AT&S offers high-performance PCB and packaging technologies for electric/hybrid drives and advanced driver assistance systems

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BERLIN, January 17, 2019: Atotech announced today that it will introduce its latest panel level plating processes and equipment solution for high resolution pattern plating during the NEPCON Japan show, held January 16 to 18, 2019, at Tokyo Big Sight.

Read more: Atotech to present its new series of panel level plating processes and equipment for high...

17 January 2019 – Ventec International Group Co., Ltd. (6672 TT), a world leader in the production of polyimide & high reliability epoxy laminates and prepregs and specialist provider of thermal management and IMS solutions, will be showcasing its latest high reliability PCB materials on booth #417 at APEX 2019 in San Diego from 29-31 January. A key focus at the show will be Ventec's extended ceramic-filled hydrocarbon thermoset material series tec-speed 20.0 which is designed for the world's most demanding high frequency Printed Circuit Board applications. The global Ventec team will be on hand to present the company's unique laminate & prepreg capability across a very wide range of applications and budgets.

Read more: Ventec at APEX 2019 – Delivering on Price, Performance and Availability for high frequency PCB...

Leading test solutions for bare boards

Wertheim, Germany January 2019: atg Luther & Maelzer GmbH to exhibit its innovative A8a Automatic Bare Board Flying Probe Test System at IPC APEX EXPO 2019, which is scheduled to take place on January 29 - 31, 2019, at the Convention Center in San Diego, CA.

Read more: atg Luther & Maelzer to exhibit at IPC APEX Show 2019