WALDENBURG, GERMANY – Würth Elektronik Sweden AB has moved; significantly more space available. Würth Elektronik, manufacturer of electronic and electromechanical components for the electronics industry, is strengthening its activities in Scandinavia. The expansion in Sweden is the result of an extremely positive business development, and now enables the expansion of the sales office, back office, and customer services.
For Robert Vikman, the newly appointed General Manager of Würth Elektronik Sweden AB, this is the second move during his eight years with the company. Vikman has worked in the electronics industry since his time at ELFA (1995 to 2006).
"We are very happy that this branch is developing so successfully," Vikmann says happily. "Both ELFA and Würth Elektronik are family-owned, so there are a lot of similarities in the corporate culture. But, I particularly like Würth Elektronik and its concept. As an established manufacturer, we can offer free components for prototypes, all simulations, footprints, and 3D files directly on our website, and guarantee 98% availability on the more than 50,000 components in our range. Few manufacturers can do that."
"Now, we have space to grow even more," Vikmann continues, "and space is what we need, because we want to expand our technical field and office service. We currently have almost 30 employees in Sweden. Joining the team now are a digital sales manager, who exclusively handles online digital customer calls from our studio in the new office, and a technician for our online chat via the website. We are also expanding our range of wireless modules in the areas of Bluetooth, LTE, Wi-Fi, and sensors, which in turn increases customer demand for local support. I look forward to what lies ahead now."
Vikmann extends a big thank you to his predecessor CEO Martin Danielsson, who is moving on to new responsibilities outside the company after 18 years in the Würth family.
AUSTIN, TX – TechSearch International’s latest analysis explains the tough year ahead for semiconductor companies, OSATs, and foundries after the record highs from the Covid-induced spending spree. Market forecasts for Ball Grid Arrays (BGAs) and Chip Scaled Packages (CSPs) are provided in units. The CSP market is divided into laminate (FBGA and FLGA) and leadframe (QFN) substrates. Stacked die package trends are included. Unit growth projections for Cu clip and molded interconnect substrates (MIS) are provided. Package examples and demand drivers are included. TechSearch International analyzes the supply and demand for build-up substrates used for flip chip BGAs and the excess capacity expected resulting from declining demand and inventory. The report includes OSAT financials and examines economic trends impacting the industry with an analysis of CAPEX plans for the year.
Automotive electronics and especially electric vehicles (EVs) are a bright spot. Increased adoption for SiC and GaN in applications including EVs and charging stations, renewable energy, fast charging for mobile devices, and power suppliers are driving demand for legacy packages such as TOs and power modules for SiC and DFNs and QFNs for GaN. Embedded die packages are playing an increased role. With strong growth in China’s EV industry, the country is well positioned with the infrastructure to support the expansion.
The latest Advanced Packaging Update is a 100-page report with full references and an accompanying set of more than 90 PowerPoint slides.
MILPITAS, CA – FlexTech, a SEMI Technology Community focused on driving flexible hybrid electronics (FHE) innovations, today issued a Request for Proposals (RFP) for advances in innovative materials, FHE design tools, additive-enabled processing, hybrid electronics packaging, FHE manufacturing, AI/ML applications, soft robotics, and power solutions. Selected projects will receive cash awards ranging from $250,000 to $1 million. The program is funded by the Army Research Laboratory (ARL).
Organizations submitting proposals will be evaluated based on their capabilities, experience, and strengths including team diversity. See the SEMI FlexTech 2023 Request for Proposals for more details on the evaluation process.
White paper submissions, the first step in responding to the RFP, are due June 5, 2023. To help organizations prepare their proposals, FlexTech staff will review the RFP topics and the submission and review process during a live webinar on May 25, 2023, at 10:00 a.m. PDT. The webinar is open to organizations considering submitting a proposal. A recording will be available for registrants unable to attend the event. Registration for the event is open.
