Log in / Register
  • Thermal Vias are Ineffective. Here’s Why.

    Thermal Vias are Ineffective. Here’s Why.

    Adding thermal vias can take up valuable board space with little benefit.
      READ MORE...

  • Connecting the Industry, from Boards to Assemblies

    Connecting the Industry, from Boards to Assemblies

    HDP is embarking on new rounds of evaluations of laminates and lead-free solders.
      READ MORE...

  • Exploring the Impact of AI

    Exploring the Impact of AI

    A special panel discusses the growth of AI tools and its possible effects on the industry.
      READ MORE...

  • A Journey in Rigid-Flex Design

    A Journey in Rigid-Flex Design

    Overcoming the challenges of rigid-flex designs can be incredibly rewarding.
      READ MORE...

  • Creating the Ultra Library

    Creating the Ultra Library

    Building and maintaining what's said to be the world's largest CAD database requires strong relationships.
      READ MORE...

Homepage Slideshow

Nan Ya PCB Posts Q1 Net Loss of $9M

Published: 14 May 2019
 by Chelsey Drysdale

TAOYUAN CITY, TAIWAN – PCB and IC substrate maker Nan Ya Printed Circuit Board posted a net loss in the first quarter of $8.9 million, compared to a net loss of $22.2 million in the same period of 2018.

The improvement is attributed to the launch of substrates for new-generation network communication devices and production process optimization, according to reports.

If strong ABF-based FCBGA substrate shipments continue in the second quarter, the firm could expect to break even in the first half, returning to profitability for full-year 2019. The company plans to expand capacity by 5% to 10% this year.

Nan Ya also expects substrates for the SiP process to grow sequentially moving forward.

 

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article