Riston DI3000 multi-wavelength, dry-film photoresist is for pattern plating on multilayer printed circuit boards.
Features high adhesion and chemical resistance delivers yield by eliminating lifting and breakdown defects in copper, tin or gold.
Riston DI5100 film for mSAP processes is made for smooth copper high adhesion on isolated resist lines. Riston DI9200 high density interconnect film for print and etch processes has high resolution and adhesion, and lamination conformation. Is said to have fast photospeed at multiple LDI wavelengths.