Amalga enables fabrication of hollow, metal waveguide and coaxial structures inside and on top of electronic substrates.
Filters, diplexers, switches, attenuators, and other components can be integrated within these structures. Millimeter-wave modules and assemblies can be miniaturized through the use of low-loss, high-density interconnects and components, leading to high packaging density, excellent isolation, and low weight solutions. MMICs and active components can be directly integrated. Beam forming networks, directional antennas, nxm switching matrices and more micro-assemblies can be realized for communications, military/aerospace, and test and measurement industries.