FREUDENSTADT, GERMANY – Robert Bürkle has divided its company into four independent divisions to better serve customers.
The German supplier provides laminating and coating technologies to the glass industry.
The company will have four independent business divisions to cover its respective product segments.
The new divisions will be managed by Marco Schaible (Printed Circuit Boards), Kai P. Treuner (Photovoltaics, Glass and Plastic Cards), Matthias Picker (Surface/Woodworking) and on an interim basis by Dr Arno Rogalla (Automation, Insulation, Doors, Parquet).
Jürgen Schröer, CEO of the Bürkle Group, said: "We are convinced that this model is more efficient and that the individual divisions will be able to react much faster and more targeted to individual customer requirements in the future.”
Mr Schröer has been supported by Martin Meister since the beginning of 2023, who, in addition to managing the commercial divisions, will also focus on the global development and digitalisation of the company.
Kai P. Treuner is responsible for the photovoltaics and technical glass division as well as for the plastic card division. Through his previous activities in other companies, Treuner brings many years of experience, especially in the field of glass and photovoltaic applications.
In the coming years, each division is to develop independently with different focal points in terms of the range of services, the product range and the global positioning to optimally serve the markets and the customers.
CAMBRIDGE, UK – Flexible hybrid electronics (FHE) promises to combine the benefits manufacturing of printed electronics capabilities of mounted components. Best expressed as 'print what you can, place what you can't', this rapidly emerging approach to electrical circuit manufacturing enables rapid prototyping and roll-to-roll manufacturing along with flexibility and even stretchability.
While FHE has many applications, we perceive wearable healthcare as the most promising in the short term, with longer term potential for industrial monitoring, automotive interiors, smart packaging, and integration into consumer goods. This broad addressable market has led to the recent emergence of contract manufactures offering or indeed specializing in FHE production, including via R2R manufacturing.
Dr Matthew Dyson, a Principal Technology Analyst at IDTechEx who covers printed/flexible electronics, will discuss the following topics:
An introduction to FHE, including motivating factors
Discussion of recent innovations and commercial developments within FHE
Identification of technological gaps and potential solutions
A roadmap for how the industry will develop, spanning both technologies and applications
This webinar is based on the new IDTechEx report, "Flexible Hybrid Electronics 2024-2034". This outlines innovations, opportunities, players, and trends across the technologies that underpin FHE, including flexible integrated circuits and low temperature component attachment. It also evaluates the opportunities for FHE across multiple application sectors, specifically automotive, consumer goods, energy, healthcare/wellness, and infrastructure/buildings/industrial. The report includes granular market forecasts, delineating the adoption of FHE across over 30 specific use cases.
Webinar Title: Flexible Hybrid Electronics: The Best of Both Worlds? Date: Thursday 17 August 2023 Duration: Approx. 30 Minutes
Webinar #1: Asia-Pacific 9:00am (UTC+8) Singapore, Taipei, Beijing 9:00am (UTC+8) Australian Western Standard Time 10:00am (UTC+9) Tokyo, Seoul 10:30am (UTC+9.30) Australian Central Time 11:00am (UTC+10) Australian Eastern Time 1:00pm (UTC+12) Auckland, New Zealand Click here to register for this session
Webinar #3: Americas 9:00am (Pacific Time PT) USA & Canada 10:00am (Mountain MST) USA & Canada 11:00am (Central CST) USA & Canada 12:00noon (Eastern EST) USA & Canada 5:00pm (UTC+1) London Click here to register for this session
WALTHAM, MA – Nano Dimension Ltd. (Nasdaq: NNDM, “Nano Dimension” or the “Company”), a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (“AM”) 3D printers, announced today that its board of directors has authorized a share repurchase plan (the “Repurchase Plan”), allowing the Company to invest up to $227.5 million to repurchase its American Depository Shares (the “ADS”).
The Repurchase Plan authorizes the Company’s management to repurchase ADSs, from time to time, in open market transactions, and/or in privately negotiated transactions or in any other legally permissible ways, depending on market conditions, share price, trading volume and other factors. Such repurchases will be made in accordance with applicable U.S. securities laws and regulations, under the U.S. Securities Exchange Act of 1934, as amended (the “Exchange Act”), and applicable Israeli law, and are subject to the approval of the Israeli court, which is meant to ensure that the Company has enough resources for the Repurchase Plan without affecting its other on-going obligations and commitments.
The Company may repurchase all or a portion of the authorized repurchase amount. The Repurchase Plan does not obligate the Company to repurchase any specific number of the ADSs and may be suspended or terminated at any time at management’s discretion.
LAKEWOOD, N.J. – August 3, 2023 – BidChip today announced its new platform that makes it possible for semiconductor customers to efficiently buy electronic parts they need from brokers without risk. The platform authenticates all components and vendor partners, guaranteeing safe purchases.
