Orbotech Ltd. announced today that FTG (Firan Technology Group) Circuits has updated and expanded the PCB production capacity in their Toronto, Ontario facility with new DI (Direct Imaging) and AOI (Automated Optical Inspection) solutions from Orbotech.

Zero Defects International [ZDI] has been appointed by Taiyo Industrial Company, Japan, to manage the North American introduction of its automated printed circuit board final inspection systems.

Schaumburg, IL.  Bowman, a global manufacturer of XRF coating measurement instruments, held its 2017 International Sales Meeting in Chicago October 30 and 31, 2017.

Advances in the printed wire board industry toward miniaturization, finer traces and HDI technology, smaller through-holes and micro-vias have placed higher demands on board design, manufacturability and quality.  Historically, the industry utilized titanium anode baskets with soluble copper-phosphate balls or anode slabs. Limitations associated with this standard anode technology are seen in low current density plating requirements, over-plating of copper to meet minimum plated board specifications and nodule defects impurities in the plating bath. Today there is an exciting alternative, Industrie De Nora’s DT insoluble MMO (mixed metal oxide) anode technology package.