tec-speed 20.0 high-frequency laminate and prepreg series is a ceramic-filled hydrocarbon thermoset material for such printed circuit board applications as cellular base station antennas, power amplifiers, LNB for broadcast satellites, automotive radar and RFID.

Preserves signal integrity up to high-GHz frequencies and has a 3.48 dielectric constant (Dk) and 0.0037 dissipation factor (Df). Tested according to IPC-TM-650. UL approved. High glass transition temperature (Tg), high peel strength, and low CTE ensure structural integrity and reliability. Comes as laminate or prepreg (VT-870PP), as standard with HTE copper foil or with HVLP (Hyper Very Low Profile) foil to attenuate passive intermodulation (PIM) effects.

Ventec

ventecsolutions.com/tec-speed-20/

Register now for PCB West, the largest trade show for the printed circuit and electronics industry in the Silicon Valley! Coming Sept. 11-13 to the Santa Clara Convention Center.

 

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article