There are many places to buy electronic components, but one of the most reliable and convenient options is through an online electronic component sourcing marketplace like BidChip. Its comprehensive online marketplace provides a wide range of parts from trusted suppliers, ensuring high quality and fair prices. The process reduces price gouging by directly connecting buyers and suppliers.
BidChip leverages a large number of suppliers to secure a fair market value for semiconductor demand. It has discovered a way to enhance and streamline procurement safer, faster and economically. The platform uses a bidding process where buyers and suppliers compete daily to increase prices through an auction and reduce prices through a reverse auction, leveraging technology to streamline purchases. It empowers buyers and sellers to trade online without the fear of counterfeit merchandise, overdue payments or fraudulent transactions.
“I developed a successful system that addresses semiconductor commerce issues,” said CEO and founder Moshe Hezrony. “We streamlined the process while providing a set of protection services for the buyer and the seller, enhancing trust. Buyers and sellers will be equally protected. Risky transactions can go wrong and our goal is to keep the platform and process transparent for peace of mind.”
The auctions allow vendors to seek fair market value by leveraging a large group of buyers to submit bids for the best price. The bidding process allows fair buyer competition. Every day, buyers are given instant access to daily component offers.
The reverse auctions allow buyers who are seeking parts to purchase them at a fair market value and leverage a large group of suppliers that bid on the demand. The bidding process allows fair suppliers competition. Every day, suppliers are given instant access to daily component demands.
BidChip gives buyers an online shopping experience advantage for small and medium-size businesses. Now they can shop for semiconductors efficiently and risk-free with the assurance that all parts are authenticated and funds are guaranteed.
Electronic component sourcing websites are online platforms where buyers can locate and procure a wide variety of electronic parts and components. These platforms offer a convenient method of sourcing electronic components from multiple suppliers worldwide. BidChip is revolutionizing the industry by integrating the trading system of online auctions and reverse auctions, plus offering escrow services and lab testing that make it a unique system where manufactures can concentrate on assembling the next innovation while BidChip finds the parts for the next project. Sourcing electronic components has never been easier, faster, more efficient and more economical.
Other BidChip advantages include:
● Verified sellers and buyers to add security.
● Auction with transparent pricing and bidding for equal opportunity.
● Reverse auction (Quest) with transparent pricing and bidding for equal opportunity.
● Integrated escrow services for safe transactions.
● High standard of lab test AS 6081 to ensure part authenticity.
● A comprehensive dashboard to streamline the procurement process
Hezrony added, “Imagine your satisfaction, establishing instant trust with any buyer or supplier. You can trade lab-certified parts, get paid through escrow and ensure your business is always up and running.”
BidChip offers lab tests and escrow services for dedicated buyers and suppliers for safe trading and reducing price gouging. BidChip understands the challenges of not being able to trade freely. The company not only cares about parts but also the safety of your business.
For more information, to register now or schedule a discovery call, visit bidchip.com.
SANTA ANA, Calif., Aug. 02, 2023 (GLOBE NEWSWIRE) -- TTM Technologies, Inc. (NASDAQ: TTMI or The Company), a leading global manufacturer of technology solutions including mission systems, radio frequency (“RF”) components and RF microwave/microelectronic assemblies, and printed circuit boards (“PCB”), today announced that Todd B. Schull, the Company’s Chief Financial Officer, intends to retire at the end of 2023. Mr. Schull has also notified the Company of his intention to step down as the Company’s Executive Vice President & Chief Financial Officer, effective September 11, 2023. From September 11, 2023 to December 31, 2023, Mr. Schull intends to serve as a special advisor to the Company’s Chief Executive Officer, Thomas T. Edman.
In addition, the Company announced today that Daniel L. Boehle, age 51, has been appointed to succeed Mr. Schull as Executive Vice President and Chief Financial Officer of the Company, with a projected effective date of September 11, 2023. Mr. Boehle is expected to join the Company on August 21, 2023. From August 21, 2023 to September 11, 2023, Mr. Boehle is expected to serve as Executive Vice President of Finance for the Company.
Mr. Boehle has served as Vice President and Chief Financial Officer for Aerojet Rocketdyne Holdings, Inc. (“Aerojet”), a world-recognized technology-based engineering and manufacturing company that develops and produces specialized power and propulsion systems, as well as armament systems, since August 2020. From August 2017 to July 2020, Mr. Boehle was Vice President, Controller, and Chief Accounting Officer for Aerojet. Before joining Aerojet, Mr. Boehle served in various leadership roles across Corporate Accounting, Financial Reporting, and Financial Planning and Analysis at Northrop Grumman Corporation. Before joining Northrop Grumman Corporation, he held positions at KPMG LLP and KPMG Australia Ltd. Mr. Boehle has a B.S. in Accounting from Loyola Marymount University and a Master of Business Administration with an Emphasis in Finance and Entrepreneurship from the UCLA Anderson School of Management.
