TNC Series NTC thermistors expand Stackpole’s passive component portfolio into temperature sensing applications using thick-film construction for improved mechanical robustness compared with multilayer NTC designs. Thick-film technology reduces susceptibility to cracking and thickness variation across resistance values. Devices are available in 0402, 0603 and 0805 chip sizes with resistance values from 50Ω to 2MΩ and B values from 2410K to 4800K. Components support temperature sensing, monitoring and control applications up to 150°C, offering fast thermal response in compact footprints. Target markets include automotive systems, battery monitoring, and industrial and medical temperature sensing equipment. Pricing varies by size, resistance, B value and tolerance, with volume options available through distribution partners.

630900-1001-801 polyimide adhesive material is designed for high-temperature industrial environments including printed circuit board marking applications exposed to soldering and aggressive cleaning processes. Construction features a 50µm polyimide base film with a 20µm white silk-matt coating optimized for thermal transfer printing of 1D/2D codes, serial numbers and variable data. High-performance acrylate adhesive 801 supports bonding to PCBs, paired with a white standard glassine liner. Material withstands short-term temperatures up to 300°C and resists common soldering cycles and harsh cleaning agents. Available from 200m² with 1,000mm working width; 170mm narrow rolls at 400 running meters offered on request. Additional thicknesses and colors available upon request with immediate supply targeting electronics manufacturing, mechatronics and component marking sectors.

Questa One Agentic Toolkit introduces domain-scoped agentic AI workflows for integrated circuit design and verification, aiming to support faster register-transfer level (RTL) sign-off with configurable human oversight. Toolkit integrates with the Fuse EDA AI system while maintaining framework-agnostic compatibility to preserve existing EDA investments. Engine-native intelligence leverages model context protocols to enable autonomous goal decomposition, adaptive cross-run strategies and persistent verification knowledge development. Initial release includes RTL Code Agent, Lint Agent, CDC Agent, Verification Planning Agent and Debug Agent to support code generation, lint analysis, clock domain crossing verification, plan creation and root cause analysis. Platform integrates with Questa One Verification IQ, Questa One SFV, Questa One Sim, Tessent software and Veloce CS systems to support connected, data-driven verification workflows across simulation, formal and hardware-assisted validation. Built using NVIDIA Llama Nemotron and NVIDIA NIM models to address increasing complexity in 3D IC, chiplet and software-defined system architectures.

Multiline ECP-8000 and ATP-7800 post-etch punch (PEP) systems designed for precision optical registration and high-throughput PCB fabrication. ECP-8000 features 8-camera alignment with punch repeatability as tight as ±0.00015” (±3.81µm) and standard production specifications of ±0.0003” to ±0.0005” (±7.62–12.7µm). System performs in-line inspection to verify image squareness and coaxial alignment between panel sides. Supports Windows 11 operation with MES and SECS/GEM integration for Industry 4.0 environments. ATP-7800 delivers up to 9+ panels per minute with punch repeatability of ±0.0005” (±12.7µm). Designed for high-volume production and backward-compatible with legacy Optiline equipment for streamlined upgrades.