Following the review of white papers by the RFP Review Committee, consisting of FlexTech Council members and other subject matter experts (SMEs), FlexTech will invite selected organizations to submit full proposals. The evaluation criteria include:
Rationale
Budget
Collaboration value
Dual-use (industry and military) applicability
Relevance to the FHE ecosystem
Schedules and milestones
Reasonable and stretch deliverables
Overall proposal quality
FlexTech supports technical approaches that are revolutionary or have a significant element of risk, as well as approaches that are evolutionary improvements upon existing capability, which tend to be less risky and involve shorter development and delivery intervals. Research and development efforts funded by FlexTech are in the U.S. government’s Technology Readiness Level (TRL) and Manufacturing Readiness Level (MRL).
FlexTech encourages partnerships among industrial companies, R&D organizations, and university teams. ARL funding will be matched with contributions by grant recipients to cover the total project cost. Development partners retain ownership of intellectual property developed under FlexTech contracts.
PARAMOUNT, CA – Excellon has recently completed the installation of a COBRA-II Hybrid Laser System at Accurate Circuit Engineering, of Santa Ana, California.
James Hofer, General Manager at Accurate Circuit Engineering (ACE), comments:
“ACE provides cutting edge technology prototype PCBs and as such we need cutting edge technology. The Cobra-II brings a suite of laser drilling, milling and skiving advantages that no other unit we evaluated could compare with. Further, the support we get from Excellon is like no other. Though we evaluated multiple manufacturers of laser drilling systems it came as no surprise that Excellon performed better and allowed us the flexibility to do what we do best, high technology faster and better than the rest.”
Accurate Circuit Engineering (ACE) is a high technology, quick turn prototype PCB manufacturer specializing in RF, microwave, high-speed and antenna designs. In our Santa Ana based facility ACE can build a Multilayer PCB in as little as 24 hours. ACE is AS9100, ITAR Mil-PRF-31032 and D0D 2345 certified.
Mike Sparidaens, Vice President of Sales at Excellon, shared his comments:
“The COBRA-II Hybrid Laser System and can handle the most challenging rigid and flexible circuit board designs. The system is well known worldwide for its capability and reliability. We have enjoyed working with Accurate Circuit Engineering for many years and are very excited to have installed a laser system at their facility.”
Excellon, a U.S. based company, is recognized worldwide as a leader in installed PCB drilling systems with products ranging from single and multiple station mechanical drilling machines to hybrid laser precision via formation and routing systems. To meet increasing production volume, Excellon has opened a new manufacturing facility in Paramount, California, USA.
WASHINGTON DC – Effective May 1, 2023, Nathan Edwards will transition into the role of executive director of the U.S. Partnership for Assured Electronics (USPAE). Currently serving as director of government development, Edwards will replace Chris Peters who will continue with the organization as a senior advisor, providing continuity and focus on special projects.
As executive director of USPAE, Edwards will be responsible for establishing and growing the organization to help ensure the U.S. Government has access to trusted, secure, and resilient electronics supply chains. One of the organization’s signature programs is the $42 million Defense Electronics Consortium, which provides a contract vehicle for the Department of Defense (DoD) to work on electronics-related challenges with trusted partners in industry and academia, including small and medium-sized innovators that typically do not do business with DoD.
Edwards joined USPAE in August 2022 after being highly recommended by several members of the electronics manufacturing community. He has significant electronics expertise stemming from an impressive academic record and valuable experience in commercial and government environments. Much of that experience involves security of microelectronics and hardware systems, including five patents for the protection of embedded technologies. Edwards’s previous employers have ranged from Medtronic and Boeing to Sandia National Laboratories. He also has supported the Trusted and Assured Microelectronics program under the Office of the Secretary of Defense.
“Nathan’s electronics expertise and experience in both commercial and government segments make him ideally suited to continue the growth of USPAE,” said board member and retired Navy Rear Admiral Kevin Sweeney. “Chris has done a superb job as founding director and we’re grateful that he will help transition Nathan into this leadership role.”
Adds John W. Mitchell, IPC president and CEO and USPAE board member, “We’re fortunate to have both Nathan and Chris as part of the USPAE leadership team. “Nathan knows the U.S. Government customer well, including the Department of Defense, and has substantial technical expertise. His work at USPAE will help us bridge the gap between industry capabilities and the governments’ needs for electronics that support our national and economic security. Chris’s extensive experience in driving the innovation and adoption of solutions throughout manufacturing supply chains has helped connect the electronics industry and government.”