“Today we reflect on the past and embrace the future. I would like to thank Todd Schull for his 10 plus years of service to TTM and congratulate him on his sterling career. I speak for all of the TTM family as we wish him immense joy and fulfillment in his retirement. I am grateful for his leadership and friendship and will always cherish the invaluable contributions he made to TTM and his partnership with me. While we honor Todd for his career as he approaches retirement, we welcome Dan with excitement and open arms. I am confident that with Dan’s experience and expertise, he will help us to continue to forge a path of excellence as we execute on our core vision of inspiring innovation as a global preeminent technology solutions company,” said Tom Edman, TTM’s Chief Executive Officer.
About TTM
TTM Technologies, Inc. is a leading global manufacturer of technology solutions including mission systems, RF components/RF microwave/microelectronic assemblies, quick-turn and technologically advanced PCBs. TTM stands for time-to-market, representing how TTM's time-critical, one-stop manufacturing services enable customers to shorten the time required to develop new products and bring them to market. Additional information can be found at www.ttm.com .
BOSTON – Can electronics be additively manufactured and flexible without compromising on the capabilities of conventionally produced integrated circuits (ICs)? Often described as 'print what you can, place what you can't', flexible hybrid electronics (FHE) offers an enticing blend of capabilities, enabling rapid prototyping, flexibility/stretchability, and roll-to-roll manufacturing of circuits with conventional ICs. Furthermore, this manufacturing methodology is moving out of research labs and into commercial production, with new and existing contract manufacturers now offering FHE.
IDTechEx's report "Flexible Hybrid Electronics 2024-2034" evaluates the status and prospects of FHE circuits, which we forecast to reach a market size of around US$1.8 billion by 2034 - more if the associated infrastructure, software, and services are included. Drawing on years of following the printed electronics industry and 40 interview-based company profiles, the report outlines trends and innovations in the materials, components, and manufacturing methods required. It explores the application sectors where FHE is most likely to be adopted, drawing on both current activity and an evaluation of FHE's value proposition. Granular market forecasts break down the opportunities for FHE circuits across 5 application sectors (automotive, consumer goods, energy, healthcare/wellness, and infrastructure/buildings/industrial) into 39 specific opportunities, such as skin temperature sensors and printed RFID tags.
Enabling Technologies
Manufacturing FHE circuits requires many current and developing emerging technologies that are essential to circuits. These include:
Low-cost thermally stabilized PET substrates that are dimensionally stable.
Component attachment materials compatible with flexible thermally fragile substrates, such as low-temperature solder and field-aligned anisotropic conductive adhesives.
Flexible integrated circuits based on both thinned Si and metal oxides.
Conductive inks based on both silver and copper.
Thin film batteries, especially if printable.
Printed sensors of all types.
Manufacturing methods for mounting components on flexible substrates.
The IDTechEx report assesses the status and prospects of each technology in detail, with recent developments and technological gaps highlighted and the merits of different approaches compared. This analysis is based on interviews with many suppliers and annual attendance at multiple printed/flexible electronics conferences. Furthermore, we profile 6 government research centers and a range of collaborative projects from around the world that support the adoption of flexible hybrid electronics, demonstrating the major players and technological themes.
Assessing Application Opportunities
With so many potential addressable markets, establishing where FHE offers the most compelling value proposition relative to alternative electronics manufacturing approaches is essential. As a manufacturing methodology rather than a specific product, the benefits of using FHE are highly dependent on the application.
For prototyping and high mix low volume production, printing with digital methods such as inkjet rather than chemically etching the conductive traces enables straightforward adjustments to design parameters. This brings multiple benefits, including shortening the product development process by reducing the time between design iterations and facilitating product 'versioning' to meet specific customer requirements without substantially increasing production costs.
Alternatively, for very high-volume applications such as RFID tags, smart packaging, and even large-area lighting, the compatibility of FHE with high throughput roll-to-roll (R2R) manufacturing via rotary printing methods such as flexography and gravure offer the potential for reduced costs. Rapid production can be expedited by low-temperature and/or high-speed component attachment methods, with competing approaches analyzed in detail within the report.
Flexibility and stretchability, of course, also form part of FHE's value proposition. While conventionally manufactured flexible PCBs already meet some application requirements, such as for making electrical connections in confined spaces, the resilience of many printed conductive inks to repeated bending and tighter curvatures offers a clear differentiator. FHE is thus well suited for wearable applications such as electronic skin patches and applications where conformality is enabled by stretchability, such as integrated lighting.
Comprehensive Insight
IDTechEx has been researching developments in the printed and flexible electronics market for well over a decade. Since then, we have stayed close to technical and commercial developments, interviewing key players worldwide, annually attending conferences such as FLEX and LOPEC, delivering multiple consulting projects, and running classes/ workshops on the topic. "Flexible Hybrid Electronics 2024-2034" utilizes this experience and expertise to summarize IDTechEx's knowledge and insight across the compelling and rapidly emerging manufacturing methodology of FHE.
To find out more about this new IDTechEx report, including downloadable sample pages, please visit www.IDTechEx.com/FlexElec
