Geode laser-based micro-via drilling system is for high-density interconnects on rigid printed circuit boards.

Beam steering and pulse shaping technologies reportedly provide flexibility and control required for 5G applications using high-frequency-compatible materials and finer-pitched interconnects fabricated with modified semi-additive processes. Uses 9.4µm pulsed CO2 laser, emitting infrared radiation suited for rigid PCB materials. HyperSonix technology shapes laser pulses to improve throughput and via quality. AcceleDrill distributes pulse energy to improve throughput and via metrics and permits multiple via sizes in a single pass. Via density compensation controls local heating.

ESI Geode web

Electro Scientific Industries

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