Bloomington, Il: Ms. Christine Davis, President and CEO of Camtek, Inc announced recently that her company has completed and achieved its’ ISO 9001:2015 certification, which includes risk management.

Read more: Camtek Inc. Earns ISO 9001:2015 Certification

Growth for high-density fan-out wafer level packages (FO-WLPs) continues unabated, with Apple’s continued use of TSMC’s InFO process in its smartphone application processors. Standard FO-WLP has experienced a few bumps on the road to higher volumes this year. Problems with Qualcomm’s steep ramp of FO-WLP for its PMICs and RF transceivers at the end of last year, and board-level reliability concerns from some customers, coupled with the option of lower-priced flip chip CSP substrates, prompted Qualcomm to lower its FO-WLP forecast this year and next. While Qualcomm’s forecast may be lower, others are stepping in to use recently installed capacity. FO-WLP has been adoption for some radar modules in vehicles equipped with advanced driver assist systems (ADAS) by companies including Infineon and NXP. Adoption of fan-out on substrate for high-performance applications is expanding.

Read more: TechSearch International Forecasts Growth for High-Density FO-WLP and Examines Panel Potential