PI gold conductive film is based on sputtering system.
Components of gold sheet over foamed gasket, SMD gasket and gold conductive tape to be applied to smartphones and TVs for grounding contact. Polyimide film has thickness of 12.5µm/25µm+. Sputtered seed (Ni/Cu alloy) + copper layer + gold layer: total thickness is 15µm/28µm. Electrical resistivity is 0.01-0.03ohm/sq. in.