens.

AIKEN COUNTY, SC – AGY will invest $12.1 million to expand specialty glass fiber production at its Aiken County facility, adding 80 jobs and increasing US capacity for materials used in semiconductor packaging and high-performance printed circuit boards. Operations are expected to begin in early 2026.

BENGALURU, INDIA – Wipro Electronics plans to begin operations at its new PCB facility in Doddaballapura, Bengaluru North within the next nine months. The investment totals ₹500 crore ($60 million), according to CEO Neeraj Pandit, who announced the timeline at the 28th Bengaluru Tech Summit. Construction is expected to conclude in six months, followed by production ramp-up shortly after.

PETACH TIKVA, ISRAEL– Eltek reported third quarter revenue of $13.3 million, down 1% from the same quarter last year, while gross margin fell sharply to 12% from 26% in the third quarter of last year. Operating income dropped to essentially break-even at $50,000, compared with $1.9 million a year ago, and the company posted a net loss of $0.2 million.