TerraGreen 400G high-speed, low-loss laminate is halogen-free.
Novel resin system is lead-free compatible and can be processed using standard PCB equipment and processes. Comes in 2 to 18 mil (0.05 to 0.46mm) thickness. VLP-2 (2-micron) copper foil; copper weight of 0.3, 0.5 or 1oz. (12, 18 or 35 microns). Glass fabrics include e-glass, low-Dk, square weave or mechanically spread. CAF resistant. Tg is 215°C, Td is 410°C, Dk is 2.9. and Df is 0.0018. Designed for 5G and computing applications.