For more information on USPAE, visit www.USPAE.org or send inquiries to This email address is being protected from spambots. You need JavaScript enabled to view it.
Waltham, Mass., April 27, 2023 (GLOBE NEWSWIRE) -- Nano Dimension Ltd. (Nasdaq: NNDM, “Nano Dimension” or the “Company”), a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (“AM”) 3D printers, today announced several notable milestones relating to its growing micro additive manufacturing (“Micro-AM”) business, which includes the launching of its next-generation system, additional materials, and a new strategic customer - The Technology House (“TTH”). The systems, materials, and customer can be seen at RAPID + TCT, the largest North American additive manufacturing conference, that takes place in Chicago, Illinois, USA in May 2-4.
The suite of announcements comes out of Nano Dimension’s Fabrica Group, which focuses on high-precision additive manufacturing and complements the Company’s long-history in 3D printing electronics solutions.
Nano Dimension will have several products on display including its newest Micro-AM system in its Giga line, along with its Tera line. Both systems are capable of micron-level resolution that is valued by OEMs, micro-manufacturers, and research and development centers. The Digital Light Processing (DLP) technology that underpins these systems enables the critical advantages of additive manufacturing; namely rapid prototyping, high-mix-low-volume production, IP security, and a minimal environmental footprint. The Giga line is designed for prototyping, while the Tera line is used for higher volume production. In having different systems with different use cases, customers are sure to find the system that best suits their strategic needs.
The Company is also debuting three new materials with various capabilities that will open up more application sets. The materials include: a durable versatile acrylonitrile butadiene styrene (ABS) like material that enables strong structural integrity; an advanced material that is rigid and transparent and can be produced with a high level of accuracy; and a composite ceramic-loaded material with upgraded properties that offers high-wear resistance for demanding applications. As an indication of Nano Dimension’s growing momentum in Micro-AM, TTH, a leading digital manufacturer and recent customer of Nano Dimension, will also be present at the event. TTH is a leader in design-to-manufacturing with a range of fabrication capabilities for industrial-level customers. TTH has been a close partner of Nano Dimension in the development of its systems.
Dale S. Baker, President of Nano Dimension-Americas and Head of Worldwide Sales & Marketing, stated, “We are excited to share several points that highlight the successes we are making in customer traction and R&D. Firstly, we are thrilled that TTH has chosen Nano Dimension as a key provider in their advanced manufacturing capabilities. We are also looking forward to sharing our newest system and materials with the industry. So much of additive manufacturing comes down to materials, and what we will showcase will certainly open up new possibilities.” Rapid + TCT participants who visit Booth 2424 will also see the DragonFly® IV AME system, the leader in additively manufactured electronics (AME) to produce electronic components; the Admaflex 300, an innovator in DLP for ceramic and metal industrial parts; and the Atlas® Software Suite that controls market leading printing systems used worldwide in additive manufacturing applications.
About Nano Dimension
Nano Dimension’s (Nasdaq: NNDM) vision is to disrupt electronics and mechanical manufacturing with an environmentally friendly & economically efficient electronics and precision additive manufacturing Industry 4.0 solution - transforming digital designs into functioning electronic and mechanical devices - on demand, anytime, anywhere. Nano Dimension’s strategy is driven by the application of deep learning-based AI to drive improvements in manufacturing capabilities by using self-learning & self-improving systems, along with the management of a distributed manufacturing network via the cloud. Nano Dimension serves over 2,000 customers across vertical target markets such as aerospace & defense, advanced automotive, high-tech industrial, specialty medical technology, R&D, and academia. The company designs and makes Additive Electronics and Additive Manufacturing 3D printing machines and consumable materials. Additive Electronics are manufacturing machines that enable the design and development of High-Performance-Electronic-Devices (Hi-PED®s). Additive Manufacturing includes manufacturing solutions for production of metal, ceramic, and specialty polymers-based applications - from millimeters to several centimeters in size with micron precision. Through the integration of its portfolio of products, Nano Dimension is offering the advantages of rapid prototyping, high-mix-low-volume production, IP security, minimal environmental footprint, and design-for-manufacturing capabilities, which is all unleashed with the limitless possibilities of additive manufacturing. For more information, please visit www.nano-di.com.
