550/560 Series ultra-broadband multilayer ceramic capacitors engineered for high-speed optical communication systems operating from 7kHz to 110GHz. Series now includes 15 part numbers with new 0402 capacitance values of 1nF, 10nF, 22nF and 47nF, extending working voltage ratings up to 100V. Capacitance range spans 1–220nF with ±10–100% tolerance and operating temperature from -55°C to +125°C. Devices feature one-piece rugged construction in 01005, 0201 and 0402 case sizes with tin- or gold-plated nickel barrier terminations compatible with reflow soldering. Designed for ultra-low insertion loss, flat frequency response and strong return loss performance in RF, microwave and mmWave applications. Supplied RoHS compliant on tape and reel in quantities from 500 to 20,000.

B43655 and B43656 aluminum electrolytic capacitor series designed for DC link stages in electric vehicle on-board chargers supporting 800V battery architectures and forced cooling operation. B43655 offers 475V and 500V ratings with capacitance from 110µF to 880µF, ripple current up to 3.29A at +105°C, ESR down to 100mΩ and useful life exceeding 3,000hours at +105°C. B43656 rated at 450V supports ripple current up to 4.42A at +105°C for higher-power OBC topologies. Available in snap-in packages from 22mm to 35mm diameter and 25mm to 60mm length, with pressure relief device and select ±0.5mm length tolerance. Qualified to AEC-Q200 Rev.E and RoHS compliant. Integrated into TDK’s AlCap Useful Life Calculation Tool for lifetime estimation.

Vishay Intertechnology has released the CRCW0201-AT e3 Series AEC-Q200 qualified thick film chip resistors in an ultra-compact 0201 case size. Measuring 0.6mm × 0.3mm × 0.23mm, the devices are designed to reduce PCB space requirements by approximately 50% compared to 0402 components. Offers a power rating of 0.05W at +70°C, a maximum operating voltage of 30V and an operating temperature range of -55°C to +155°C. Resistance values range from 10Ω to 1MΩ, including a 0Ω jumper option, with tolerances of ±1% and ±5% and a temperature coefficient of ±200ppm/K.

Molex introduced Impress Co-Packaged Copper Solutions, a compression-based connector and cable assembly designed for near-ASIC connectivity in high-speed data center systems. The solution supports data rates up to 224Gbps PAM-4 and is intended for use in next-generation AI and hyperscale computing architectures. Impress places the connection interface directly on the ASIC package substrate, reducing signal path length through the PCB. The two-piece system consists of a compression-attached socket and mating cable assembly, engineered to manage signal integrity and power distribution in high-density environments. The compression attachment method is designed to minimize substrate stress and simplify maintenance or rework. The platform builds on the company’s NearStack On-the-Substrate (OTS) connectors, with more than one million units previously deployed. Impress is designed to provide electrical isolation from substrate to interconnect to reduce signal loss and crosstalk in high-speed channels.